Substrate or mask aligning feature

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CPC
Y10S438/975

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S438/00Semiconductor device manufacturing: process

Current Industry

Y10S438/975Substrate or mask aligning feature

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and methods for detecting overlay errors using scatterometry
- Patent number 10,451,412
- Issue date Oct 22, 2019
- KLA-Tencor Corporation
- Michael Adel
- G01 - MEASURING TESTING
Information Patent Grant
Solid-state imaging device and method of manufacturing solid-state...
- Patent number 10,249,665
- Issue date Apr 2, 2019
- Sony Corporation
- Yuichi Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Lithography alignment marks
- Patent number 9,823,574
- Issue date Nov 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Huang Chen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Apparatus for measuring overlay errors
- Patent number 9,702,693
- Issue date Jul 11, 2017
- KLA-Tencor Corporation
- Mark Ghinovker
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor device having a high-K gate dielectric above an STI r...
- Patent number 9,659,928
- Issue date May 23, 2017
- Advanced Micro Devices, Inc.
- Andy Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned contact formation
- Patent number 9,368,446
- Issue date Jun 14, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Neng-Kuo Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor apparatus and substrate
- Patent number 9,190,363
- Issue date Nov 17, 2015
- Renesas Electronics Corporation
- Masahiro Ishida
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus and methods for determining overlay of structures having...
- Patent number 9,182,680
- Issue date Nov 10, 2015
- KLA-Tencor Corporation
- Mark Ghinovker
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
WH (wafer-holder) process
- Patent number 9,105,675
- Issue date Aug 11, 2015
- Nikon Corporation
- Kazuya Okamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing semiconductor substrate
- Patent number 9,034,721
- Issue date May 19, 2015
- Sumco Corporation
- Syouji Nogami
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Systems and methods for plasma etching compound semiconductor (CS)...
- Patent number 9,034,734
- Issue date May 19, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Chee Siong Peh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for self-aligned removal of a high-K gate dielectric above a...
- Patent number 9,023,712
- Issue date May 5, 2015
- Advanced Micro Devices, Inc.
- Andy Wei
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Heterogeneous chip integration with low loss interconnection throug...
- Patent number 8,963,313
- Issue date Feb 24, 2015
- Raytheon Company
- Sankerlingam Rajendran
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing semiconductor substrate
- Patent number 8,956,947
- Issue date Feb 17, 2015
- Sumco Corporation
- Syouji Nogami
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Self aligned contact formation
- Patent number 8,921,136
- Issue date Dec 30, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Neng-Kuo Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Solid-state image pickup device and a method of manufacturing the same
- Patent number 8,896,137
- Issue date Nov 25, 2014
- Sony Corporation
- Keiichi Nakazawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing a radiation imaging panel comprising imagi...
- Patent number 8,850,697
- Issue date Oct 7, 2014
- Oy Ajat LTD
- Konstantinos Spartiotis
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor apparatus and substrate
- Patent number 8,841,784
- Issue date Sep 23, 2014
- Renesas Electronics Corporation
- Masahiro Ishida
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing semiconductor substrate
- Patent number 8,835,276
- Issue date Sep 16, 2014
- Sumco Corporation
- Syouji Nogami
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
System and method for improved automated semiconductor wafer manufa...
- Patent number 8,825,191
- Issue date Sep 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yao Hsieh
- G05 - CONTROLLING REGULATING
Information Patent Grant
Multiple-points measurement
- Patent number 8,735,180
- Issue date May 27, 2014
- Nikon Corporation
- Kazuya Okamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method to align mask patterns
- Patent number 8,674,512
- Issue date Mar 18, 2014
- Micron Technology, Inc.
- Gurtej S. Sandhu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Exposure apparatus, exposure method, and device manufacturing method
- Patent number 8,605,249
- Issue date Dec 10, 2013
- Nikon Corporation
- Hideya Inoue
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor substrates comprising through substrate interconnects...
- Patent number 8,531,046
- Issue date Sep 10, 2013
- Micron Technology, Inc.
- Dave Pratt
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing method for exposure mask, generating method for mask...
- Patent number 8,465,907
- Issue date Jun 18, 2013
- Kabushiki Kaisha Toshiba
- Masamitsu Itoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
System and method for improved automated semiconductor wafer manufa...
- Patent number 8,463,419
- Issue date Jun 11, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yao Hsieh
- G05 - CONTROLLING REGULATING
Information Patent Grant
Stacking apparatus and method for stacking integrated circuit elements
- Patent number 8,440,472
- Issue date May 14, 2013
- Nikon Corporation
- Kazuya Okamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Solid-state imaging device and method of manufacturing solid-state...
- Patent number 8,420,434
- Issue date Apr 16, 2013
- Sony Corporation
- Yuichi Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Alignment marks for polarized light lithography and method for use...
- Patent number 8,377,800
- Issue date Feb 19, 2013
