Syringe

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CPC
H01L2224/76152

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/76152Syringe

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing an electrically conductive connection on a sub...
- Patent number 11,855,037
- Issue date Dec 26, 2023
- Karlsruher Institut für Technologie
- Uwe Bog
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming side wirings
- Patent number 7,807,561
- Issue date Oct 5, 2010
- Shinko Electric Industries Co., Ltd.
- Shigeru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus having side surface wiring
- Patent number 7,777,349
- Issue date Aug 17, 2010
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with pattern leads and method for manufacturi...
- Patent number 7,061,125
- Issue date Jun 13, 2006
- Samsung Electronics, Co. Ltd.
- Sung-Dae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module for chip card
- Patent number 6,769,619
- Issue date Aug 3, 2004
- Gemplus
- Michael Zafrany
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic module for chip card
- Patent number 6,435,414
- Issue date Aug 20, 2002
- Gemplus
- Michael Zafrany
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION ON A SUB...
- Publication number 20210358880
- Publication date Nov 18, 2021
- Karlsruher Institut für Technologie
- Uwe Bog
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A THREE-DIMENSIONAL ULTRAFINE POLYMER CONDUC...
- Publication number 20120298401
- Publication date Nov 29, 2012
- POSTECH Academy-Industry Foundation
- Jung Ho Je
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SIDE WIRINGS
- Publication number 20090023247
- Publication date Jan 22, 2009
- Shinko Electric Industries Co., Ltd.
- Shigeru MIZUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20090020889
- Publication date Jan 22, 2009
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20090020887
- Publication date Jan 22, 2009
- Shinko Electric Industries Co., Ltd.
- Shigeru MIZUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with pattern leads and method for manufacturi...
- Publication number 20040155322
- Publication date Aug 12, 2004
- Sung-Dae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module for chip card
- Publication number 20020125329
- Publication date Sep 12, 2002
- Michael Zafrany
- G06 - COMPUTING CALCULATING COUNTING

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing an electrically conductive connection on a sub...

Method for forming side wirings

Semiconductor apparatus having side surface wiring

Semiconductor package with pattern leads and method for manufacturi...

Electronic module for chip card

Electronic module for chip card

Patents Applicationslast 30 patents

METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION ON A SUB...

METHOD FOR FABRICATING A THREE-DIMENSIONAL ULTRAFINE POLYMER CONDUC...

METHOD FOR FORMING SIDE WIRINGS

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF

Semiconductor package with pattern leads and method for manufacturi...

Electronic module for chip card