Suspending or supporting devices for articles to be coated

Industry

CPC
C25D17/06

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Parent Industries

CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating

Current Industry

C25D17/06Suspending or supporting devices for articles to be coated

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate holding and locking system for chemical and/or electrolyt...
- Patent number 11,965,263
- Issue date Apr 23, 2024
- SEMSYSCO GMBH
- Herbert Ötzlinger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Portable and modular production electroplating system
- Patent number 11,939,690
- Issue date Mar 26, 2024
- Snap-on Incorporated
- Kraig A. Tabor
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for forming metal film
- Patent number 11,932,957
- Issue date Mar 19, 2024
- Toyota Jidosha Kabushiki Kaisha
- Haruki Kondoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 11,926,920
- Issue date Mar 12, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Zhaowei Jia
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for fixturing a gas turbine engine component for an electrop...
- Patent number 11,926,919
- Issue date Mar 12, 2024
- CHROMALLOY GAS TURBINE LLC
- James Whitton
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Detection of contact formation between a substrate and contact pins...
- Patent number 11,920,254
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for plating of tubular workpiece
- Patent number 11,905,612
- Issue date Feb 20, 2024
- Japan Aviation Electronics Industry, Limited
- Takeharu Naito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Maintenance member, substrate holding module, plating apparatus, an...
- Patent number 11,905,611
- Issue date Feb 20, 2024
- Ebara Corporation
- Masayuki Satake
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroforming system and method
- Patent number 11,898,260
- Issue date Feb 13, 2024
- Unison Industries, LLC
- Ashwini Sameer Wadhavkar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Holding apparatus
- Patent number 11,891,714
- Issue date Feb 6, 2024
- C. Uyemura & Co., Ltd.
- Daisuke Matsuyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device manufacturing jig and method for manufacturing...
- Patent number 11,891,713
- Issue date Feb 6, 2024
- Kabushiki Kaisha Toshiba
- Takeyuki Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus
- Patent number 11,859,303
- Issue date Jan 2, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Zhaowei Jia
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for continuously applying nanolaminate metal c...
- Patent number 11,851,781
- Issue date Dec 26, 2023
- Modumetal, Inc.
- Christina A. Lomasney
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Plating membrane
- Patent number 11,814,743
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Hsiang Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
System and method for coating thin elongate parts
- Patent number 11,761,111
- Issue date Sep 19, 2023
- SST Systems, Inc.
- Bradley M. Andreae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electronic device including thin housing, and manufacturing method...
- Patent number 11,744,028
- Issue date Aug 29, 2023
- Samsung Electronics Co., Ltd.
- Seung Chang Baek
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Paddle, plating apparatus equipped with the paddle, and plating method
- Patent number 11,717,796
- Issue date Aug 8, 2023
- Ebara Corporation
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate transfer device
- Patent number 11,707,834
- Issue date Jul 25, 2023
- BOE Technology Group Co., Ltd.
- Chengfei Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition sequence for the filling of cobalt lined f...
- Patent number 11,699,590
- Issue date Jul 11, 2023
- Lam Research Corporation
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder
- Patent number 11,697,886
- Issue date Jul 11, 2023
- Ebara Corporation
- Matsutaro Miyamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Leak check method, leak check apparatus, plating method, and platin...
- Patent number 11,686,647
- Issue date Jun 27, 2023
- Ebara Corporation
- Kiyoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Regulation plate, anode holder, and substrate holder
- Patent number 11,686,009
- Issue date Jun 27, 2023
- Ebara Corporation
- Naoki Shimomura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder
- Patent number 11,676,837
- Issue date Jun 13, 2023
- Ebara Corporation
- Matsutaro Miyamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Contact structure, substrate holder, apparatus for plating, and met...
- Patent number 11,668,018
- Issue date Jun 6, 2023
- Ebara Corporation
- Matsutaro Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system, controller and method using test opera...
- Patent number 11,661,669
- Issue date May 30, 2023
- Ebara Corporation
- Kazuma Ideguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic stripping agent for jig
- Patent number 11,649,558
- Issue date May 16, 2023
- Okuno Chemical Industries Co., Ltd.
- Yusuke Yoshikane
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for electrochemically processing semiconductor substrates
- Patent number 11,643,744
- Issue date May 9, 2023
- SPTS Technologies Limited
- John Macneil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for fixturing a gas turbine engine component for an electrop...
- Patent number 11,629,424
- Issue date Apr 18, 2023
- CHROMALLOY GAS TURBINE LLC
- James Whitton
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for uniformly metallization on substrate
- Patent number 11,629,425
- Issue date Apr 18, 2023
