TREA

Suspending or supporting devices for articles to be coated

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  • CPC
  • C25D17/06
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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating

Current Industry

C25D17/06Suspending or supporting devices for articles to be coated
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SUBSTRATE PROCESSING METHOD
    • Publication number 20240376625
    • Publication date Nov 14, 2024
    • ACM RESEARCH (SHANGHAI), INC.
    • Meng Wu
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240368800
    • Publication date Nov 7, 2024
    • EBARA CORPORATION
    • Shigeyuki NAKAHAMA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240318346
    • Publication date Sep 26, 2024
    • EBARA CORPORATION
    • Shinji OMATA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240301582
    • Publication date Sep 12, 2024
    • EBARA CORPORATION
    • Yohei WAKUDA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ELECTRODEPOSITION APPARATUS AND METHOD FOR ELECTRODEPOSITION
    • Publication number 20240301583
    • Publication date Sep 12, 2024
    • Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    • Jinyang ZHAO
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ELECTROPLATING DEVICE AND ELECTROPLATING METHOD
    • Publication number 20240279838
    • Publication date Aug 22, 2024
    • ACM RESEARCH (SHANGHAI), INC.
    • Hui Wang
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    RESISTOR AND PLATING APPARATUS
    • Publication number 20240279837
    • Publication date Aug 22, 2024
    • EBARA CORPORATION
    • Ryosuke Hiwatashi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240271313
    • Publication date Aug 15, 2024
    • EBARA CORPORATION
    • Masaki TOMITA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240247395
    • Publication date Jul 25, 2024
    • EBARA CORPORATION
    • Masaki Tomita
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    LEAKAGE DETERMINATION METHOD AND PLATING APPARATUS
    • Publication number 20240247396
    • Publication date Jul 25, 2024
    • EBARA CORPORATION
    • Masaki TOMITA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS AND CONTACT CLEANING METHOD
    • Publication number 20240218552
    • Publication date Jul 4, 2024
    • EBARA CORPORATION
    • Kentaro YAMAMOTO
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240218553
    • Publication date Jul 4, 2024
    • EBARA CORPORATION
    • Masashi SHIMOYAMA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PORTABLE AND MODULAR PRODUCTION ELECTROPLATING SYSTEM
    • Publication number 20240209541
    • Publication date Jun 27, 2024
    • Snap-on Incorporated
    • Kraig A. Tabor
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS AND SUBSTRATE CLEANING METHOD
    • Publication number 20240209538
    • Publication date Jun 27, 2024
    • EBARA CORPORATION
    • Kentaro YAMAMOTO
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240209539
    • Publication date Jun 27, 2024
    • EBARA CORPORATION
    • Masaki TOMITA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    System for Securing Component for an Electrically-Driven Process
    • Publication number 20240191386
    • Publication date Jun 13, 2024
    • CHROMALLOY GAS TURBINE LLC
    • James Whitton
    • B33 - ADDITIVE MANUFACTURING TECHNOLOGY
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240183057
    • Publication date Jun 6, 2024
    • EBARA CORPORATION
    • Shigeyuki NAKAHAMA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240183056
    • Publication date Jun 6, 2024
    • EBARA CORPORATION
    • Masaki TOMITA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
    • Publication number 20240183051
    • Publication date Jun 6, 2024
    • ACM Research (Shanghai) Inc.
    • Zhaowei JIA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240175165
    • Publication date May 30, 2024
    • EBARA CORPORATION
    • Masaki Tomita
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    DETECTION OF CONTACT FORMATION BETWEEN A SUBSTRATE AND CONTACT PINS...
    • Publication number 20240167188
    • Publication date May 23, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Yung Chang HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Growth of Nanowires
    • Publication number 20240141542
    • Publication date May 2, 2024
    • NanoWired GmbH
    • Olav Birlem
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ANODIZING APPARATUS
    • Publication number 20240141536
    • Publication date May 2, 2024
    • DAEGU GYEONGBUK INSTITUTE OF SCIENCE & TECHNOLOGY
    • Su Il IN
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    INSTALLATION AND METHOD FOR ELECTROPLATING WITH ACTIVE INTERCELL BARS
    • Publication number 20240113308
    • Publication date Apr 4, 2024
    • Felix PRADO PUEO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SPATIALLY AND DIMENSIONALLY NON-UNIFORM CHANNELLED PLATE FOR TAILOR...
    • Publication number 20240076795
    • Publication date Mar 7, 2024
    • LAM RESEARCH CORPORATION
    • Stephen J. Banik
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ELECTROFORMING SYSTEM AND METHOD
    • Publication number 20240060200
    • Publication date Feb 22, 2024
    • Ashwini Sameer Wadhavkar
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    CUP-SHAPED CHUCK OF SUBSTRATE HOLDING DEVICE AND SUBSTRATE HOLDING...
    • Publication number 20240035189
    • Publication date Feb 1, 2024
    • ACM RESEARCH (SHANGHAI), INC.
    • Hui Wang
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING MEMBRANE
    • Publication number 20240018685
    • Publication date Jan 18, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yung-Hsiang CHEN
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    SUBSTRATE HOLDER, APPARATUS FOR PLATING, AND METHOD OF PLATING
    • Publication number 20240003038
    • Publication date Jan 4, 2024
    • EBARA CORPORATION
    • NAOTO TAKAHASHI
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    SUBSTRATE HOLDER, APPARATUS FOR PLATING, AND METHOD OF MANUFACTURIN...
    • Publication number 20230383431
    • Publication date Nov 30, 2023
    • EBARA CORPORATION
    • Yasuyuki Masuda
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR