Sulfur [S]

Industry

CPC
H01L2924/01016

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01016Sulfur [S]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Palladium-coated copper bonding wire and method for manufacturing same
- Patent number 12,087,724
- Issue date Sep 10, 2024
- Tanaka Denshi Kogyo K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, wire bonding structure, semic...
- Patent number 11,876,066
- Issue date Jan 16, 2024
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 11,760,059
- Issue date Sep 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor memory device structure
- Patent number 11,742,307
- Issue date Aug 29, 2023
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device structure
- Patent number 11,264,344
- Issue date Mar 1, 2022
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu pillar cylindrical preform for semiconductor connection
- Patent number 11,101,234
- Issue date Aug 24, 2021
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive film for semiconductor, and semiconductor device
- Patent number 10,818,610
- Issue date Oct 27, 2020
- LG Chem, Ltd.
- Hee Jung Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Cu column, Cu core column, solder joint, and through-silicon via
- Patent number 10,811,376
- Issue date Oct 20, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor memory device structure
- Patent number 10,756,036
- Issue date Aug 25, 2020
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 10,434,749
- Issue date Oct 8, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 10,163,850
- Issue date Dec 25, 2018
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulating resin composition, semiconductor device using the enc...
- Patent number 9,932,473
- Issue date Apr 3, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Emi Iwatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a structure by assembling at least two elemen...
- Patent number 9,922,953
- Issue date Mar 20, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Paul Gondcharton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,780,069
- Issue date Oct 3, 2017
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for integrated circuit devices including multi-layer glas...
- Patent number 9,761,514
- Issue date Sep 12, 2017
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin-indium based low temperature solder alloy
- Patent number 9,741,676
- Issue date Aug 22, 2017
- Indium Corporation
- Jianguo Luo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory device structure
- Patent number 9,589,918
- Issue date Mar 7, 2017
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with thin film resistor and terminal bond pad
- Patent number 9,287,345
- Issue date Mar 15, 2016
- GLOBALFOUNDRIES Inc.
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Indium compositions
- Patent number 9,206,519
- Issue date Dec 8, 2015
- Rohm and Haas Electronic Materials LLC
- Edit Szocs
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of forming a memory device
- Patent number 9,177,927
- Issue date Nov 3, 2015
- Micron Technology, Inc.
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nano memory, light, energy, antenna and strand-based systems and me...
- Patent number 9,117,550
- Issue date Aug 25, 2015
- Bao Q. Tran
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Apparatus with a multi-layer coating and method of forming the same
- Patent number 9,055,700
- Issue date Jun 9, 2015
- Semblant Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces
- Patent number 8,986,789
- Issue date Mar 24, 2015
- Atotech Deutschland GmbH
- Albrecht Uhlig
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Epoxy resin composition for semiconductor encapsulation, cured prod...
- Patent number 8,963,344
- Issue date Feb 24, 2015
- Sumitomo Bakelite Co., Ltd.
- Shingo Itoh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Production apparatus of composite silver nanoparticle
- Patent number 8,906,317
- Issue date Dec 9, 2014
- Applied Nanoparticle Laboratory Corporation
- Teruo Komatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Window interposed die packaging
- Patent number 8,907,471
- Issue date Dec 9, 2014
- IMEC
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a memory device
- Patent number 8,900,945
- Issue date Dec 2, 2014
- Micron Technology, Inc.
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor device comprising an inter-die conn...
- Patent number 8,847,404
- Issue date Sep 30, 2014
- GLOBALFOUNDRIES Inc.
- Stephan Kronholz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 8,841,002
- Issue date Sep 23, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low temperature bonding material comprising coated metal nanopartic...
- Patent number 8,821,676
- Issue date Sep 2, 2014
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PHASE CHANGE INTERCONNECTS AND METHODS FOR FORMING THE SAME
- Publication number 20230058704
- Publication date Feb 23, 2023
- TOKYO ELECTRON LIMITED
- Robert D. Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
- Publication number 20220157753
- Publication date May 19, 2022
- Ovonyx Memory Technology, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE, MANUFACTURING METHOD OF PALLA...
- Publication number 20220005781
- Publication date Jan 6, 2022
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE, WIRE BONDING STRUCTURE, SEMIC...
- Publication number 20210366867
- Publication date Nov 25, 2021
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20210280553
- Publication date Sep 9, 2021
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
- Publication number 20200357761
- Publication date Nov 12, 2020
- Ovonyx Memory Technology, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ROOM TEMPERATURE COVALENT BONDING
- Publication number 20190344534
- Publication date Nov 14, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF ROOM TEMPERATURE COVALENT BONDING
- Publication number 20190344533
- Publication date Nov 14, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE
- Publication number 20190326226
- Publication date Oct 24, 2019
- LG CHEM, LTD.
- Hee Jung KIM
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
- Publication number 20190319001
- Publication date Oct 17, 2019
- Ovonyx Memory Technology, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180005981
- Publication date Jan 4, 2018
- Rohm Co., Ltd.
- Motoharu HAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TIN-INDIUM BASED LOW TEMPERATURE SOLDER ALLOY
- Publication number 20170373034
- Publication date Dec 28, 2017
- Indium Corporation
- Jianguo Luo
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu PILLAR CYLINDRICAL PREFORM FOR SEMICONDUCTOR CONNECTION
- Publication number 20170287861
- Publication date Oct 5, 2017
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via
- Publication number 20170287862
- Publication date Oct 5, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- B32 - LAYERED PRODUCTS
Information Patent Application
PROCESS FOR PRODUCING A STRUCTURE BY ASSEMBLING AT LEAST TWO ELEMEN...
- Publication number 20170025377
- Publication date Jan 26, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Paul GONDCHARTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR INTEGRATED CIRCUIT DEVICES INCLUDING MULTI-LAYER GLAS...
- Publication number 20160322290
- Publication date Nov 3, 2016
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATING RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING THE ENC...
- Publication number 20160289443
- Publication date Oct 6, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- EMI IWATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140035115
- Publication date Feb 6, 2014
- SUMITOMO BAKELITE CO., LTD.
- Shin-ichi Zenbutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THIN FILM RESISTOR AND TERMINAL BOND PAD SIMULTA...
- Publication number 20140001599
- Publication date Jan 2, 2014
- International Business Machines Corporation
- Fen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20130306352
- Publication date Nov 21, 2013
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
INDIUM COMPOSITIONS
- Publication number 20130270117
- Publication date Oct 17, 2013
- Edit SZOCS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE COMPRISING AN INTER-DIE CONN...
- Publication number 20130221540
- Publication date Aug 29, 2013
- GLOBALFOUNDRIES INC.
- Stephan Kronholz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Production Apparatus of Composite Silver Nanoparticle
- Publication number 20130164187
- Publication date Jun 27, 2013
- Applied Nanoparticle Laboratory Corporation
- Teruo Komatsu
- B82 - NANO-TECHNOLOGY
Information Patent Application
EMBEDDED SEMICONDUCTOR DEVICE SUBSTRATE AND PRODUCTION METHOD THEREOF
- Publication number 20130130494
- Publication date May 23, 2013
- Canon Kabushiki Kaisha
- HIROSHI KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Production Method of Composite Silver Nanoparticle
- Publication number 20130098205
- Publication date Apr 25, 2013
- Applied Nanoparticle Laboratory Corporation
- Teruo Komatsu
- B82 - NANO-TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS TO COOL SEMICONDUCTOR
- Publication number 20120299175
- Publication date Nov 29, 2012
- Bao Tran
- G11 - INFORMATION STORAGE
Information Patent Application
Window Interposed Die Packaging
- Publication number 20120280381
- Publication date Nov 8, 2012
- IMEC
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, CURED PROD...
- Publication number 20120261807
- Publication date Oct 18, 2012
- Shingo Itoh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PROCESS FOR WET PASSIVATION OF BOND PADS FOR PROTECTION AGAINST SUB...
- Publication number 20120225567
- Publication date Sep 6, 2012
- Mattia Cichocki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ROOM TEMPERATURE COVALENT BONDING
- Publication number 20120183808
- Publication date Jul 19, 2012
- Ziptronix, Inc.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Palladium-coated copper bonding wire and method for manufacturing same

