substantially perpendicularly to each other

Industry

CPC
H05K3/366

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/366substantially perpendicularly to each other

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of mounting and electrically contacting a first printed circ...
- Patent number 12,150,253
- Issue date Nov 19, 2024
- ABB AG
- Stefan Gutermuth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power conversion device
- Patent number 12,133,369
- Issue date Oct 29, 2024
- Mitsubishi Electric Corporation
- Yuta Yoshimi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly
- Patent number 12,133,331
- Issue date Oct 29, 2024
- WAGO Verwaltungsgesellschaft mbH
- Gerald Schauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate, electronic circuit, antenna apparatus, electronic appara...
- Patent number 11,924,967
- Issue date Mar 5, 2024
- Kabushiki Kaisha Toshiba
- Makoto Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vehicle luminaire and vehicle lamp
- Patent number 11,619,361
- Issue date Apr 4, 2023
- Toshiba Lighting & Technology Corporation
- Hiroaki Kanagawa
- F21 - LIGHTING
Information Patent Grant
Assemblies including heat dispersing elements and related systems a...
- Patent number 11,617,284
- Issue date Mar 28, 2023
- Micron Technology, Inc.
- Xiaopeng Qu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 11,605,609
- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED assembly with omnidirectional light field
- Patent number 11,543,081
- Issue date Jan 3, 2023
- Epistar Corporation
- Hong-Zhi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB assembly and manufacturing method thereof
- Patent number 11,503,721
- Issue date Nov 15, 2022
- LG ENERGY SOLUTION, LTD.
- Seung-Min Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nose cone comprising electronic circuit boards arranged radially
- Patent number 11,493,313
- Issue date Nov 8, 2022
- BAE Systems plc
- Gary Roy Moore
- F42 - AMMUNITION BLASTING
Information Patent Grant
Printed circuit board
- Patent number 11,445,609
- Issue date Sep 13, 2022
- Mitsubishi Electric Corporation
- Yoshiko Fujima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,266,018
- Issue date Mar 1, 2022
- Mitsubishi Electric Corporation
- Shunsuke Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supplies including shielded multilayer power transmission boards
- Patent number 11,129,275
- Issue date Sep 21, 2021
- Astec International Limited
- Prabou Ranganathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 11,122,687
- Issue date Sep 14, 2021
- Mitsubishi Electric Corporation
- Kohei Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with edge soldering for high-density packages...
- Patent number 11,096,290
- Issue date Aug 17, 2021
- International Business Machines Corporation
- Thomas Brunschwiler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Peripheral end face attachment of exposed copper layers of a first...
- Patent number 11,026,326
- Issue date Jun 1, 2021
- International Business Machines Corporation
- Todd E. Takken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a wireless connector transmitter module
- Patent number 11,011,915
- Issue date May 18, 2021
- NuCurrent, Inc.
- Vinit Singh
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for generating packing solution of printed circuit board
- Patent number 10,977,411
- Issue date Apr 13, 2021
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Yu-Sheng Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connection for printed circuit board assemblies
- Patent number 10,971,880
- Issue date Apr 6, 2021
- Neptune Technology Group Inc.
- Wilson Philip Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna base for fixing an antenna body on a casing, antenna struct...
- Patent number 10,957,974
- Issue date Mar 23, 2021
- Wistron Corporation
- Chung-Ta Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory module connector, memory module, and pivotable latch
- Patent number 10,950,958
- Issue date Mar 16, 2021
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies including heat dispersing elements and related systems a...
- Patent number 10,952,352
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Xiaopeng Qu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Wireless connector system
- Patent number 10,938,220
- Issue date Mar 2, 2021
- NuCurrent, Inc.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless connector transmitter module with an electrical connector
- Patent number 10,931,118
- Issue date Feb 23, 2021
- NuCurrent, Inc.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply for output of various specifications
- Patent number 10,931,206
- Issue date Feb 23, 2021
- Fuji Electric Co., Ltd.
- Ryuji Yamada
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of making a wireless connector receiver module
- Patent number 10,916,950
- Issue date Feb 9, 2021
- NuCurrent, Inc.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless connector system circuit
- Patent number 10,903,660
- Issue date Jan 26, 2021
- NuCurrent, Inc.
- Vinit Singh
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of operating a wireless connector system
- Patent number 10,897,140
- Issue date Jan 19, 2021
- NuCurrent, Inc.
- Vinit Singh
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Printed circuit board composite and method for producing same
- Patent number 10,893,615
- Issue date Jan 12, 2021
- CPT Zwei GmbH
- Juergen Rietsch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless connector transmitter module
- Patent number 10,886,751
