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H01L2224/75743

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75743Suction holding means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 11,651,983
- Issue date May 16, 2023
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,626,295
- Issue date Apr 11, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 11,521,950
- Issue date Dec 6, 2022
- Kioxia Corporation
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PTFE sheet and method for mounting die
- Patent number 11,512,411
- Issue date Nov 29, 2022
- Shinkawa Ltd.
- Osamu Watanabe
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Grant
Alignment mechanism, chuck device, and bonder
- Patent number 11,462,428
- Issue date Oct 4, 2022
- Tazmo Co., Ltd.
- Masaaki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and related techniques for handling aligned substrate pairs
- Patent number 11,183,401
- Issue date Nov 23, 2021
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,018,028
- Issue date May 25, 2021
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method of semiconductor chip and bonding apparatus of semic...
- Patent number 11,018,112
- Issue date May 25, 2021
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method of semiconductor chip and bonding apparatus of semic...
- Patent number 10,847,497
- Issue date Nov 24, 2020
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system
- Patent number 10,840,213
- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 10,825,705
- Issue date Nov 3, 2020
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with embedded bridge interconnects
- Patent number 10,468,352
- Issue date Nov 5, 2019
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with embedded bridge interconnects
- Patent number 10,446,500
- Issue date Oct 15, 2019
- Intel Corporation
- Kyu-Oh Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding systems
- Patent number 10,340,248
- Issue date Jul 2, 2019
- Tokyo Electron Limited
- Masataka Matsunaga
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor packages with embedded bridge interconnects
- Patent number 10,157,847
- Issue date Dec 18, 2018
- Intel Corporation
- Kyu-Oh Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method of semiconductor chip and bonding apparatus of semic...
- Patent number 9,728,519
- Issue date Aug 8, 2017
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,633,978
- Issue date Apr 25, 2017
- Shinko Electric Industries Co., Ltd.
- Shota Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,397,072
- Issue date Jul 19, 2016
- Renesas Electronics Corporation
- Nobuyasu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip package covered with tape
- Patent number 9,385,014
- Issue date Jul 5, 2016
- Cypress Semiconductor Corporation
- Naomi Masuda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,177,936
- Issue date Nov 3, 2015
- Renesas Electronics Corporation
- Nobuyasu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D assembly for interposer bow
- Patent number 9,059,241
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,796,074
- Issue date Aug 5, 2014
- Renesas Electronics Corporation
- Nobuyasu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method including deformation of supporting board to a...
- Patent number 8,748,229
- Issue date Jun 10, 2014
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packaging apparatus and electronic packaging method
- Patent number 8,720,519
- Issue date May 13, 2014
- Shinko Electric Industries Co., Ltd.
- Takatoyo Yamakami
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,710,651
- Issue date Apr 29, 2014
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board for flip-chip mounting, mounting structure of electron...
- Patent number 8,659,168
- Issue date Feb 25, 2014
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,580,620
- Issue date Nov 12, 2013
- Renesas Electronics Corporation
- Kazuyuki Nakagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer wafer bonding method and apparatus
- Patent number 8,557,631
- Issue date Oct 15, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die collet
- Patent number 8,465,619
- Issue date Jun 18, 2013
- Texas Instruments Incorporated
- Dan Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode bonding method and part mounting apparatus
- Patent number 8,449,712
- Issue date May 28, 2013
- Panasonic Corporation
- Yoshimasa Inamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20230054378
- Publication date Feb 23, 2023
- KIOXIA Corporation
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS
- Publication number 20210013079
- Publication date Jan 14, 2021
- SUSS MICROTEC LITHOGRAPHY GMBH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PTFE SHEET AND METHOD FOR MOUNTING DIE
- Publication number 20200291548
- Publication date Sep 17, 2020
- SHINKAWA LTD.
- Osamu WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD OF SEMICONDUCTOR CHIP AND BONDING APPARATUS OF SEMIC...
- Publication number 20200051953
- Publication date Feb 13, 2020
- Kabushiki Kaisha Toshiba
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM
- Publication number 20180019226
- Publication date Jan 18, 2018
- TOKYO ELECTRON LIMITED
- Masataka MATSUNAGA
- B32 - LAYERED PRODUCTS
Information Patent Application
Bonding System
- Publication number 20180019225
- Publication date Jan 18, 2018
- TOKYO ELECTRON LIMITED
- Masataka MATSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD OF SEMICONDUCTOR CHIP AND BONDING APPARATUS OF SEMIC...
- Publication number 20170309594
- Publication date Oct 26, 2017
- Kabushiki Kaisha Toshiba
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD OF SEMICONDUCTOR CHIP AND BONDING APPARATUS OF SEMIC...
- Publication number 20160126218
- Publication date May 5, 2016
- Kabushiki Kaisha Toshiba
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE
- Publication number 20150171048
- Publication date Jun 18, 2015
- SHIBUYA KOGYO CO., LTD.
- Hiroyuki YASUYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D ASSEMBLY FOR INTERPOSER BOW
- Publication number 20140209666
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140127860
- Publication date May 8, 2014
- RENESAS ELECTRONICS CORPORATION
- Nobuyasu MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Collet and Method
- Publication number 20130264836
- Publication date Oct 10, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Dan OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer Wafer Bonding Method and Apparatus
- Publication number 20130140713
- Publication date Jun 6, 2013
- Taiwan Semiconductro Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTRUING SEMICONDUCTOR DEVICE
- Publication number 20130005086
- Publication date Jan 3, 2013
- Renesas Electronics Corporation
- Nobuyasu MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20120322202
- Publication date Dec 20, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING APPARATUS AND ELECTRONIC PACKAGING METHOD
- Publication number 20120043005
- Publication date Feb 23, 2012
- Shinko Electric Industries Co., Ltd.
- Takatoyo YAMAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110171777
- Publication date Jul 14, 2011
- Renesas Electronics Corporation
- Nobuyasu MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110084384
- Publication date Apr 14, 2011
- RENESAS ELECTRONICS CORPORATION
- Kenji SAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP PACKAGE COVERED WITH TAPE
- Publication number 20110074029
- Publication date Mar 31, 2011
- Naomi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110039375
- Publication date Feb 17, 2011
- Renesas Electronics Corporation
- Kazuyuki Nakagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Die Collet and Method
- Publication number 20100289159
- Publication date Nov 18, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Dan OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100148368
- Publication date Jun 17, 2010
- Fujitsu Limited
- Motoyuki NISHIZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PART MOUNTING APPARATUS AND METHOD
- Publication number 20100132187
- Publication date Jun 3, 2010
- Fujitsu Limited
- Toru Nishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT SUPPLY HEAD DEVICE AND COMPONENT MOUNTING HEAD DEVICE
- Publication number 20100064510
- Publication date Mar 18, 2010
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20090309239
- Publication date Dec 17, 2009
- Fujitsu Microelectronics Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD
- Publication number 20090288767
- Publication date Nov 26, 2009
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Mounting Head, and Apparatus and Method for Mo...
- Publication number 20090265924
- Publication date Oct 29, 2009
- Hiroshi Ebihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting apparatus, inspecting apparatus, inspecting method, and mo...
- Publication number 20090251701
- Publication date Oct 8, 2009
- SONY CORPORATION
- Yoshihiro Ibayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP MOUNTING METHOD, FLIP CHIP MOUNTING APPARATUS AND FLIP CH...
- Publication number 20090203170
- Publication date Aug 13, 2009
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20090186451
- Publication date Jul 23, 2009
- Fujitsu Microelectronics Limited
- Kazuo TESHIROGI
- H01 - BASIC ELECTRIC ELEMENTS

