Structures specially adapted for transferring the charges across the imager perpendicular to the imaging plane

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CPC
H01L27/14638

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14638Structures specially adapted for transferring the charges across the imager perpendicular to the imaging plane

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
- Patent number 11,961,865
- Issue date Apr 16, 2024
- Sony Group Corporation
- Hideaki Togashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge release layer to remove charge carriers from dielectric grid...
- Patent number 11,948,962
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Chung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, method for manufacturing the same, and...
- Patent number 11,942,502
- Issue date Mar 26, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kyohei Mizuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors
- Patent number 11,935,906
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Jonghyun Go
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors
- Patent number 11,929,375
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jonghyun Go
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and imaging apparatus
- Patent number 11,929,376
- Issue date Mar 12, 2024
- Sony Group Corporation
- Tetsuji Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side illuminated image sensor with reduced sidewall-induced le...
- Patent number 11,901,396
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and imaging apparatus
- Patent number 11,869,907
- Issue date Jan 9, 2024
- Sony Group Corporation
- Tetsuji Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 11,848,337
- Issue date Dec 19, 2023
- DePuy Synthes Products, Inc.
- Laurent Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS image sensor having indented photodiode structure
- Patent number 11,843,007
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 11,843,020
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Changhwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device
- Patent number 11,843,012
- Issue date Dec 12, 2023
- Sharp Semiconductor Innovation Corporation
- Takanori Usuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with a high absorption layer
- Patent number 11,830,892
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing device including noise blocking structures
- Patent number 11,824,069
- Issue date Nov 21, 2023
- SK hynix Inc.
- Kyung Su Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and image capturing apparatus
- Patent number 11,825,196
- Issue date Nov 21, 2023
- Canon Kabushiki Kaisha
- Shunichi Wakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion element, photodetector, photodetection sys...
- Patent number 11,817,466
- Issue date Nov 14, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hideaki Togashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device with a pixel having a partially shielded...
- Patent number 11,798,962
- Issue date Oct 24, 2023
- Sony Corporation
- Hideo Kido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel-array substrate and associated method
- Patent number 11,784,206
- Issue date Oct 10, 2023
- OmniVision Technologies, Inc.
- Hui Zang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 11,776,983
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuichiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor module and method of manufacturing the same
- Patent number 11,722,800
- Issue date Aug 8, 2023
- Sony Group Corporation
- Shin Iwabuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and method of controlling image sensor
- Patent number 11,715,745
- Issue date Aug 1, 2023
- TIANMA JAPAN, LTD.
- Hiroyuki Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion apparatus having overlapped parts of charg...
- Patent number 11,710,755
- Issue date Jul 25, 2023
- Canon Kabushiki Kaisha
- Shinichiro Shimizu
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Pixel array area optimization using stacking scheme for hybrid imag...
- Patent number 11,682,682
- Issue date Jun 20, 2023
- DePuy Synthes Products, Inc.
- Laurent Blanquart
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Imaging device including signal line and unit pixel cell including...
- Patent number 11,653,116
- Issue date May 16, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihiro Sato
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor package
- Patent number 11,637,140
- Issue date Apr 25, 2023
- Samsung Electronics Co., Ltd.
- Ji-hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device
- Patent number 11,631,707
- Issue date Apr 18, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging element, laminated imaging element, and solid-state imaging...
- Patent number 11,621,290
- Issue date Apr 4, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Nobuhiro Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside illuminated photo-sensitive device with gradated buffer layer
- Patent number 11,611,005
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup device that is provided with peripheral circuits to pr...
- Patent number 11,606,526
- Issue date Mar 14, 2023
- Canon Kabushiki Kaisha
- Takafumi Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint recognition sensor and manufacturing method thereof, an...
- Patent number 11,605,239
- Issue date Mar 14, 2023
- BOE Technology Group Co., Ltd.
- Shipei Li
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
IMAGING ELEMENT AND IMAGING DEVICE
- Publication number 20240113148