- Issue date Jan 5, 2021
- NuCurrent, Inc.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TARGET MATERIAL SEPARATION CONTROL DEVICE USING LASER DIODE
- Publication number 20240365470
- Publication date Oct 31, 2024
- CTCELLS, INC.
- Seung Hoon KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE AND POWER SUPPLY DEVICE COMPRISING SAME
- Publication number 20240130037
- Publication date Apr 18, 2024
- LG INNOTEK CO LTD
- Sung June PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERLOCKED CIRCUIT BOARD ELEMENTS AND ASSEMBLIES
- Publication number 20240107669
- Publication date Mar 28, 2024
- Infineon Technologies Austria AG
- Darryl Galipeau
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES
- Publication number 20240107674
- Publication date Mar 28, 2024
- Infineon Technologies Austria AG
- Eung San Cho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CIRCUIT BOARD ASSEMBLY
- Publication number 20230232534
- Publication date Jul 20, 2023
- WAGO VERWALTUNGSGESELLSCHAFT MBH
- Gerald SCHAUER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD CORNER CONNECTION
- Publication number 20230061365
- Publication date Mar 2, 2023
- INTERPLEX NAS ELECTRONICS GMBH
- Hans-Jörg HAHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Mounting and Electrically Contacting a First Printed Circ...
- Publication number 20220287188
- Publication date Sep 8, 2022
- ABB AG
- Stefan Gutermuth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE, ELECTRONIC CIRCUIT, ANTENNA APPARATUS, ELECTRONIC APPARA...
- Publication number 20220272835
- Publication date Aug 25, 2022
- Kabushiki Kaisha Toshiba
- Makoto SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Card Edge Connector System
- Publication number 20220263259
- Publication date Aug 18, 2022
- Carlisle Interconnect Technologies, Inc.
- Shawn Murphy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wireless Connector System
- Publication number 20210367451
- Publication date Nov 25, 2021
- NUCURRENT, INC.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION SYSTEM COMPRISING A PRIMARY CONNECTION DEVICE...
- Publication number 20210281018
- Publication date Sep 9, 2021
- SAGEMCOM BROADBAND SAS
- Nassim SAHEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20210267060
- Publication date Aug 26, 2021
- Mitsubishi Electric Corporation
- Yoshiko FUJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLIES INCLUDING HEAT DISPERSING ELEMENTS AND RELATED SYSTEMS A...
- Publication number 20210204446
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Xiaopeng Qu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20210195744
- Publication date Jun 24, 2021
- Mitsubishi Electric Corporation
- Kohei SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20210176868
- Publication date Jun 10, 2021
- LG CHEM, LTD.
- Seung-Min YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLIES INCLUDING SHIELDED MULTILAYER POWER TRANSMISSION BOARDS
- Publication number 20210007221
- Publication date Jan 7, 2021
- Astec International Limited
- Prabou RANGANATHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200236786
- Publication date Jul 23, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Shunsuke SASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
- Publication number 20200185349
- Publication date Jun 11, 2020
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS AND METHOD FOR PRODUCING ELECTRONIC APPARATUS
- Publication number 20200077532
- Publication date Mar 5, 2020
- KABUSHIKI KAISHA YASKAWA DENKI
- Takashi FUJIKI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Printed Circuit Board Composite And Method For Producing Same
- Publication number 20200077525
- Publication date Mar 5, 2020
- CPT ZWEI GMBH
- JUERGEN RIETSCH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PERIPHERAL END FACE ATTACHMENT OF EXPOSED COPPER LAYERS OF A FIRST...
- Publication number 20190357354
- Publication date Nov 21, 2019
- International Business Machines Corporation
- Todd E. Takken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20190342997
- Publication date Nov 7, 2019
- Japan Display Inc.
- Shuichi OSAWA
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE MODULE
- Publication number 20190311994
- Publication date Oct 10, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Suk Youn HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CONNECTOR
- Publication number 20190313530
- Publication date Oct 10, 2019
- Northrop Grumman Systems Corporation
- JEFFREY DAVID HARTMAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20190281702
- Publication date Sep 12, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANGLE MOUNT MM-WAVE SEMICONDUCTOR PACKAGE
- Publication number 20190200451
- Publication date Jun 27, 2019
- Intel Corporation
- SASHA OSTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEABLE ON-PACKAGE MEMORY DEVICES
- Publication number 20190182955
- Publication date Jun 13, 2019
- Intel Corporation
- Gregorio R. Murtagian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE FOR LED LIGHTING
- Publication number 20190145584
- Publication date May 16, 2019
- Merlot Laboratories Inc.
- Young-Hun KO
- F21 - LIGHTING
Information Patent Application
BOARD-TO-BOARD CONNECTORS AND MOUNTING STRUCTURE
- Publication number 20190020130
- Publication date Jan 17, 2019
- Rosemount Aerospace Inc.
- Tim DeAngelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board Solder Joints
- Publication number 20190006777
- Publication date Jan 3, 2019
- Lutron Electronics Co., Inc.
- Matthew Knauss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