Suction holding means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus, system, and method for handling aligned wafer pairs

Method of applying conductive adhesive and manufacturing device usi...

Semiconductor manufacturing apparatus and method of manufacturing s...

PTFE sheet and method for mounting die

Alignment mechanism, chuck device, and bonder

System and related techniques for handling aligned substrate pairs

Method of applying conductive adhesive and manufacturing device usi...

Bonding method of semiconductor chip and bonding apparatus of semic...

Bonding method of semiconductor chip and bonding apparatus of semic...

Bonding system

Apparatus, system, and method for handling aligned wafer pairs

Semiconductor packages with embedded bridge interconnects

Semiconductor packages with embedded bridge interconnects

Bonding systems

Semiconductor packages with embedded bridge interconnects

Bonding method of semiconductor chip and bonding apparatus of semic...

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device

Flip-chip package covered with tape

Method of manufacturing semiconductor device

3D assembly for interposer bow

Method of manufacturing semiconductor device

Manufacturing method including deformation of supporting board to a...

Electronic packaging apparatus and electronic packaging method

Semiconductor device and method for manufacturing the same

Wiring board for flip-chip mounting, mounting structure of electron...

Method of manufacturing semiconductor device

Interposer wafer bonding method and apparatus

Semiconductor die collet

Electrode bonding method and part mounting apparatus

Patents Applicationslast 30 patents

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS

PTFE SHEET AND METHOD FOR MOUNTING DIE

BONDING METHOD OF SEMICONDUCTOR CHIP AND BONDING APPARATUS OF SEMIC...

BONDING SYSTEM

Bonding System

BONDING METHOD OF SEMICONDUCTOR CHIP AND BONDING APPARATUS OF SEMIC...

BONDING METHOD OF SEMICONDUCTOR CHIP AND BONDING APPARATUS OF SEMIC...

BONDING DEVICE

3D ASSEMBLY FOR INTERPOSER BOW

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Die Collet and Method

Interposer Wafer Bonding Method and Apparatus

METHOD OF MANUFACTRUING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

ELECTRONIC PACKAGING APPARATUS AND ELECTRONIC PACKAGING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

FLIP-CHIP PACKAGE COVERED WITH TAPE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Die Collet and Method

SEMICONDUCTOR DEVICE

PART MOUNTING APPARATUS AND METHOD

COMPONENT SUPPLY HEAD DEVICE AND COMPONENT MOUNTING HEAD DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

ELECTRONIC COMPONENT MOUNTING METHOD

Electronic Component Mounting Head, and Apparatus and Method for Mo...

Mounting apparatus, inspecting apparatus, inspecting method, and mo...

FLIP CHIP MOUNTING METHOD, FLIP CHIP MOUNTING APPARATUS AND FLIP CH...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE