Suction

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CPC
H05K2203/082

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/082Suction

Industries

Patents Grantslast 30 patents

Information Patent Grant
Vacuum-assisted BGA joint formation
- Patent number 11,963,307
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Matthew Doyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting machine
- Patent number 11,432,444
- Issue date Aug 30, 2022
- FUJI CORPORATION
- Shigeto Oyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filling assembly
- Patent number 11,172,578
- Issue date Nov 9, 2021
- ITC Intercircuit Electronic GmbH
- Hubertus Hein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus and method for manufacturing display apparatus
- Patent number 11,096,292
- Issue date Aug 17, 2021
- SAKAI DISPLAY PRODUCTS CORPORATION
- Katsuhiko Kishimoto
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Optoelectronic assembly, and method for producing an optoelectronic...
- Patent number 10,834,809
- Issue date Nov 10, 2020
- Ledvance GmbH
- Georg Rosenbauer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic device
- Patent number 10,716,221
- Issue date Jul 14, 2020
- Samsung Display Co., Ltd.
- Jun-hee Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus and method for manufacturing display apparatus
- Patent number 10,694,626
- Issue date Jun 23, 2020
- Sakai Display Products Corporation
- Katsuhiko Kishimoto
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for bonding discrete devices using anisotropic conductive film
- Patent number 10,420,222
- Issue date Sep 17, 2019
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Chip mounter, electronic circuit substrate, and power module
- Patent number 10,194,519
- Issue date Jan 29, 2019
- Mitsubishi Electric Corporation
- Tetsuya Ueda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method, pickup method, equipment and EMI (electromagn...
- Patent number 10,121,684
- Issue date Nov 6, 2018
- Bin Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of intra-structure conductive traces and interconnects...
- Patent number 10,039,195
- Issue date Jul 31, 2018
- Facebook, Inc.
- Baback Elmieh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Cortical implant system for brain stimulation and recording
- Patent number 9,949,376
- Issue date Apr 17, 2018
- Second Sight Medical Products, Inc.
- Robert J Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Mounting device for mounting multi-segmented flexible printed circu...
- Patent number 9,820,385
- Issue date Nov 14, 2017
- Samsung Display Co., Ltd.
- Joon-Sam Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for adsorbing solder ball and method of attaching solder...
- Patent number 9,579,741
- Issue date Feb 28, 2017
- Samsung Electronics Co., Ltd.
- Eun-Sun An
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive ball mounting method
- Patent number 9,516,763
- Issue date Dec 6, 2016
- Shibuya Kogyo Co., Ltd.
- Kazunari Ikeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing apparatus and laser processing method using the sa...
- Patent number 9,421,638
- Issue date Aug 23, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshinori Nakagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for removing an electronic component from a substrate
- Patent number 9,338,935
- Issue date May 10, 2016
- International Business Machines Corporation
- Yvan Bessette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for contacting, positioning and impinging a solde...
- Patent number 9,327,360
- Issue date May 3, 2016
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder piece, chip solder and method of fabricating solder piece
- Patent number 9,327,364
- Issue date May 3, 2016
- Senju Metal Industry Co., Ltd.
- Masahiko Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for forming roll-to-roll pattern
- Patent number 9,248,471
- Issue date Feb 2, 2016
- Korea Institute of Science and Technology
- Jung Ah Lim
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
T-flex bonder
- Patent number 9,101,083
- Issue date Aug 4, 2015
- Apple Inc.
- Silvio Grespan
- B32 - LAYERED PRODUCTS
Information Patent Grant
Solder piece, chip solder and method of fabricating solder piece
- Patent number 8,991,679
- Issue date Mar 31, 2015
- Senju Metal Industry Co., Ltd.
- Masahiko Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pattern forming apparatus and pattern forming method
- Patent number 8,955,432
- Issue date Feb 17, 2015
- SCREEN Holdings Co., Ltd.
- Masafumi Kawagoe
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of bonding a member to a support by addition of material, an...
- Patent number 8,952,288
- Issue date Feb 10, 2015
- Valeo Equipements Electriques Monteur
- Jean-Michel Morelle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for removing an electronic component from a substrate
- Patent number 8,925,170
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Yvan Bessette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging structure for assembling to printed circuit board
- Patent number 8,893,369
- Issue date Nov 25, 2014
- Ting-Jui Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor substrate and method of fabricating same
- Patent number 8,821,793
- Issue date Sep 2, 2014
- Medtronic MiniMed, Inc.
- Shaun Pendo
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Forming low stress joints using thermal compress bonding
- Patent number 8,616,433
- Issue date Dec 31, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting board including a flat-type electrical element and capable...
- Patent number 8,618,423
- Issue date Dec 31, 2013
- SANYO Electric Co., Ltd.
- Hirotoshi Ozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for non-vascular sensor implantation
- Patent number 8,465,466
- Issue date Jun 18, 2013
- Medtronic MiniMed, Inc.
- Michael E. Miller