Palladium-coated copper bonding wire, wire bonding structure, semic...

Method of room temperature covalent bonding

Semiconductor memory device structure

Semiconductor memory device structure

Cu pillar cylindrical preform for semiconductor connection

Adhesive film for semiconductor, and semiconductor device

Cu column, Cu core column, solder joint, and through-silicon via

Semiconductor memory device structure

Method of room temperature covalent bonding

Semiconductor device

Encapsulating resin composition, semiconductor device using the enc...

Process for producing a structure by assembling at least two elemen...

Semiconductor device

Substrate for integrated circuit devices including multi-layer glas...

Tin-indium based low temperature solder alloy

Memory device structure

Semiconductor structure with thin film resistor and terminal bond pad

Indium compositions

Method of forming a memory device

Nano memory, light, energy, antenna and strand-based systems and me...

Apparatus with a multi-layer coating and method of forming the same

Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces

Epoxy resin composition for semiconductor encapsulation, cured prod...

Production apparatus of composite silver nanoparticle

Window interposed die packaging

Method of forming a memory device

Three-dimensional semiconductor device comprising an inter-die conn...

Method of room temperature covalent bonding

Low temperature bonding material comprising coated metal nanopartic...

Patents Applicationslast 30 patents

PHASE CHANGE INTERCONNECTS AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR MEMORY DEVICE STRUCTURE

PALLADIUM-COATED COPPER BONDING WIRE, MANUFACTURING METHOD OF PALLA...

PALLADIUM-COATED COPPER BONDING WIRE, WIRE BONDING STRUCTURE, SEMIC...

PALLADIUM-COATED COPPER BONDING WIRE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR MEMORY DEVICE STRUCTURE

METHOD OF ROOM TEMPERATURE COVALENT BONDING

METHOD OF ROOM TEMPERATURE COVALENT BONDING

ADHESIVE FILM FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY DEVICE STRUCTURE

SEMICONDUCTOR DEVICE

TIN-INDIUM BASED LOW TEMPERATURE SOLDER ALLOY

Cu PILLAR CYLINDRICAL PREFORM FOR SEMICONDUCTOR CONNECTION

Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via

PROCESS FOR PRODUCING A STRUCTURE BY ASSEMBLING AT LEAST TWO ELEMEN...

SUBSTRATE FOR INTEGRATED CIRCUIT DEVICES INCLUDING MULTI-LAYER GLAS...

ENCAPSULATING RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING THE ENC...

SEMICONDUCTOR DEVICE

METHOD FOR FORMING THIN FILM RESISTOR AND TERMINAL BOND PAD SIMULTA...

BONDING WIRE FOR SEMICONDUCTOR

INDIUM COMPOSITIONS

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE COMPRISING AN INTER-DIE CONN...

Production Apparatus of Composite Silver Nanoparticle

EMBEDDED SEMICONDUCTOR DEVICE SUBSTRATE AND PRODUCTION METHOD THEREOF

Production Method of Composite Silver Nanoparticle

SYSTEMS AND METHODS TO COOL SEMICONDUCTOR

Window Interposed Die Packaging

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, CURED PROD...

PROCESS FOR WET PASSIVATION OF BOND PADS FOR PROTECTION AGAINST SUB...

METHOD OF ROOM TEMPERATURE COVALENT BONDING