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H01L2224/78743

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78743Suction holding means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for fabricating integrated circuit device usin...
- Patent number 8,722,460
- Issue date May 13, 2014
- Mitsumasa Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for making a semiconductor device including bondi...
- Patent number 8,439,249
- Issue date May 14, 2013
- Infineon Technologies AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 8,368,191
- Issue date Feb 5, 2013
- Renesas Electronics Corporation
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for fabricating integrated circuit device usin...
- Patent number 8,283,208
- Issue date Oct 9, 2012
- Mitsumasa Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package assembly method and apparatus for counte...
- Patent number 8,008,131
- Issue date Aug 30, 2011
- Texas Instruments Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including plural sem...
- Patent number 7,998,795
- Issue date Aug 16, 2011
- Renesas Electronics Corporation
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 7,847,376
- Issue date Dec 7, 2010
- Renesas Electronics Corporation
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant wirebond pedestal
- Patent number 7,847,378
- Issue date Dec 7, 2010
- Texas Instruments Incorporated
- Jeffrey W. Marsh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device including plural sem...
- Patent number 7,772,044
- Issue date Aug 10, 2010
- Renesas Technology Corp.
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device manufacturing method and supporter
- Patent number 7,637,004
- Issue date Dec 29, 2009
- Seiko Epson Corporation
- Shingo Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant wirebond pedestal
- Patent number 7,575,147
- Issue date Aug 18, 2009
- Texas Instruments Incorporated
- Jeffrey W. Marsh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip semiconductor device package
- Patent number 7,466,024
- Issue date Dec 16, 2008
- Renesas Technology Corp.
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 7,416,970
- Issue date Aug 26, 2008
- Renesas Technology Corp.
- Tomishi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 7,226,815
- Issue date Jun 5, 2007
- Renesas Technology Corp.
- Tomishi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant wirebond pedestal
- Patent number 7,214,607
- Issue date May 8, 2007
- Texas Instruments Incorporated
- Jeffrey W. Marsh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant wirebond pedestal
- Patent number 6,877,650
- Issue date Apr 12, 2005
- Texas Instruments Incorporated
- Jeffrey W. Marsh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus for connecting semiconductor devices
- Patent number 6,516,994
- Issue date Feb 11, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Yoshiharu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus and wire bonding method of semiconductor device
- Patent number 6,454,158
- Issue date Sep 24, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Yoshiharu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded packaging for semiconductor device and method of manufacturi...
- Patent number 6,258,632
- Issue date Jul 10, 2001
- Kabushiki Kaisha Toshiba
- Naoto Takebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for packaging high temperature solid state ele...
- Patent number 6,169,330
- Issue date Jan 2, 2001
- Astrulux, Inc.
- Jacques Isaac Pankove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding methods and apparatus for heat sensitive metallization...
- Patent number 6,031,216
- Issue date Feb 29, 2000
- National Semiconductor Corporation
- Inderjit Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for packaging high temperature solid state ele...
- Patent number 5,930,666
- Issue date Jul 27, 1999
- Astralux, Incorporated
- Jacques Isaac Pankove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded packaging for semiconductor device and method of manufacturi...
- Patent number 5,869,905
- Issue date Feb 9, 1999
- Kabushiki Kaisha Toshiba
- Naoto Takebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making semiconductor device having no die supporting sur...
- Patent number 5,474,958
- Issue date Dec 12, 1995
- Motorola, Inc.
- Frank Djennas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for flip-chip bonding a semiconductor chip using wire leads
- Patent number 5,438,020
- Issue date Aug 1, 1995
- Thomson-CSF
- Alain Grancher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for bonding of lead wires for an integrated circuit device
- Patent number 4,790,897
- Issue date Dec 13, 1988
- LSI Logic Corporation
- Jon Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligning small scale integrated circuit semiconductor chips to...
- Patent number 4,542,397
- Issue date Sep 17, 1985
- Xerox Corporation
- David K. Biegelsen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR FABRICATING INTEGRATED CIRCUIT DEVICE USIN...
- Publication number 20130045569
- Publication date Feb 21, 2013
- Mitsumasa Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR FABRICATING INTEGRATED CIRCUIT DEVICE USIN...
- Publication number 20110249113
- Publication date Oct 13, 2011
- Mitsumasa Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20110068450
- Publication date Mar 24, 2011
- Renesas Electronics Corporation
- NORIYUKI TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING PLURAL SEM...
- Publication number 20100255639
- Publication date Oct 7, 2010
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR MAKING A SEMICONDUCTOR DEVICE INCLUDING BONDI...
- Publication number 20100078463
- Publication date Apr 1, 2010
- INFINEON TECHNOLOGIES AG
- Roland SPECKELS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compliant Wirebond Pedestal
- Publication number 20090309211
- Publication date Dec 17, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey W. Marsh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting device for a chip component
- Publication number 20090254213
- Publication date Oct 8, 2009
- TDK Corporation
- Takaaki Domon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package Assembly Method and Apparatus for Counte...
- Publication number 20090243057
- Publication date Oct 1, 2009
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING PLURAL SEM...
- Publication number 20090061563
- Publication date Mar 5, 2009
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20090020860
- Publication date Jan 22, 2009
- RENESAS TECHNOLOGY CORP.
- Noriyuki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR FABRICATING INTEGRATED CIRCUIT DEVICE USIN...
- Publication number 20090023243
- Publication date Jan 22, 2009
- Mitsumasa Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE MANUFACTURING METHOD AND SUPPORTER
- Publication number 20080277149
- Publication date Nov 13, 2008
- SEIKO EPSON CORPORATION
- Shingo KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fixing curved circuit board and wire bonding apparatus
- Publication number 20070287222
- Publication date Dec 13, 2007
- KABUSHIKI KAISHA SHINKAWA
- Ryuichi Natsume
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20070212821
- Publication date Sep 13, 2007
- Tomishi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compliant Wirebond Pedestal
- Publication number 20070205249
- Publication date Sep 6, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey W. Marsh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20070035017
- Publication date Feb 15, 2007
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050230793
- Publication date Oct 20, 2005
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor device
- Publication number 20050176178
- Publication date Aug 11, 2005
- Tomishi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compliant wirebond pedestal
- Publication number 20050170556
- Publication date Aug 4, 2005
- Jeffrey W. Marsh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compliant wirebond pedestal
- Publication number 20020048925
- Publication date Apr 25, 2002
- Jeffrey W. Marsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding apparatus for connecting semiconductor devices
- Publication number 20010054640
- Publication date Dec 27, 2001
- Yoshiharu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Suction holding means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and apparatus for fabricating integrated circuit device usin...