- Infineon Technologies AG
- Sajan Marokkey
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method to align mask patterns
- Patent number 8,338,085
- Issue date Dec 25, 2012
- Micron Technology, Inc.
- Gurtej S. Sandhu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHODS FOR DETECTING OVERLAY ERRORS USING SCATTEROMETRY
- Publication number 20170336198
- Publication date Nov 23, 2017
- KLA-Tencor Corporation
- Michael Adel
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR APPARATUS AND SUBSTRATE
- Publication number 20140367836
- Publication date Dec 18, 2014
- Masahiro ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE
- Publication number 20140342526
- Publication date Nov 20, 2014
- Syouji Nogami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE
- Publication number 20140342525
- Publication date Nov 20, 2014
- Syouji Nogami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE
- Publication number 20140342535
- Publication date Nov 20, 2014
- Syouji Nogami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DICING A COMPOUND SEMICONDUCTOR WAFER, AND DICED WAFERS...
- Publication number 20140217556
- Publication date Aug 7, 2014
- Avago Technologies General IP (Singapore) PTE. LTD.
- Chee Siong Peh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self Aligned Contact Formation
- Publication number 20140197499
- Publication date Jul 17, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Neng-Kuo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WH (WAFER-HOLDER) PROCESS
- Publication number 20130251494
- Publication date Sep 26, 2013
- Nikon Corporation
- Kazuya OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Improved Automated Semiconductor Wafer Manufa...
- Publication number 20130253681
- Publication date Sep 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yao Hsieh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTIPLE-POINTS MEASUREMENT
- Publication number 20130226334
- Publication date Aug 29, 2013
- Nikon Corporation
- Kazuya OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ALIGN MASK PATTERNS
- Publication number 20130105976
- Publication date May 2, 2013
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND SUBSTRATE
- Publication number 20130037968
- Publication date Feb 14, 2013
- Renesas Electronics Corporation
- Masahiro ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE PICKUP DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20120313211
- Publication date Dec 13, 2012
- SONY CORPORATION
- Keiichi NAKAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR EXPOSURE MASK, GENERATING METHOD FOR MASK...
- Publication number 20120264067
- Publication date Oct 18, 2012
- Kabushiki Kaisha Toshiba
- Masamitsu Itoh
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Alignment Marks for Polarized Light Lithography and Method for Use...
- Publication number 20120208341
- Publication date Aug 16, 2012
- INFINEON TECHNOLOGIES AG
- Sajan Marokkey
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
APPARATUS AND METHODS FOR DETERMINING OVERLAY OF STRUCTURES HAVING...
- Publication number 20120153281
- Publication date Jun 21, 2012
- KLA-Tencor Technologies Corporation
- Mark Ghinovker
- G01 - MEASURING TESTING
Information Patent Application
STACKING APPARATUS AND METHOD FOR STACKING INTEGRATED CIRCUIT ELEMENTS
- Publication number 20120118477
- Publication date May 17, 2012
- NIKON CORPORATION
- Kazuya Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A RADIATION IMAGING PANEL COMPRISING IMAGI...
- Publication number 20120090171
- Publication date Apr 19, 2012
- OY AJAT, LTD.
- Konstantinos SPARTIOTIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MEASUREMENT AND CONTROL OF PHOTOMASK TO SU...
- Publication number 20110269077
- Publication date Nov 3, 2011
- International Business Machines Corporation
- Axel Aguado Granados
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MANUFACTURING METHOD FOR EXPOSURE MASK, GENERATING METHOD FOR MASK...
- Publication number 20110262848
- Publication date Oct 27, 2011
- Kabushiki Kaisha Toshiba
- Masamitsu Itoh
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20110229824
- Publication date Sep 22, 2011
- Yoshihiko OKAMOTO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Methods of Determining X-Y Spatial Orientation of a Semiconductor S...
- Publication number 20110204526
- Publication date Aug 25, 2011
- Micron Technology, Inc.
- Dave Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid-state imaging device and method of manufacturing solid-state...
- Publication number 20110165723
- Publication date Jul 7, 2011
- SONY CORPORATION
- Yuichi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE
- Publication number 20110151641
- Publication date Jun 23, 2011
- Elpida Memory, Inc.
- Yohei OTA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20110084382
- Publication date Apr 14, 2011
- Wei-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE
- Publication number 20110076830
- Publication date Mar 31, 2011
- SUMCO CORPORATION
- Syouji NOGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MEASUREMENT AND CONTROL OF PHOTOMASK TO SU...
- Publication number 20110013187
- Publication date Jan 20, 2011
- International Business Machines Corporation
- Axel Aguado Granados
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD AND APPARATUS FOR MEASUREMENT AND CONTROL OF PHOTOMASK TO SU...
- Publication number 20110008719
- Publication date Jan 13, 2011
- International Business Machines Corporation
- Axel Aguado Granados
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Electronic device, method for manufacturing the same, and silicon s...
- Publication number 20100320507
- Publication date Dec 23, 2010
- Shinji UYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid-state imaging device and method of manufacturing solid-state...
- Publication number 20100301439
- Publication date Dec 2, 2010
- SONY CORPORATION
- Yuichi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS