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for controlling substrate approach toward a tar...
- Patent number 11,621,187
- Issue date Apr 4, 2023
- Lam Research Corporation
- Douglas Hill
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Growth of Nanowires
- Publication number 20240141542
- Publication date May 2, 2024
- NanoWired GmbH
- Olav Birlem
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ANODIZING APPARATUS
- Publication number 20240141536
- Publication date May 2, 2024
- DAEGU GYEONGBUK INSTITUTE OF SCIENCE & TECHNOLOGY
- Su Il IN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INSTALLATION AND METHOD FOR ELECTROPLATING WITH ACTIVE INTERCELL BARS
- Publication number 20240113308
- Publication date Apr 4, 2024
- Felix PRADO PUEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPATIALLY AND DIMENSIONALLY NON-UNIFORM CHANNELLED PLATE FOR TAILOR...
- Publication number 20240076795
- Publication date Mar 7, 2024
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROFORMING SYSTEM AND METHOD
- Publication number 20240060200
- Publication date Feb 22, 2024
- Ashwini Sameer Wadhavkar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CUP-SHAPED CHUCK OF SUBSTRATE HOLDING DEVICE AND SUBSTRATE HOLDING...
- Publication number 20240035189
- Publication date Feb 1, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING MEMBRANE
- Publication number 20240018685
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Hsiang CHEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER, APPARATUS FOR PLATING, AND METHOD OF PLATING
- Publication number 20240003038
- Publication date Jan 4, 2024
- EBARA CORPORATION
- NAOTO TAKAHASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER, APPARATUS FOR PLATING, AND METHOD OF MANUFACTURIN...
- Publication number 20230383431
- Publication date Nov 30, 2023
- EBARA CORPORATION
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20230374691
- Publication date Nov 23, 2023
- ACM Research (Shanghai) Inc.
- Hui Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20230366120
- Publication date Nov 16, 2023
- EBARA CORPORATION
- Masashi SHIMOYAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20230340688
- Publication date Oct 26, 2023
- EBARA CORPORATION
- Tsubasa ISHII
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND CLEANING METHOD OF CONTACT MEMBER OF PLATING...
- Publication number 20230340687
- Publication date Oct 26, 2023
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FINISHING SYSTEM
- Publication number 20230332321
- Publication date Oct 19, 2023
- SST SYSTEMS, INC.
- Anthony E. Herbst
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
PLATING APPARATUS AND AIR BUBBLE REMOVING METHOD OF PLATING APPARATUS
- Publication number 20230295829
- Publication date Sep 21, 2023
- EBARA CORPORATION
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...
- Publication number 20230298894
- Publication date Sep 21, 2023
- LAM RESEARCH CORPORATION
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20230279579
- Publication date Sep 7, 2023
- EBARA CORPORATION
- Tsubasa ISHII
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER
- Publication number 20230268209
- Publication date Aug 24, 2023
- EBARA CORPORATION
- Matsutaro MIYAMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING FRAME UNIT FOR HOLDING A SUBSTRATE IN A CHEMICAL AND/OR ELE...
- Publication number 20230265577
- Publication date Aug 24, 2023
- Semsysco GmbH
- Andreas Gleissner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Systems and Methods for Controlling Substrate Approach Toward a Tar...
- Publication number 20230245917
- Publication date Aug 3, 2023
- LAM RESEARCH CORPORATION
- Douglas Hill
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DISTRIBUTION SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTRO...
- Publication number 20230193503
- Publication date Jun 22, 2023
- Semsysco GmbH
- Andreas GLEISSNER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20230193501
- Publication date Jun 22, 2023
- EBARA CORPORATION
- Yasuyuki MASUDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Fixturing a Gas Turbine Engine Component for an Electrop...
- Publication number 20230183878
- Publication date Jun 15, 2023
- CHROMALLOY GAS TURBINE LLC
- James Whitton
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER, PLATING APPARATUS AND METHOD FOR MANAGING SUBSTRA...
- Publication number 20230175163
- Publication date Jun 8, 2023
- EBARA CORPORATION
- Masayuki FUJIKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WETTING METHOD FOR SUBSTRATE AND PLATING APPARATUS
- Publication number 20230167572
- Publication date Jun 1, 2023
- EBARA CORPORATION
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR PLATING AND METHOD OF CONTROLLING APPARATUS FOR PLATING
- Publication number 20230160089
- Publication date May 25, 2023
- EBARA CORPORATION
- Yasuyuki MASUDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND AIR BUBBLE REMOVING METHOD
- Publication number 20230151508
- Publication date May 18, 2023
- EBARA CORPORATION
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20230151507
- Publication date May 18, 2023
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SYSTEM INCLUDING AN IMPROVED BASE STRUCTURE
- Publication number 20230146080
- Publication date May 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Sheng Lai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL THREE-DIMENSIONAL PRINTING AND SOLDERING
- Publication number 20230129434
- Publication date Apr 27, 2023
- University of South Florida
- Arash Takshi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Suspending or supporting devices for articles to be coated