Device and method for making a semiconductor device including bondi...

Semiconductor device and manufacturing method of the same

Method and apparatus for fabricating integrated circuit device usin...

Semiconductor chip package assembly method and apparatus for counte...

Method of manufacturing a semiconductor device including plural sem...

Semiconductor device and manufacturing method of the same

Compliant wirebond pedestal

Method of manufacturing a semiconductor device including plural sem...

Electronic device manufacturing method and supporter

Compliant wirebond pedestal

Multi-chip semiconductor device package

Method for manufacturing semiconductor device

Method for manufacturing semiconductor device

Compliant wirebond pedestal

Compliant wirebond pedestal

Wire bonding apparatus for connecting semiconductor devices

Wire bonding apparatus and wire bonding method of semiconductor device

Molded packaging for semiconductor device and method of manufacturi...

Method and apparatus for packaging high temperature solid state ele...

Wire bonding methods and apparatus for heat sensitive metallization...

Method and apparatus for packaging high temperature solid state ele...

Molded packaging for semiconductor device and method of manufacturi...

Method for making semiconductor device having no die supporting sur...

Process for flip-chip bonding a semiconductor chip using wire leads

Device for bonding of lead wires for an integrated circuit device

Self aligning small scale integrated circuit semiconductor chips to...

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR FABRICATING INTEGRATED CIRCUIT DEVICE USIN...

METHOD AND APPARATUS FOR FABRICATING INTEGRATED CIRCUIT DEVICE USIN...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING PLURAL SEM...

DEVICE AND METHOD FOR MAKING A SEMICONDUCTOR DEVICE INCLUDING BONDI...

Compliant Wirebond Pedestal

Mounting device for a chip component

Semiconductor Chip Package Assembly Method and Apparatus for Counte...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING PLURAL SEM...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

METHOD AND APPARATUS FOR FABRICATING INTEGRATED CIRCUIT DEVICE USIN...

ELECTRONIC DEVICE MANUFACTURING METHOD AND SUPPORTER

Method of fixing curved circuit board and wire bonding apparatus

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Compliant Wirebond Pedestal

Semiconductor device

Semiconductor device

Method for manufacturing semiconductor device

Compliant wirebond pedestal

Compliant wirebond pedestal

Wire bonding apparatus for connecting semiconductor devices