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- Tetsushi Okazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE
- Publication number 20240113145
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- Hiroki TOJINBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION DEVICE AND ELECTRONIC APPARATUS
- Publication number 20240088191
- Publication date Mar 14, 2024
- Sony Semiconductor Solutions Corporation
- Kazuki NOMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR HAVING INDENTED PHOTODIODE STRUCTURE
- Publication number 20240063234
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING THE SAME, AND...
- Publication number 20240047499
- Publication date Feb 8, 2024
- Sony Semiconductor Solutions Corporation
- Kyohei MIZUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE PICKUP DEVICE, METHOD OF MANUFACTURING SOLID-STAT...
- Publication number 20240047490
- Publication date Feb 8, 2024
- SONY GROUP CORPORATION
- Ryosuke NAKAMURA
- G01 - MEASURING TESTING
Information Patent Application
PHOTOELECTRIC CONVERSION ELEMENT, PHOTODETECTOR, PHOTODETECTION SYS...
- Publication number 20240006426
- Publication date Jan 4, 2024
- Sony Semiconductor Solutions Corporation
- Hideaki TOGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH A HIGH ABSORPTION LAYER
- Publication number 20230387150
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20230369374
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuichiro YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT, LAMINATED IMAGING ELEMENT, AND SOLID-STATE IMAGING...
- Publication number 20230343807
- Publication date Oct 26, 2023
- Sony Semiconductor Solutions Corporation
- Nobuhiro KAWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS HAVING OVERLAPPED PARTS OF CHARG...
- Publication number 20230335570
- Publication date Oct 19, 2023
- Canon Kabushiki Kaisha
- Shinichiro Shimizu
- B60 - VEHICLES IN GENERAL
Information Patent Application
SOLID-STATE IMAGING ELEMENT AND SOLID-STATE IMAGING APPARATUS
- Publication number 20230326941
- Publication date Oct 12, 2023
- Sony Semiconductor Solutions Corporation
- HIROAKI MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE
- Publication number 20230299113
- Publication date Sep 21, 2023
- Sony Semiconductor Solutions Corporation
- SATOKO IIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS
- Publication number 20230282658
- Publication date Sep 7, 2023
- SONY GROUP CORPORATION
- Tetsuji Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE INCLUDING SIGNAL LINE AND UNIT PIXEL CELL INCLUDING...
- Publication number 20230247320
- Publication date Aug 3, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- YOSHIHIRO SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE
- Publication number 20230238417
- Publication date Jul 27, 2023
- Samsung Electronics Co., Ltd.
- Ji-hwang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT AND IMAGING DEVICE
- Publication number 20230215880
- Publication date Jul 6, 2023
- SONY GROUP CORPORATION
- Masahiro JOEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL TRANSFER STRUCTURES
- Publication number 20230215900
- Publication date Jul 6, 2023
- OMNIVISION TECHNOLOGIES, INC.
- Qin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical Pump-Gate Charge Transfer for High-Conversion-Gain CMOS Im...
- Publication number 20230197757
- Publication date Jun 22, 2023
- Gigajot Technology, Inc.
- Jiaju Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT RECEIVING ELEMENT AND ELECTRONIC EQUIPMENT
- Publication number 20230178576
- Publication date Jun 8, 2023
- Sony Semiconductor Solutions Corporation
- Hidenori MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS
- Publication number 20230154951
- Publication date May 18, 2023
- SONY GROUP CORPORATION
- Tetsuji Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE PICKUP DEVICE THAT IS PROVIDED WITH PERIPHERAL CIRCUITS TO PR...
- Publication number 20230156364
- Publication date May 18, 2023
- Canon Kabushiki Kaisha
- Takafumi Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20230127821
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Eunsub Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH A CONTROL CIRCUIT
- Publication number 20230071932
- Publication date Mar 9, 2023
- STMicroelectronics (Grenoble 2) SAS
- Laurent SIMONY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS HAVING CAPACITANCE ADDITION TRAN...
- Publication number 20230069364
- Publication date Mar 2, 2023
- Canon Kabushiki Kaisha
- Shuhei Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT AND DISTANCE MEASUREMENT MODULE
- Publication number 20230038698
- Publication date Feb 9, 2023
- Sony Semiconductor Solutions Corporation
- Hideki ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF MANUFACTURING SAME
- Publication number 20230017757
- Publication date Jan 19, 2023
- Samsung Electronics Co., Ltd.
- SANGSU PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR SUB-COLUMN PARALLEL DIGITIZERS FOR HYBRID STA...
- Publication number 20220409033
- Publication date Dec 29, 2022
- DePuy Synthes Products, Inc.
- Laurent Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING APPARATUS, MANUFACTURING METHOD THEREOF, AND ELECTRONIC EQU...
- Publication number 20220399391
- Publication date Dec 15, 2022
- Sony Semiconductor Solutions Corporation
- NAO YOSHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE IMAGE SENSOR AND ELECTRONIC DEVICE
- Publication number 20220384501
- Publication date Dec 1, 2022
- SONY GROUP CORPORATION
- SHINYA YAMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS

Structures specially adapted for transferring the charges across the imager perpendicular to the imaging plane

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device, method of manufacturing a semiconductor devic...

Charge release layer to remove charge carriers from dielectric grid...

Solid-state imaging device, method for manufacturing the same, and...

Image sensors

Image sensors

Solid-state imaging device and imaging apparatus

Back side illuminated image sensor with reduced sidewall-induced le...

Solid-state imaging device and imaging apparatus

Image sensor

CMOS image sensor having indented photodiode structure

Image sensor

Solid-state imaging device

Image sensor with a high absorption layer

Image sensing device including noise blocking structures

Image sensor and image capturing apparatus

Photoelectric conversion element, photodetector, photodetection sys...

Solid-state imaging device with a pixel having a partially shielded...

Pixel-array substrate and associated method

Image sensor

Semiconductor image sensor module and method of manufacturing the same

Image sensor and method of controlling image sensor

Photoelectric conversion apparatus having overlapped parts of charg...

Pixel array area optimization using stacking scheme for hybrid imag...

Imaging device including signal line and unit pixel cell including...

Image sensor package

Imaging device

Imaging element, laminated imaging element, and solid-state imaging...

Backside illuminated photo-sensitive device with gradated buffer layer

Image pickup device that is provided with peripheral circuits to pr...

Fingerprint recognition sensor and manufacturing method thereof, an...

Patents Applicationslast 30 patents

IMAGING ELEMENT AND IMAGING DEVICE

SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE

PHOTOELECTRIC CONVERSION DEVICE AND ELECTRONIC APPARATUS

CMOS IMAGE SENSOR HAVING INDENTED PHOTODIODE STRUCTURE

SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING THE SAME, AND...

SOLID-STATE IMAGE PICKUP DEVICE, METHOD OF MANUFACTURING SOLID-STAT...

PHOTOELECTRIC CONVERSION ELEMENT, PHOTODETECTOR, PHOTODETECTION SYS...

IMAGE SENSOR WITH A HIGH ABSORPTION LAYER

IMAGE SENSOR

IMAGING ELEMENT, LAMINATED IMAGING ELEMENT, AND SOLID-STATE IMAGING...

PHOTOELECTRIC CONVERSION APPARATUS HAVING OVERLAPPED PARTS OF CHARG...

SOLID-STATE IMAGING ELEMENT AND SOLID-STATE IMAGING APPARATUS

SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE

SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS

IMAGING DEVICE INCLUDING SIGNAL LINE AND UNIT PIXEL CELL INCLUDING...

IMAGE SENSOR PACKAGE

IMAGING ELEMENT AND IMAGING DEVICE

VERTICAL TRANSFER STRUCTURES

Vertical Pump-Gate Charge Transfer for High-Conversion-Gain CMOS Im...

LIGHT RECEIVING ELEMENT AND ELECTRONIC EQUIPMENT

SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS

IMAGE PICKUP DEVICE THAT IS PROVIDED WITH PERIPHERAL CIRCUITS TO PR...

IMAGE SENSOR

IMAGE SENSOR WITH A CONTROL CIRCUIT

PHOTOELECTRIC CONVERSION APPARATUS HAVING CAPACITANCE ADDITION TRAN...

IMAGING ELEMENT AND DISTANCE MEASUREMENT MODULE

IMAGE SENSOR AND METHOD OF MANUFACTURING SAME

SYSTEM AND METHOD FOR SUB-COLUMN PARALLEL DIGITIZERS FOR HYBRID STA...

IMAGING APPARATUS, MANUFACTURING METHOD THEREOF, AND ELECTRONIC EQU...

SOLID STATE IMAGE SENSOR AND ELECTRONIC DEVICE