Surface mounted components

Industry

CPC
H05K3/341

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/341Surface mounted components

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor component and method for producing a power semi...
- Patent number 12,165,950
- Issue date Dec 10, 2024
- Vitesco Technologies GmbH
- Christina Quest-Matt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, electronic device, and production method for circuit...
- Patent number 12,156,346
- Issue date Nov 26, 2024
- HONOR DEVICE CO., LTD.
- Leiwen Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module having a soldering portion coupling a driving device...
- Patent number 12,149,811
- Issue date Nov 19, 2024
- LG Innotek Co., Ltd
- Jong Ho Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Device for driving a compressor and processes for mounting the device
- Patent number 12,138,989
- Issue date Nov 12, 2024
- HANON SYSTEMS
- Hendrik Varain
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Barrier for preventing SMD components from drifting
- Patent number 12,127,350
- Issue date Oct 22, 2024
- ZKW GROUP GMBH
- Christoph Haiden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,120,818
- Issue date Oct 15, 2024
- LG Innotek Co., Ltd
- Myung Gu Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount technology method and magnetic carrier system
- Patent number 12,114,435
- Issue date Oct 8, 2024
- SanDisk Technologies, Inc.
- Virgil Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with stack-stack connection for connecting compon...
- Patent number 12,096,555
- Issue date Sep 17, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB production by laser systems
- Patent number 12,089,328
- Issue date Sep 10, 2024
- IO Tech Group Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component arrangement, method for fabrication thereof...
- Patent number 12,046,531
- Issue date Jul 23, 2024
- Vitesco Technologies GmbH
- Detlev Bagung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical light emitting device, manufacturing method thereof, and op...
- Patent number 12,038,140
- Issue date Jul 16, 2024
- Japan Display Inc.
- Tomoyuki Ishihara
- F21 - LIGHTING
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,028,987
- Issue date Jul 2, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Switched capacitor converter package structure and method
- Patent number 12,028,980
- Issue date Jul 2, 2024
- Halo Microelectronics International
- Rui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method and mounting structure formed by the same
- Patent number 12,028,986
- Issue date Jul 2, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Naomichi Ohashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode structure
- Patent number 12,014,868
- Issue date Jun 18, 2024
- Cyntec Co., Ltd.
- Yi-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for manufacturing the same
- Patent number 11,973,486
- Issue date Apr 30, 2024
- Kyocera Corporation
- Sinichiro Kitanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smart yarn and method for manufacturing a yarn containing an electr...
- Patent number 11,891,730
- Issue date Feb 6, 2024
- SIREN CARE, INC.
- Jie Fu
- A41 - WEARING APPAREL
Information Patent Grant
Modular power electronics converters with enhanced connectivity rel...
- Patent number 11,895,775
- Issue date Feb 6, 2024
- University of Maryland, College Park
- Yongwan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic component and method of forming
- Patent number 11,887,766
- Issue date Jan 30, 2024
- GE Aviation Systems LLC
- Ramanujam Ramabhadran
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna and assembly
- Patent number 11,888,219
- Issue date Jan 30, 2024
- Japan Aviation Electronics Industry, Limited
- Osamu Hashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB production by laser systems
- Patent number 11,877,398
- Issue date Jan 16, 2024
- IO Tech Group Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering apparatus
- Patent number 11,865,645
- Issue date Jan 9, 2024
- Senju Metal Industry Co., Ltd.
- Yuta Saito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembling a camera for a vision system of a vehicle
- Patent number 11,812,563
- Issue date Nov 7, 2023
- Magna Electronics Inc.
- Jens Steigerwald
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems including an integrated power module with vias and methods...
- Patent number 11,778,793
- Issue date Oct 3, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Hitoshi Fujioka
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Component carrier for arranging electrical components on a circuit...
- Patent number 11,770,896
- Issue date Sep 26, 2023
- HARTING AG
- Thomas Hess
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Additive manufactured 3D electronic substrate
- Patent number 11,765,839
- Issue date Sep 19, 2023
- Schlumberger Technology Corporation
- Steven O. Dunford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package, electronic assembly and method for ma...
- Patent number 11,764,137
- Issue date Sep 19, 2023
- Cheng-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit, power converter, and method for producing an el...
- Patent number 11,756,857
- Issue date Sep 12, 2023
- Siemens Aktiengesellschaft
- Thomas Bigl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module
- Patent number 11,699,670
- Issue date Jul 11, 2023
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of determining state of iron tip
- Patent number 11,691,210
- Issue date Jul 4, 2023
- AND CO., LTD.
- Mitsuo Ebisawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MOUNT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240414847
- Publication date Dec 12, 2024
- DENSO CORPORATION
- Takeshi KAZAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
- Publication number 20240389239
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wen Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR ROUTABLE CIRCUIT BOARD CONDUCTOR BLOCKS
- Publication number 20240381541
- Publication date Nov 14, 2024
- Microsoft Technology Licensing, LLC
- Jason HARRIGAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20240373563
- Publication date Nov 7, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THIN SEMICOND...
- Publication number 20240355719
- Publication date Oct 24, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB PRODUCTION BY LASER SYSTEMS
- Publication number 20240324101
- Publication date Sep 26, 2024
- IO Tech Group Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR COMPONENT ARRANGEMENT, METHOD FOR FABRICATION THEREOF...
- Publication number 20240297093
- Publication date Sep 5, 2024
- Vitesco Technologies GMBH
- Detlev Bagung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL SOLDER LAYER FOR BROACHING CLINCH NUT ASSEMBLY
- Publication number 20240292546
- Publication date Aug 29, 2024
- Nokia Solutions and Networks Oy
- Daniel Fazari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240276642
- Publication date Aug 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Keesu Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MOUNTING LAND AND CHARGER
- Publication number 20240268024
- Publication date Aug 8, 2024
- Panasonic Automotive Systems Co., Ltd.
- Hiroyuki HOSOI
- B60 - VEHICLES IN GENERAL
Information Patent Application
OPTOELECTRONIC ASSEMBLY AND METHOD FOR THE PRODUCTION OF SAME
- Publication number 20240260186
- Publication date Aug 1, 2024
- ams-OSRAM International GmbH
- Thomas KIPPES
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DECOUPLING CAPACITOR BOOSTER MODULE
- Publication number 20240260193
- Publication date Aug 1, 2024
- Intel Corporation
- Herh Nan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD FOR A POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR...
- Publication number 20240260168
- Publication date Aug 1, 2024
- VITESCO TECHNOLOGIES GMBH
- Detlev Bagung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE
- Publication number 20240260184
- Publication date Aug 1, 2024
- LG Innotek Co., Ltd.
- Seung Hyeong LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD FOR CIRCUIT BOARD ASSEMBLY
- Publication number 20240237227
- Publication date Jul 11, 2024
- NGK Insulators, Ltd.
- Yukinobu YURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Energy Storage Unit for an Electrical Consumer and Method for Manuf...
- Publication number 20240204268
- Publication date Jun 20, 2024
- ROBERT BOSCH GmbH
- Holger Wernerus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BUSBARS FOR LOAD SWITCHING
- Publication number 20240206049
- Publication date Jun 20, 2024
- Valmet Automotive EV Power Oy
- Juuso Kelkka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board, Electronic Device, and Production Method for Circuit...
- Publication number 20240196543
- Publication date Jun 13, 2024
- Honor Device Co., Ltd.
- Leiwen Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC COMPONENT AND METHOD OF FORMING
- Publication number 20240177912
- Publication date May 30, 2024
- GE AVIATION SYSTEMS LLC
- Ramanujam Ramabhadran
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING POWER MODULE PACKAGE, POWER MODULE PACKAGE AND E...
- Publication number 20240172375
- Publication date May 23, 2024
- Delta Electronics, Inc.
- Quansong Luo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240147632
- Publication date May 2, 2024
- YAZAKI CORPORATION
- Mitsuaki Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SWITCHING MODULE, POWER CONVERSION DEVICE, AND MANUFACTURING METHOD...
- Publication number 20240098926
- Publication date Mar 21, 2024
- Kabushiki Kaisha Yaskawa Denki
- Kenshiro MORISHITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240098912
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Jinhwan JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE, ELECTRONIC ASSEMBLY AND METHOD FOR MA...
- Publication number 20240088001
- Publication date Mar 14, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductive Position Sensor for Electronic Throttle Control
- Publication number 20240077335
- Publication date Mar 7, 2024
- Integrated Device Technology, Inc.
- Andreas Buchinger
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Application
EXTENDED PAD AREA TO PREVENT PRINTED CIRCUIT BOARD DAMAGE
- Publication number 20240074067
- Publication date Feb 29, 2024
- KOLLMORGEN CORPORATION
- Jeffery Todd BREWSTER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB PRODUCTION BY LASER SYSTEMS
- Publication number 20240064897
- Publication date Feb 22, 2024
- IO Tech Group Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL LIGHT EMITTING DEVICE, MANUFACTURING METHOD THEREOF, AND OP...
- Publication number 20240044458
- Publication date Feb 8, 2024
- Japan Display Inc.
- Tomoyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE MOUNT HAPTIC ACTUATOR
- Publication number 20240022155
- Publication date Jan 18, 2024
- PUI Audio, Inc.
- Barry RICKS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MODULAR POWER ELECTRONICS CONVERTERS WITH ENHANCED CONNECTIVITY REL...
- Publication number 20240008182
- Publication date Jan 4, 2024
- University of Maryland, College Park
- YONGWAN PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Surface mounted components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power semiconductor component and method for producing a power semi...

