Sweep

Industry

CPC
H01L2924/3862

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/3862Sweep

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package having multi-layer molding compound an...
- Patent number 11,961,778
- Issue date Apr 16, 2024
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scribe seals and methods of making
- Patent number 11,069,627
- Issue date Jul 20, 2021
- Texas Instruments Incorporated
- Thomas D. Bonifield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Screening methodology to eliminate wire sweep in bond and assembly...
- Patent number 10,605,850
- Issue date Mar 31, 2020
- International Business Machines Corporation
- Stephen Peter Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face down dual sided chip scale memory package
- Patent number 10,366,934
- Issue date Jul 30, 2019
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic-packaged semiconductor device having wires with polymerized...
- Patent number 10,199,348
- Issue date Feb 5, 2019
- Texas Instruments Incorporated
- Rongwei Zhang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,128,172
- Issue date Nov 13, 2018
- RENESAS ELECTRONICS CORPORATION
- Yuichiro Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with coated bonding wires and fabrication met...
- Patent number 10,037,936
- Issue date Jul 31, 2018
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a first internal circuit, a second i...
- Patent number 9,917,037
- Issue date Mar 13, 2018
- RENESAS ELECTRONICS CORPORATION
- Yuichiro Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion-resistant copper bonds to aluminum
- Patent number 9,646,950
- Issue date May 9, 2017
- Texas Instruments Incorporated
- Kejun Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Screening methodology to eliminate wire sweep in bond and assembly...
- Patent number 9,470,740
- Issue date Oct 18, 2016
- International Business Machines Corporation
- Stephen Peter Ayotte
- G01 - MEASURING TESTING
Information Patent Grant
Packaging a semiconductor device having wires with polymerized insu...
- Patent number 9,378,984
- Issue date Jun 28, 2016
- Texas Instruments Incorporated
- Rongwei Zhang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device with stacked semiconductor chips
- Patent number 9,177,941
- Issue date Nov 3, 2015
- PS4 Luxco S.A.R.L.
- Naohiro Handa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional structure for wiring formation
- Patent number 9,082,438
- Issue date Jul 14, 2015
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional structure in which wiring is provided on its surface
- Patent number 9,070,393
- Issue date Jun 30, 2015
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device reducing risks of a wire short-circuit and a w...
- Patent number 8,975,760
- Issue date Mar 10, 2015
- PS4 Luxco S.A.R.L.
- Shori Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,710,637
- Issue date Apr 29, 2014
- Renesas Electronics Corporation
- Yukinori Tashiro
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 8,691,630
- Issue date Apr 8, 2014
- ChipMOS Technologies Inc.
- Yu-Tang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with stacked semiconductor chips
- Patent number 8,610,288
- Issue date Dec 17, 2013
- Elpida Memory, Inc.
- Naohiro Handa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of assembling an integrated c...
- Patent number 8,536,717
- Issue date Sep 17, 2013
- Xilinx, Inc.
- Shin S. Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,525,306
- Issue date Sep 3, 2013
- Renesas Electronics Corporation
- Yukinori Tashiro
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
System on a chip with interleaved sets of pads
- Patent number 8,476,768
- Issue date Jul 2, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Ajay Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device and method for producing the...
- Patent number 7,969,021
- Issue date Jun 28, 2011
- Nippon Steel Corporation
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element and semiconductor device
- Patent number 7,911,045
- Issue date Mar 22, 2011
- Kabushiki Kaisha Toshiba
- Ryoji Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire sweep resistant semiconductor package and manufacturing method...
- Patent number 7,541,222
- Issue date Jun 2, 2009
- Stats Chippac Ltd.
- Sheila Rima C. Magno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor multi-chip package and fabrication method
- Patent number 7,298,032
- Issue date Nov 20, 2007
- Samsung Electronics Co., Ltd.
- Dong-Kuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing or eliminating semiconductor device wire sweep...
- Patent number 7,179,688
- Issue date Feb 20, 2007
- Kulicke and Soffa Industries, Inc.
- Rakesh Batish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for reducing or eliminating semiconductor device wire sweep
- Patent number 7,109,586
- Issue date Sep 19, 2006
- Kulicke and Soffa Industries, Inc.
- Rakesh Batish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for reducing or eliminating semiconductor device...
- Patent number 6,955,949
- Issue date Oct 18, 2005
- Kulicke & Soffa Investments, Inc.
- Rakesh Batish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wire protection and method therefor
- Patent number 6,211,574
- Issue date Apr 3, 2001
- Advanced Semiconductor Engineering Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold for ball grid array semiconductor package
