Superposed layout

Industry

CPC
H05K2201/09672

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09672Superposed layout

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-level printed circuit boards and memory modules including the...
- Patent number 12,075,560
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jong-Hyun Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer board
- Patent number 12,046,838
- Issue date Jul 23, 2024
- Murata Manufacturing Co., Ltd.
- Koji Kamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution plate
- Patent number 11,997,789
- Issue date May 28, 2024
- Dominik Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and manufacturing method thereof, electronic de...
- Patent number 11,917,758
- Issue date Feb 27, 2024
- PANELSEMI CORPORATION
- Ya-Che Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-interference circuit board and terminal
- Patent number 11,903,122
- Issue date Feb 13, 2024
- Huawei Technologies Co., Ltd.
- Dong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for high-speed signal layer transition
- Patent number 11,889,617
- Issue date Jan 30, 2024
- BAIDU USA LLC
- Zhenwei Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite wiring board, package, and electronic device
- Patent number 11,849,538
- Issue date Dec 19, 2023
- NGK Electronics Devices, Inc.
- Noboru Kubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 11,818,833
- Issue date Nov 14, 2023
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 11,785,720
- Issue date Oct 10, 2023
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector attached multi-conductor cable
- Patent number 11,784,438
- Issue date Oct 10, 2023
- Sumitomo Electric Industries, Ltd.
- Naoshige Yokota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for break out of interconnections for high-dens...
- Patent number 11,778,731
- Issue date Oct 3, 2023
- Raytheon Company
- Thanh Tran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Quad-trace structures for high-speed signaling
- Patent number 11,751,323
- Issue date Sep 5, 2023
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate and method for manufacturing the same
- Patent number 11,735,346
- Issue date Aug 22, 2023
- Murata Manufacturing Co., Ltd.
- Shingo Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tamper-respondent assemblies with porous heat transfer element(s)
- Patent number 11,716,808
- Issue date Aug 1, 2023
- International Business Machines Corporation
- Hongqing Zhang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Package substrate inductor having thermal interconnect structures
- Patent number 11,690,165
- Issue date Jun 27, 2023
- Intel Corporation
- Michael J. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and circuit for controlling quality of metallization of a mu...
- Patent number 11,678,434
- Issue date Jun 13, 2023
- Continental Automotive France
- Daniel Guerra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adapter board and method for making adapter board
- Patent number 11,665,820
- Issue date May 30, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Man-Zhi Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit module and interposer
- Patent number 11,640,860
- Issue date May 2, 2023
- Murata Manufacturing Co., Ltd.
- Keito Yonemori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 11,622,449
- Issue date Apr 4, 2023
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module, high-frequency circuit, and communication de...
- Patent number 11,533,806
- Issue date Dec 20, 2022
- Murata Manufacturing Co., Ltd.
- Hiroshi Matsubara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution plate
- Patent number 11,510,318
- Issue date Nov 22, 2022
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Grant
Metal base circuit board and method of manufacturing the metal base...
- Patent number 11,490,513
- Issue date Nov 1, 2022
- NHK Spring Co., Ltd.
- Katsumi Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus
- Patent number 11,462,529
- Issue date Oct 4, 2022
- Samsung Display Co., Ltd.
- Jungpyo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate and method of producing multilayer substrate
- Patent number 11,443,886
- Issue date Sep 13, 2022
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate and method for manufacturing same
- Patent number 11,424,063
- Issue date Aug 23, 2022
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and layout structure thereof
- Patent number 11,419,205
- Issue date Aug 16, 2022
- HTC Corporation
- Che-Jung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible substrate
- Patent number 11,388,816
- Issue date Jul 12, 2022
- Japan Display Inc.
- Takumi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board and electronic device including th...
- Patent number 11,362,697
- Issue date Jun 14, 2022
- Samsung Electronics Co., Ltd.
- Jinsu Heo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Package substrate inductor having thermal interconnect structures
- Patent number 11,357,096
- Issue date Jun 7, 2022
- Intel Corporation
- Michael J. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reversible electronic card and method of implementation thereof
- Patent number 11,350,526
- Issue date May 31, 2022
- GE Aviation Systems, LLC
- Jeffrey A. VanDorp
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTISTAGE CAPACITIVE CROSSTALK COMPENSATION ARRANGEMENT
- Publication number 20240195125
- Publication date Jun 13, 2024
- CommScope Technologies LLC