Substrate or mask aligning feature

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus and methods for detecting overlay errors using scatterometry

Solid-state imaging device and method of manufacturing solid-state...

Lithography alignment marks

Apparatus for measuring overlay errors

Semiconductor device having a high-K gate dielectric above an STI r...

Self aligned contact formation

Semiconductor apparatus and substrate

Apparatus and methods for determining overlay of structures having...

WH (wafer-holder) process

Method for manufacturing semiconductor substrate

Systems and methods for plasma etching compound semiconductor (CS)...

Method for self-aligned removal of a high-K gate dielectric above a...

Heterogeneous chip integration with low loss interconnection throug...

Method for manufacturing semiconductor substrate

Self aligned contact formation

Solid-state image pickup device and a method of manufacturing the same

Method for manufacturing a radiation imaging panel comprising imagi...

Semiconductor apparatus and substrate

Method for manufacturing semiconductor substrate

System and method for improved automated semiconductor wafer manufa...

Multiple-points measurement

Method to align mask patterns

Exposure apparatus, exposure method, and device manufacturing method

Semiconductor substrates comprising through substrate interconnects...

Manufacturing method for exposure mask, generating method for mask...

System and method for improved automated semiconductor wafer manufa...

Stacking apparatus and method for stacking integrated circuit elements

Solid-state imaging device and method of manufacturing solid-state...

Alignment marks for polarized light lithography and method for use...

Method to align mask patterns

Patents Applicationslast 30 patents

APPARATUS AND METHODS FOR DETECTING OVERLAY ERRORS USING SCATTEROMETRY

SEMICONDUCTOR APPARATUS AND SUBSTRATE

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

METHODS FOR DICING A COMPOUND SEMICONDUCTOR WAFER, AND DICED WAFERS...

Self Aligned Contact Formation

WH (WAFER-HOLDER) PROCESS

System and Method for Improved Automated Semiconductor Wafer Manufa...

MULTIPLE-POINTS MEASUREMENT

METHOD TO ALIGN MASK PATTERNS

SEMICONDUCTOR APPARATUS AND SUBSTRATE

SOLID-STATE IMAGE PICKUP DEVICE AND A METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD FOR EXPOSURE MASK, GENERATING METHOD FOR MASK...

Alignment Marks for Polarized Light Lithography and Method for Use...

APPARATUS AND METHODS FOR DETERMINING OVERLAY OF STRUCTURES HAVING...

STACKING APPARATUS AND METHOD FOR STACKING INTEGRATED CIRCUIT ELEMENTS

METHOD FOR MANUFACTURING A RADIATION IMAGING PANEL COMPRISING IMAGI...

METHOD AND APPARATUS FOR MEASUREMENT AND CONTROL OF PHOTOMASK TO SU...

MANUFACTURING METHOD FOR EXPOSURE MASK, GENERATING METHOD FOR MASK...

METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Methods of Determining X-Y Spatial Orientation of a Semiconductor S...

Solid-state imaging device and method of manufacturing solid-state...

METHOD OF FORMING A SEMICONDUCTOR DEVICE

CHIP PACKAGE AND FABRICATION METHOD THEREOF

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

METHOD AND APPARATUS FOR MEASUREMENT AND CONTROL OF PHOTOMASK TO SU...

METHOD AND APPARATUS FOR MEASUREMENT AND CONTROL OF PHOTOMASK TO SU...

Electronic device, method for manufacturing the same, and silicon s...

Solid-state imaging device and method of manufacturing solid-state...