- Patent number 5,971,734
- Issue date Oct 26, 1999
- Anam Semiconductor Inc.
- Young Yeob Moon
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDS FOR GALVANIC ISOLATION DEVICE
- Publication number 20240113155
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240047336
- Publication date Feb 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Ching-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING A ROUTABLE LEADFRAME
- Publication number 20230411170
- Publication date Dec 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- BRADLEY GLASSCOCK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Having Multi-Layer Molding Compound an...
- Publication number 20230101826
- Publication date Mar 30, 2023
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190051583
- Publication date Feb 14, 2019
- RENESAS ELECTRONICS CORPORATION
- Yuichiro IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180204788
- Publication date Jul 19, 2018
- RENESAS ELECTRONICS CORPORATION
- Yuichiro IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170309551
- Publication date Oct 26, 2017
- RENESAS ELECTRONICS CORPORATION
- Yuichiro IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20160372441
- Publication date Dec 22, 2016
- Fujitsu Limited
- Hiroshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORROSION-RESISTANT COPPER BONDS TO ALUMINUM
- Publication number 20160181225
- Publication date Jun 23, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Kejun Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCREENING METHODOLOGY TO ELIMINATE WIRE SWEEP IN BOND AND ASSEMBLY...
- Publication number 20140266242
- Publication date Sep 18, 2014
- International Business Machines Corporation
- Stephen Peter Ayotte
- G01 - MEASURING TESTING
Information Patent Application
THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE
- Publication number 20140183751
- Publication date Jul 3, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL STRUCTURE FOR WIRING FORMATION
- Publication number 20140182887
- Publication date Jul 3, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE WITH STACKED SEMICONDUCTOR CHIPS
- Publication number 20140091479
- Publication date Apr 3, 2014
- Elpida Memory, Inc.
- Naohiro HANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASTIC-PACKAGED SEMICONDUCTOR DEVICE HAVING WIRES WITH POLYMERIZED...
- Publication number 20130277816
- Publication date Oct 24, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF ASSEMBLING AN INTEGRATED C...
- Publication number 20130175709
- Publication date Jul 11, 2013
- Xilinx, Inc.
- Shin S. Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20130140686
- Publication date Jun 6, 2013
- CHIPMOS TECHNOLOGIES INC.
- Yu-Tang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE REDUCING RISKS OF A WIRE SHORT-CIRCUIT AND A W...
- Publication number 20130037941
- Publication date Feb 14, 2013
- Elpida Memory, Inc.
- Shori FUJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM ON A CHIP WITH INTERLEAVED SETS OF PADS
- Publication number 20130001790
- Publication date Jan 3, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Ajay Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120018859
- Publication date Jan 26, 2012
- RENESAS ELECTRONICS CORPORATION
- Yukinori TASHIRO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20110260337
- Publication date Oct 27, 2011
- Elpida Memory, Inc.
- Naohiro HANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20090045525
- Publication date Feb 19, 2009
- Kabushiki Kaisha Toshiba
- Ryoji MATSUSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090032972
- Publication date Feb 5, 2009
- Kabushiki Kaisha Toshiba
- Tadanobu OKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING SEPARATING INSULATING STRUCTURES ON WIRES...
- Publication number 20080296780
- Publication date Dec 4, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Cheol-joon Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING OR ELIMINATING SEMICONDUCTOR DEVICE WIRE SWEEP...
- Publication number 20070096342
- Publication date May 3, 2007
- Rakesh Batish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE SWEEP RESISTANT SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD...
- Publication number 20070063354
- Publication date Mar 22, 2007
- STATS ChipPAC Ltd.
- Sheila Rima C. Magno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire sweep resistant semiconductor package and manufacturing method...
- Publication number 20060043612
- Publication date Mar 2, 2006
- STATS ChipPAC Ltd.
- Sheila Rima C. Magno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System for reducing or eliminating semiconductor device wire sweep
- Publication number 20050224930
- Publication date Oct 13, 2005
- Rakesh Batish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for reducing or eliminating semiconductor device wire sweep...
- Publication number 20050121798
- Publication date Jun 9, 2005
- Kulicke & Soffa Investments, Inc.
- Rakesh Batish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for reducing or eliminating semiconductor device...
- Publication number 20050085019
- Publication date Apr 21, 2005
- Rakesh Batish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding wire
- Publication number 20040245320
- Publication date Dec 9, 2004
- Mesato Fukagaya
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package having multi-layer molding compound an...