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR FORMING BOARD MULTI-LAYERS OF MULTILAYER PRIN...
- Publication number 20240397634
- Publication date Nov 28, 2024
- FIND HOW ENTERPRISE CO. LTD.
- Kuo-Ching Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Filling Assembly
- Publication number 20210037655
- Publication date Feb 4, 2021
- ITC Intercircuit Electronic GmbH
- Hubertus Hein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING MACHINE
- Publication number 20200296869
- Publication date Sep 17, 2020
- FUJI CORPORATION
- Shigeto OYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY APPARATUS AND METHOD FOR MANUFACTURING DISPLAY APPARATUS
- Publication number 20200068724
- Publication date Feb 27, 2020
- Sakai Display Products Corporation
- KATSUHIKO KISHIMOTO
- B60 - VEHICLES IN GENERAL
Information Patent Application
CHIP MOUNTER, ELECTRONIC CIRCUIT SUBSTRATE, AND POWER MODULE
- Publication number 20190037680
- Publication date Jan 31, 2019
- Mitsubishi Electric Corporation
- Tetsuya UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TREATMENT FLUID EXTRACTING DEVICE AND ETCHING DEVICE COMPRISING THE...
- Publication number 20180324954
- Publication date Nov 8, 2018
- Gebr. Schmid GmbH
- Jürgen Haungs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRACKS PATTERNS PRODUCTION APPARATUS
- Publication number 20170013724
- Publication date Jan 12, 2017
- Utilight Ltd.
- Amir Noy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
T-FLEX BONDER
- Publication number 20140069567
- Publication date Mar 13, 2014
- Apple Inc.
- Silvio GRESPAN
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR FORMING ROLL-TO-ROLL PATTERN
- Publication number 20140037863
- Publication date Feb 6, 2014
- Korea Institute of Science and Technology
- Jung Ah LIM
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
BOARD SEPARATION APPARATUS AND OPERATING METHOD THEREOF
- Publication number 20130319620
- Publication date Dec 5, 2013
- SUBTRON TECHNOLOGY CO., LTD.
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM TABLE FOR A PRINTING DEVICE
- Publication number 20130171351
- Publication date Jul 4, 2013
- CAMTEK LTD
- Uri Vekstein
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PATTERN FORMING APPARATUS AND PATTERN FORMING METHOD
- Publication number 20130133535
- Publication date May 30, 2013
- Masafumi KAWAGOE
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Forming Low Stress Joints Using Thermal Compress Bonding
- Publication number 20130128486
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR MOUNTING CONDUCTIVE BALLS
- Publication number 20130098975
- Publication date Apr 25, 2013
- SHIBUYA KOGYO CO., LTD.
- Kazunari Ikeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE
- Publication number 20130082087
- Publication date Apr 4, 2013
- SENJU METAL INDUSTRY CO., LTD.
- Masahiko Abe
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
METHOD OF BONDING A MEMBER TO A SUPPORT BY ADDITION OF MATERIAL, AN...
- Publication number 20130062326
- Publication date Mar 14, 2013
- VALEO ELECTRONIQUE ET SYSTEMES DE LIAISON
- Jean-Michel Morelle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of controlling bump printing apparatus
- Publication number 20130020379
- Publication date Jan 24, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Joon Kon KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MACHINE PLACEABLE CIRCUIT BOARD INTERPOSER
- Publication number 20130003336
- Publication date Jan 3, 2013
- Delphi Technologies, Inc.
- ROY A. VISSER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR REMOVING AN ELECTRONIC COMPONENT FROM A SUBST...
- Publication number 20120266459
- Publication date Oct 25, 2012
- International Business Machines Corporation
- Yvan Bessette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING STRUCTURE FOR ASSEMBLING TO PRINTED CIRCUIT BOARD
- Publication number 20120233851
- Publication date Sep 20, 2012
- TING-JUI WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR LOADING SOLDER BALLS
- Publication number 20120067938
- Publication date Mar 22, 2012
- IBIDEN CO., LTD.
- Katsuhiko TANNO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE SUPPORT MATERIAL USEFUL FOR SCREEN PRINTING PROCESSES
- Publication number 20120034382
- Publication date Feb 9, 2012
- Applied Materials, Inc.
- Andrea Baccini
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Forming Low Stress Joints Using Thermal Compress Bonding
- Publication number 20120021183
- Publication date Jan 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MAKING AN ELECTRONIC ASSEMBLY
- Publication number 20110271522
- Publication date Nov 10, 2011
- Charles Still
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTIL...
- Publication number 20110220405
- Publication date Sep 15, 2011
- FUJITSU LIMITED
- Kazuhisa TSUNOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING TH...
- Publication number 20110211323
- Publication date Sep 1, 2011
- Kabushiki KaishaToshiba
- Norichika Unriin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Apparatus for cleaning inkjet print head
- Publication number 20110164087
- Publication date Jul 7, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jae Hun Kim
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CIRCUIT BOARD, ITS MANUFACTURING METHOD, AND JOINT BOX USING CIRCUI...
- Publication number 20110120756
- Publication date May 26, 2011
- MITSUBISHI CABLE INDUSTRIES, LTD.
- Tsugio AMBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, ITS MANUFACTURING METHOD, AND JOINT BOX USING CIRCUI...
- Publication number 20110116248
- Publication date May 19, 2011
- MITSUBISHI CABLE INDUSTRIES, LTD.
- Tsugio AMBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-BALL REMOVAL METHOD AND REMOVAL DEVICE, AND MICRO-BALL COLLEC...
- Publication number 20110107580
- Publication date May 12, 2011
- Shinji Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Vacuum-assisted BGA joint formation

Component mounting machine

Filling assembly

Display apparatus and method for manufacturing display apparatus

Optoelectronic assembly, and method for producing an optoelectronic...

Method of manufacturing electronic device

Display apparatus and method for manufacturing display apparatus

Method for bonding discrete devices using anisotropic conductive film

Chip mounter, electronic circuit substrate, and power module

Manufacturing method, pickup method, equipment and EMI (electromagn...

Fabrication of intra-structure conductive traces and interconnects...

Cortical implant system for brain stimulation and recording

Mounting device for mounting multi-segmented flexible printed circu...

Apparatus for adsorbing solder ball and method of attaching solder...

Conductive ball mounting method

Laser processing apparatus and laser processing method using the sa...

System for removing an electronic component from a substrate

Method and device for contacting, positioning and impinging a solde...

Solder piece, chip solder and method of fabricating solder piece

Device and method for forming roll-to-roll pattern

T-flex bonder

Solder piece, chip solder and method of fabricating solder piece

Pattern forming apparatus and pattern forming method

Method of bonding a member to a support by addition of material, an...

Method for removing an electronic component from a substrate

Packaging structure for assembling to printed circuit board

Sensor substrate and method of fabricating same

Forming low stress joints using thermal compress bonding

Mounting board including a flat-type electrical element and capable...

Method and system for non-vascular sensor implantation

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR FORMING BOARD MULTI-LAYERS OF MULTILAYER PRIN...

Filling Assembly

COMPONENT MOUNTING MACHINE

DISPLAY APPARATUS AND METHOD FOR MANUFACTURING DISPLAY APPARATUS

CHIP MOUNTER, ELECTRONIC CIRCUIT SUBSTRATE, AND POWER MODULE

TREATMENT FLUID EXTRACTING DEVICE AND ETCHING DEVICE COMPRISING THE...

TRACKS PATTERNS PRODUCTION APPARATUS

T-FLEX BONDER

DEVICE AND METHOD FOR FORMING ROLL-TO-ROLL PATTERN

BOARD SEPARATION APPARATUS AND OPERATING METHOD THEREOF

VACUUM TABLE FOR A PRINTING DEVICE

PATTERN FORMING APPARATUS AND PATTERN FORMING METHOD

Forming Low Stress Joints Using Thermal Compress Bonding

METHOD AND APPARATUS FOR MOUNTING CONDUCTIVE BALLS

SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE

METHOD OF BONDING A MEMBER TO A SUPPORT BY ADDITION OF MATERIAL, AN...

Method of controlling bump printing apparatus

MACHINE PLACEABLE CIRCUIT BOARD INTERPOSER

SYSTEM AND METHOD FOR REMOVING AN ELECTRONIC COMPONENT FROM A SUBST...

PACKAGING STRUCTURE FOR ASSEMBLING TO PRINTED CIRCUIT BOARD

METHOD AND APPARATUS FOR LOADING SOLDER BALLS

SUBSTRATE SUPPORT MATERIAL USEFUL FOR SCREEN PRINTING PROCESSES

Forming Low Stress Joints Using Thermal Compress Bonding

METHOD FOR MAKING AN ELECTRONIC ASSEMBLY

METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTIL...

CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING TH...

Apparatus for cleaning inkjet print head

CIRCUIT BOARD, ITS MANUFACTURING METHOD, AND JOINT BOX USING CIRCUI...

CIRCUIT BOARD, ITS MANUFACTURING METHOD, AND JOINT BOX USING CIRCUI...

MICRO-BALL REMOVAL METHOD AND REMOVAL DEVICE, AND MICRO-BALL COLLEC...