substantially perpendicularly to each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of mounting and electrically contacting a first printed circ...

Power conversion device

Circuit board assembly

Substrate, electronic circuit, antenna apparatus, electronic appara...

Vehicle luminaire and vehicle lamp

Assemblies including heat dispersing elements and related systems a...

Ultra-thin embedded semiconductor device package and method of manu...

LED assembly with omnidirectional light field

PCB assembly and manufacturing method thereof

Nose cone comprising electronic circuit boards arranged radially

Printed circuit board

Printed wiring board and method for manufacturing the same

Power supplies including shielded multilayer power transmission boards

Printed wiring board

Printed circuit board with edge soldering for high-density packages...

Peripheral end face attachment of exposed copper layers of a first...

Method of making a wireless connector transmitter module

Method for generating packing solution of printed circuit board

Connection for printed circuit board assemblies

Antenna base for fixing an antenna body on a casing, antenna struct...

Memory module connector, memory module, and pivotable latch

Assemblies including heat dispersing elements and related systems a...

Wireless connector system

Wireless connector transmitter module with an electrical connector

Power supply for output of various specifications

Method of making a wireless connector receiver module

Wireless connector system circuit

Method of operating a wireless connector system

Printed circuit board composite and method for producing same

Wireless connector transmitter module

Patents Applicationslast 30 patents

TARGET MATERIAL SEPARATION CONTROL DEVICE USING LASER DIODE

ELECTRONIC COMPONENT MODULE AND POWER SUPPLY DEVICE COMPRISING SAME

INTERLOCKED CIRCUIT BOARD ELEMENTS AND ASSEMBLIES

CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES

CIRCUIT BOARD ASSEMBLY

PRINTED CIRCUIT BOARD CORNER CONNECTION

Method of Mounting and Electrically Contacting a First Printed Circ...

SUBSTRATE, ELECTRONIC CIRCUIT, ANTENNA APPARATUS, ELECTRONIC APPARA...

Card Edge Connector System

Wireless Connector System

ELECTRICAL CONNECTION SYSTEM COMPRISING A PRIMARY CONNECTION DEVICE...

PRINTED CIRCUIT BOARD

ASSEMBLIES INCLUDING HEAT DISPERSING ELEMENTS AND RELATED SYSTEMS A...

PRINTED WIRING BOARD

PCB ASSEMBLY AND MANUFACTURING METHOD THEREOF

POWER SUPPLIES INCLUDING SHIELDED MULTILAYER POWER TRANSMISSION BOARDS

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

ELECTRONIC APPARATUS AND METHOD FOR PRODUCING ELECTRONIC APPARATUS

Printed Circuit Board Composite And Method For Producing Same

PERIPHERAL END FACE ATTACHMENT OF EXPOSED COPPER LAYERS OF A FIRST...

ELECTRONIC DEVICE

ELECTRONIC DEVICE MODULE

FLEXIBLE CONNECTOR

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

ANGLE MOUNT MM-WAVE SEMICONDUCTOR PACKAGE

REPLACEABLE ON-PACKAGE MEMORY DEVICES

SUBSTRATE STRUCTURE FOR LED LIGHTING

BOARD-TO-BOARD CONNECTORS AND MOUNTING STRUCTURE

Printed Circuit Board Solder Joints