Scribe seals and methods of making

Screening methodology to eliminate wire sweep in bond and assembly...

Face down dual sided chip scale memory package

Plastic-packaged semiconductor device having wires with polymerized...

Semiconductor device and method for manufacturing the same

Semiconductor package with coated bonding wires and fabrication met...

Semiconductor device including a first internal circuit, a second i...

Corrosion-resistant copper bonds to aluminum

Screening methodology to eliminate wire sweep in bond and assembly...

Packaging a semiconductor device having wires with polymerized insu...

Semiconductor device with stacked semiconductor chips

Three-dimensional structure for wiring formation

Three-dimensional structure in which wiring is provided on its surface

Semiconductor device reducing risks of a wire short-circuit and a w...

Semiconductor device and method of manufacturing the same

Semiconductor package structure and manufacturing method thereof

Semiconductor device with stacked semiconductor chips

Integrated circuit package and method of assembling an integrated c...

Semiconductor device and method of manufacturing the same

System on a chip with interleaved sets of pads

Bonding wire for semiconductor device and method for producing the...

Semiconductor element and semiconductor device

Wire sweep resistant semiconductor package and manufacturing method...

Semiconductor multi-chip package and fabrication method

Method for reducing or eliminating semiconductor device wire sweep...

System for reducing or eliminating semiconductor device wire sweep

System and method for reducing or eliminating semiconductor device...

Semiconductor package with wire protection and method therefor

Mold for ball grid array semiconductor package

Patents Applicationslast 30 patents

WIRE BONDS FOR GALVANIC ISOLATION DEVICE

ELECTRONIC PACKAGE

INTEGRATED CIRCUIT HAVING A ROUTABLE LEADFRAME

Semiconductor Device Package Having Multi-Layer Molding Compound an...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

CORROSION-RESISTANT COPPER BONDS TO ALUMINUM

SCREENING METHODOLOGY TO ELIMINATE WIRE SWEEP IN BOND AND ASSEMBLY...

THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE

THREE-DIMENSIONAL STRUCTURE FOR WIRING FORMATION

SEMICONDUCTOR DEVICE WITH STACKED SEMICONDUCTOR CHIPS

PLASTIC-PACKAGED SEMICONDUCTOR DEVICE HAVING WIRES WITH POLYMERIZED...

INTEGRATED CIRCUIT PACKAGE AND METHOD OF ASSEMBLING AN INTEGRATED C...

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE REDUCING RISKS OF A WIRE SHORT-CIRCUIT AND A W...

SYSTEM ON A CHIP WITH INTERLEAVED SETS OF PADS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

MEMORY DEVICES INCLUDING SEPARATING INSULATING STRUCTURES ON WIRES...

METHOD FOR REDUCING OR ELIMINATING SEMICONDUCTOR DEVICE WIRE SWEEP...

WIRE SWEEP RESISTANT SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD...

Wire sweep resistant semiconductor package and manufacturing method...

System for reducing or eliminating semiconductor device wire sweep

Method for reducing or eliminating semiconductor device wire sweep...

System and method for reducing or eliminating semiconductor device...

Bonding wire