- David Patrick Murray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BASE AND ELECTRONIC DEVICE
- Publication number 20240074035
- Publication date Feb 29, 2024
- KYOCERA CORPORATION
- Yoshiki KAWAZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS
- Publication number 20240049393
- Publication date Feb 8, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240008168
- Publication date Jan 4, 2024
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED WIRING BOARD AND ELECTRIC WIRING
- Publication number 20230354522
- Publication date Nov 2, 2023
- NIPPON MEKTRON, LTD.
- Shunsuke AOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND PROBE CARD
- Publication number 20230266363
- Publication date Aug 24, 2023
- KYOCERA CORPORATION
- Hitoshi TEGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230262888
- Publication date Aug 17, 2023
- Murata Manufacturing Co., Ltd.
- Hiromichi TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB WITH INTERNAL CAPACITORS AND A MULTILAYER CAPACITANCE PLANE
- Publication number 20230223200
- Publication date Jul 13, 2023
- Imagine TF, LLC
- Brian Edward Richardson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Platform Supports the Shortest Electrical Connection between Two QS...
- Publication number 20230199950
- Publication date Jun 22, 2023
- Shuang Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION BODY AND HARNESS
- Publication number 20230187855
- Publication date Jun 15, 2023
- Japan Aviation Electronics Industry, Limited
- Kentaro TODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20230156908
- Publication date May 18, 2023
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION PLATE
- Publication number 20230054628
- Publication date Feb 23, 2023
- Translarity, Inc.
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Application
QUAD-TRACE STRUCTURES FOR HIGH-SPEED SIGNALING
- Publication number 20230031615
- Publication date Feb 2, 2023
- DELL PRODUCTS, L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER BOARD
- Publication number 20220416425
- Publication date Dec 29, 2022
- Murata Manufacturing Co., Ltd.
- Koji KAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT COPPER OVERLAY FOR TEMPERATURE MANAGEMENT
- Publication number 20220418078
- Publication date Dec 29, 2022
- Western Digital Technologies, Inc.
- Teruhiro Nakamiya
- G11 - INFORMATION STORAGE
Information Patent Application
CIRCUIT MODULE AND INTERPOSER
- Publication number 20220377893
- Publication date Nov 24, 2022
- Murata Manufacturing Co., Ltd.
- Keito YONEMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ATTACHED MULTI-CONDUCTOR CABLE
- Publication number 20220311189
- Publication date Sep 29, 2022
- Sumitomo Electric Industries, Ltd.
- Naoshige YOKOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE INDUCTOR HAVING THERMAL INTERCONNECT STRUCTURES
- Publication number 20220240370
- Publication date Jul 28, 2022
- Intel Corporation
- Michael J. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND CIRCUIT FOR CONTROLLING QUALITY OF METALLIZATION OF A MU...
- Publication number 20220240377
- Publication date Jul 28, 2022
- Daniel Guerra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAMPER-RESPONDENT ASSEMBLIES WITH POROUS HEAT TRANSFER ELEMENT(S)
- Publication number 20220192011
- Publication date Jun 16, 2022
- International Business Machines Corporation
- Hongqing ZHANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COMPOSITE WIRING BOARD, PACKAGE, AND ELECTRONIC DEVICE
- Publication number 20220151060
- Publication date May 12, 2022
- NGK Electronics Devices, Inc.
- Noboru KUBO
- G02 - OPTICS
Information Patent Application
Anti-Interference Circuit Board and Terminal
- Publication number 20220117077
- Publication date Apr 14, 2022
- Huawei Technologies Co., Ltd
- Dong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTER BOARD AND METHOD FOR MAKING ADAPTER BOARD
- Publication number 20220087020
- Publication date Mar 17, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MAN-ZHI PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY MODULE, HIGH-FREQUENCY CIRCUIT, AND COMMUNICATION DE...
- Publication number 20210315096
- Publication date Oct 7, 2021
- MURATA MANUFACTURING CO., LTD.
- Hiroshi MATSUBARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDISTRIBUTION PLATE
- Publication number 20210243896
- Publication date Aug 5, 2021
- TRANSLARITY, INC.
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Application
ADAPTER BOARD AND METHOD FOR MAKING ADAPTOR BOARD
- Publication number 20210235581
- Publication date Jul 29, 2021
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MAN-ZHI PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductor Arrangement and Production Method
- Publication number 20210202130
- Publication date Jul 1, 2021
- LISA DRAXLMAIER GMBH
- Michael WORTBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE, SYSTEM TO DETECT DISCONNECTION AND METHOD FOR DETEC...
- Publication number 20210141509
- Publication date May 13, 2021
- Sharp Kabushiki Kaisha
- NAOYA OKADA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REVERSIBLE ELECTRONIC CARD AND METHOD OF IMPLEMENTATION THEREOF
- Publication number 20210100096
- Publication date Apr 1, 2021
- GE AVIATION SYSTEMS, LLC
- Jeffrey A. VanDorp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD SHIELDING AND POWER DISTRIBUTION VIA EDGE PLA...
- Publication number 20210084756
- Publication date Mar 18, 2021
- International Business Machines Corporation
- Edni Del Rosal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Superposed layout