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate holding and locking system for chemical and/or electrolyt...

Portable and modular production electroplating system

Method for forming metal film

Electroplating apparatus and electroplating method

Method for fixturing a gas turbine engine component for an electrop...

Detection of contact formation between a substrate and contact pins...

Method for plating of tubular workpiece

Maintenance member, substrate holding module, plating apparatus, an...

Electroforming system and method

Holding apparatus

Semiconductor device manufacturing jig and method for manufacturing...

Plating apparatus

Method and apparatus for continuously applying nanolaminate metal c...

Plating membrane

System and method for coating thin elongate parts

Electronic device including thin housing, and manufacturing method...

Paddle, plating apparatus equipped with the paddle, and plating method

Substrate transfer device

Copper electrodeposition sequence for the filling of cobalt lined f...

Substrate holder

Leak check method, leak check apparatus, plating method, and platin...

Regulation plate, anode holder, and substrate holder

Substrate holder

Contact structure, substrate holder, apparatus for plating, and met...

Substrate processing system, controller and method using test opera...

Electrolytic stripping agent for jig

Apparatus for electrochemically processing semiconductor substrates

System for fixturing a gas turbine engine component for an electrop...

Method and apparatus for uniformly metallization on substrate

Systems and methods for controlling substrate approach toward a tar...

Patents Applicationslast 30 patents

Growth of Nanowires

ANODIZING APPARATUS

INSTALLATION AND METHOD FOR ELECTROPLATING WITH ACTIVE INTERCELL BARS

SPATIALLY AND DIMENSIONALLY NON-UNIFORM CHANNELLED PLATE FOR TAILOR...

ELECTROFORMING SYSTEM AND METHOD

CUP-SHAPED CHUCK OF SUBSTRATE HOLDING DEVICE AND SUBSTRATE HOLDING...

PLATING MEMBRANE

SUBSTRATE HOLDER, APPARATUS FOR PLATING, AND METHOD OF PLATING

SUBSTRATE HOLDER, APPARATUS FOR PLATING, AND METHOD OF MANUFACTURIN...

PLATING APPARATUS AND PLATING METHOD

PLATING APPARATUS

PLATING APPARATUS

PLATING APPARATUS AND CLEANING METHOD OF CONTACT MEMBER OF PLATING...

FINISHING SYSTEM

PLATING APPARATUS AND AIR BUBBLE REMOVING METHOD OF PLATING APPARATUS

COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...

PLATING APPARATUS

SUBSTRATE HOLDER

PLATING FRAME UNIT FOR HOLDING A SUBSTRATE IN A CHEMICAL AND/OR ELE...

Systems and Methods for Controlling Substrate Approach Toward a Tar...

DISTRIBUTION SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTRO...

PLATING APPARATUS AND PLATING METHOD

Method for Fixturing a Gas Turbine Engine Component for an Electrop...

SUBSTRATE HOLDER, PLATING APPARATUS AND METHOD FOR MANAGING SUBSTRA...

WETTING METHOD FOR SUBSTRATE AND PLATING APPARATUS

APPARATUS FOR PLATING AND METHOD OF CONTROLLING APPARATUS FOR PLATING

PLATING APPARATUS AND AIR BUBBLE REMOVING METHOD

PLATING APPARATUS

ELECTROPLATING SYSTEM INCLUDING AN IMPROVED BASE STRUCTURE

ELECTROCHEMICAL THREE-DIMENSIONAL PRINTING AND SOLDERING