Circuit board, electronic device, and production method for circuit...

Camera module having a soldering portion coupling a driving device...

Device for driving a compressor and processes for mounting the device

Barrier for preventing SMD components from drifting

Printed circuit board

Surface mount technology method and magnetic carrier system

Component carrier with stack-stack connection for connecting compon...

PCB production by laser systems

Semiconductor component arrangement, method for fabrication thereof...

Optical light emitting device, manufacturing method thereof, and op...

Method for soldering an electronic component to a circuit board by...

Switched capacitor converter package structure and method

Mounting method and mounting structure formed by the same

Electrode structure

Electronic component and method for manufacturing the same

Smart yarn and method for manufacturing a yarn containing an electr...

Modular power electronics converters with enhanced connectivity rel...

Magnetic component and method of forming

Antenna and assembly

PCB production by laser systems

Soldering apparatus

Method for assembling a camera for a vision system of a vehicle

Systems including an integrated power module with vias and methods...

Component carrier for arranging electrical components on a circuit...

Additive manufactured 3D electronic substrate

Semiconductor device package, electronic assembly and method for ma...

Electronic circuit, power converter, and method for producing an el...

High-frequency module

Method of determining state of iron tip

Patents Applicationslast 30 patents

MOUNT BOARD AND METHOD OF MANUFACTURING THE SAME

METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER

MODULAR ROUTABLE CIRCUIT BOARD CONDUCTOR BLOCKS

Method for Soldering an Electronic Component to a Circuit Board by...

THIN SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THIN SEMICOND...

PCB PRODUCTION BY LASER SYSTEMS

SEMICONDUCTOR COMPONENT ARRANGEMENT, METHOD FOR FABRICATION THEREOF...

SACRIFICIAL SOLDER LAYER FOR BROACHING CLINCH NUT ASSEMBLY

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

SOLDER MOUNTING LAND AND CHARGER

OPTOELECTRONIC ASSEMBLY AND METHOD FOR THE PRODUCTION OF SAME

DECOUPLING CAPACITOR BOOSTER MODULE

CIRCUIT BOARD FOR A POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR...

PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE

PRODUCTION METHOD FOR CIRCUIT BOARD ASSEMBLY

Energy Storage Unit for an Electrical Consumer and Method for Manuf...

EMBEDDED BUSBARS FOR LOAD SWITCHING

Circuit Board, Electronic Device, and Production Method for Circuit...

MAGNETIC COMPONENT AND METHOD OF FORMING

METHOD FOR FORMING POWER MODULE PACKAGE, POWER MODULE PACKAGE AND E...

WIRING BOARD

SWITCHING MODULE, POWER CONVERSION DEVICE, AND MANUFACTURING METHOD...

CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME

SEMICONDUCTOR DEVICE PACKAGE, ELECTRONIC ASSEMBLY AND METHOD FOR MA...

Inductive Position Sensor for Electronic Throttle Control

EXTENDED PAD AREA TO PREVENT PRINTED CIRCUIT BOARD DAMAGE

PCB PRODUCTION BY LASER SYSTEMS

OPTICAL LIGHT EMITTING DEVICE, MANUFACTURING METHOD THEREOF, AND OP...

SURFACE MOUNT HAPTIC ACTUATOR

MODULAR POWER ELECTRONICS CONVERTERS WITH ENHANCED CONNECTIVITY REL...