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-level printed circuit boards and memory modules including the...

Multilayer board

Redistribution plate

Substrate structure and manufacturing method thereof, electronic de...

Anti-interference circuit board and terminal

Techniques for high-speed signal layer transition

Composite wiring board, package, and electronic device

Circuit board structure

Multilayer ceramic capacitor

Connector attached multi-conductor cable

Systems and methods for break out of interconnections for high-dens...

Quad-trace structures for high-speed signaling

Multilayer substrate and method for manufacturing the same

Tamper-respondent assemblies with porous heat transfer element(s)

Package substrate inductor having thermal interconnect structures

Method and circuit for controlling quality of metallization of a mu...

Adapter board and method for making adapter board

Circuit module and interposer

Multilayer ceramic capacitor

High-frequency module, high-frequency circuit, and communication de...

Redistribution plate

Metal base circuit board and method of manufacturing the metal base...

Electronic apparatus

Multilayer substrate and method of producing multilayer substrate

Multilayer substrate and method for manufacturing same

Circuit board structure and layout structure thereof

Flexible substrate

Multilayer printed circuit board and electronic device including th...

Package substrate inductor having thermal interconnect structures

Reversible electronic card and method of implementation thereof

Patents Applicationslast 30 patents

MULTISTAGE CAPACITIVE CROSSTALK COMPENSATION ARRANGEMENT

WIRING BASE AND ELECTRONIC DEVICE

METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS

CIRCUIT BOARD

FLEXIBLE PRINTED WIRING BOARD AND ELECTRIC WIRING

CIRCUIT BOARD AND PROBE CARD

MULTILAYER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PCB WITH INTERNAL CAPACITORS AND A MULTILAYER CAPACITANCE PLANE

Platform Supports the Shortest Electrical Connection between Two QS...

CONNECTION BODY AND HARNESS

CIRCUIT BOARD STRUCTURE

REDISTRIBUTION PLATE

QUAD-TRACE STRUCTURES FOR HIGH-SPEED SIGNALING

MULTILAYER BOARD

FLEXIBLE PRINTED CIRCUIT COPPER OVERLAY FOR TEMPERATURE MANAGEMENT

CIRCUIT MODULE AND INTERPOSER

CONNECTOR ATTACHED MULTI-CONDUCTOR CABLE

PACKAGE SUBSTRATE INDUCTOR HAVING THERMAL INTERCONNECT STRUCTURES

METHOD AND CIRCUIT FOR CONTROLLING QUALITY OF METALLIZATION OF A MU...

TAMPER-RESPONDENT ASSEMBLIES WITH POROUS HEAT TRANSFER ELEMENT(S)

COMPOSITE WIRING BOARD, PACKAGE, AND ELECTRONIC DEVICE

Anti-Interference Circuit Board and Terminal

ADAPTER BOARD AND METHOD FOR MAKING ADAPTER BOARD

HIGH-FREQUENCY MODULE, HIGH-FREQUENCY CIRCUIT, AND COMMUNICATION DE...

REDISTRIBUTION PLATE

ADAPTER BOARD AND METHOD FOR MAKING ADAPTOR BOARD

Conductor Arrangement and Production Method

DISPLAY DEVICE, SYSTEM TO DETECT DISCONNECTION AND METHOD FOR DETEC...

REVERSIBLE ELECTRONIC CARD AND METHOD OF IMPLEMENTATION THEREOF

PRINTED CIRCUIT BOARD SHIELDING AND POWER DISTRIBUTION VIA EDGE PLA...