Sulfur containing polymer

Industry

CPC
H01L2924/0705

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/0705Sulfur containing polymer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive composition
- Patent number 10,689,550
- Issue date Jun 23, 2020
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular electronics apparatuses and methods
- Patent number 10,573,835
- Issue date Feb 25, 2020
- Nokia Technologies Oy
- Mark Allen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,256,169
- Issue date Apr 9, 2019
- Fuji Electric Co., Ltd.
- Naoyuki Kanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,137,534
- Issue date Nov 27, 2018
- Nippon Micrometal Corporation
- Takashi Yamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Molded composite enclosure for integrated circuit assembly
- Patent number 10,056,308
- Issue date Aug 21, 2018
- Intel Corporation
- Paul J. Gwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Molded composite enclosure for integrated circuit assembly
- Patent number 9,607,914
- Issue date Mar 28, 2017
- Intel Corporation
- Paul J. Gwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
TSV structures and methods for forming the same
- Patent number 9,373,575
- Issue date Jun 21, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isocyanurate compound for forming organic anti-reflective layer and...
- Patent number 9,063,424
- Issue date Jun 23, 2015
- Dongjin Semichem Co., Ltd.
- Hyo-Jung Roh
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
TSV structures and methods for forming the same
- Patent number 8,956,966
- Issue date Feb 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV structures and methods for forming the same
- Patent number 8,803,316
- Issue date Aug 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...
- Publication number 20220415853
- Publication date Dec 29, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR ELECTRONICS APPARATUSES AND METHODS
- Publication number 20180013082
- Publication date Jan 11, 2018
- Nokia Technologies Oy
- Mark ALLEN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRICALLY CONDUCTIVE COMPOSITION
- Publication number 20170369746
- Publication date Dec 28, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170278771
- Publication date Sep 28, 2017
- Fuji Electric Co., Ltd.
- Naoyuki Kanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20170170085
- Publication date Jun 15, 2017
- Intel Corporation
- Paul J. Gwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20160268178
- Publication date Sep 15, 2016
- Paul J. Gwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR DEVICE
- Publication number 20160075920
- Publication date Mar 17, 2016
- Samsung SDI Co., Ltd.
- Dong Seon UH
- B32 - LAYERED PRODUCTS
Information Patent Application
TSV Structures and Methods for Forming the Same
- Publication number 20140342547
- Publication date Nov 20, 2014
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV Structures and Methods for Forming the Same
- Publication number 20130140690
- Publication date Jun 6, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOCYANURATE COMPOUND FOR FORMING ORGANIC ANTI-REFLECTIVE LAYER AND...
- Publication number 20120164338
- Publication date Jun 28, 2012
- DONGJIN SEMICHEM CO., LTD.
- Hyo-Jung Roh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR DEVICE
- Publication number 20120141786
- Publication date Jun 7, 2012
- Dong Seon UH
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Sulfur containing polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connection structure and manufacturing method therefor

Bonding wire for semiconductor device

Electrically conductive composition

Bonding wire for semiconductor device

Modular electronics apparatuses and methods

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Semiconductor device

Bonding wire for semiconductor device

Molded composite enclosure for integrated circuit assembly

Molded composite enclosure for integrated circuit assembly

TSV structures and methods for forming the same

Isocyanurate compound for forming organic anti-reflective layer and...

TSV structures and methods for forming the same

TSV structures and methods for forming the same

Patents Applicationslast 30 patents

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...

MODULAR ELECTRONICS APPARATUSES AND METHODS

ELECTRICALLY CONDUCTIVE COMPOSITION

SEMICONDUCTOR DEVICE

MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY

MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE

TSV Structures and Methods for Forming the Same

TSV Structures and Methods for Forming the Same

ISOCYANURATE COMPOUND FOR FORMING ORGANIC ANTI-REFLECTIVE LAYER AND...

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE