TAB carriers beam leads

Industry

CPC
H01L2225/06579

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06579TAB carriers beam leads

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 11,979,987
- Issue date May 7, 2024
- Samsung Display Co., Ltd.
- Han-Sung Bae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Display device
- Patent number 11,874,569
- Issue date Jan 16, 2024
- Samsung Display Co., Ltd.
- Han Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 11,696,402
- Issue date Jul 4, 2023
- Samsung Display Co., Ltd.
- Han-Sung Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 11,457,531
- Issue date Sep 27, 2022
- Samsung Display Co., Ltd.
- Han-Sung Bae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Display device
- Patent number 11,347,120
- Issue date May 31, 2022
- Samsung Display Co., Ltd.
- Han Ho Park
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor structure
- Patent number 11,145,617
- Issue date Oct 12, 2021
- Winbond Electronics Corp.
- Yu-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structures for integrated device packages
- Patent number 11,127,716
- Issue date Sep 21, 2021
- Analog Devices International Unlimited Company
- Rigan McGeehan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack structure and method of fabricating the same
- Patent number 10,867,963
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,782,573
- Issue date Sep 22, 2020
- Samsung Display Co., Ltd.
- Han Ho Park
- G02 - OPTICS
Information Patent Grant
Electronic device
- Patent number 10,553,563
- Issue date Feb 4, 2020
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of ultrathin functional block by solid ph...
- Patent number 10,522,510
- Issue date Dec 31, 2019
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 10,461,042
- Issue date Oct 29, 2019
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 10,306,763
- Issue date May 28, 2019
- Samsung Display Co., Ltd.
- Han-Sung Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,303,017
- Issue date May 28, 2019
- Samsung Display Co., Ltd.
- Han Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,297,566
- Issue date May 21, 2019
- Winbond Electronics Corp.
- Yu-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer device for high heat flux applications and related me...
- Patent number 10,217,692
- Issue date Feb 26, 2019
- University of Virginia Patent Foundation
- Hossein Haj-Hariri
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Package-on-package structure and manufacturing method thereof
- Patent number 10,079,222
- Issue date Sep 18, 2018
- Powertech Technology Inc.
- Chien-Wei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 9,974,175
- Issue date May 15, 2018
- Samsung Display Co., Ltd.
- Han-Sung Bae
- G02 - OPTICS
Information Patent Grant
Three-dimensional hybrid packaging with through-silicon-vias and ta...
- Patent number 9,972,606
- Issue date May 15, 2018
- GLOBALFOUNDRIES Inc.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, electronic device including the same, and bonding me...
- Patent number 9,894,792
- Issue date Feb 13, 2018
- Samsung Display Co., Ltd.
- Han Sung Bae
- G02 - OPTICS
Information Patent Grant
Three-dimensional hybrid packaging with through-silicon-vias and ta...
- Patent number 9,741,695
- Issue date Aug 22, 2017
- GLOBALFOUNDRIES Inc.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile integrated circuit (IC) package comprising a plurality...
- Patent number 9,679,873
- Issue date Jun 13, 2017
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack structure using conductive film bridge adhesive technology
- Patent number 9,553,073
- Issue date Jan 24, 2017
- Lingsen Precision Industries, Ltd.
- Chien-Ko Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including face-to-face semiconducto...
- Patent number 9,269,695
- Issue date Feb 23, 2016
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes and structures for IC fabrication
- Patent number 9,224,641
- Issue date Dec 29, 2015
- Jayna Sheats
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for forming lead frame land grid array
- Patent number 9,099,317
- Issue date Aug 4, 2015
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ramp-stack chip package with variable chip spacing
- Patent number 9,082,632
- Issue date Jul 14, 2015
- Oracle International Corporation
- Michael H. S. Dayringer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes and structures for IC fabrication
- Patent number 8,928,118
- Issue date Jan 6, 2015
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor device assemblies including...
- Patent number 8,927,332
- Issue date Jan 6, 2015
- Micron Technology, Inc.
- Swee Seng Eric Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to fabricate integrated circuits by assembling components
- Patent number 8,889,482
- Issue date Nov 18, 2014
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...
- Publication number 20240284594
- Publication date Aug 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- Han-Sung BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACK STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20200294965
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20190371764
- Publication date Dec 5, 2019
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURES FOR INTEGRATED DEVICE PACKAGES
- Publication number 20190319011
- Publication date Oct 17, 2019
- Analog Devices Global Unlimited Company
- Rigan McGeehan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20190278125
- Publication date Sep 12, 2019
- SAMSUNG DISPLAY CO., LTD.
- Han Ho PARK
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20190221538
- Publication date Jul 18, 2019
- WINBOND ELECTRONICS CORP.
- Yu-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...
- Publication number 20180263116
- Publication date Sep 13, 2018
- SAMSUNG DISPLAY CO., LTD.
- Han-Sung BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20180226356
- Publication date Aug 9, 2018
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20180149901
- Publication date May 31, 2018
- SAMSUNG DISPLAY CO., LTD.
- Han Ho PARK
- G02 - OPTICS
Information Patent Application
HETEROGENEOUS INTEGRATION OF ULTRATHIN FUNCTIONAL BLOCK BY SOLID PH...
- Publication number 20180151541
- Publication date May 31, 2018
- Intel Corporation
- Kimin JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180138149
- Publication date May 17, 2018
- Powertech Technology Inc.
- Chien-Wei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL HYBRID PACKAGING WITH THROUGH-SILICON-VIAS AND TA...
- Publication number 20170271309
- Publication date Sep 21, 2017
- GLOBALFOUNDRIES INC.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT TRANSFER DEVICE FOR HIGH HEAT FLUX APPLICATIONS AND RELATED ME...
- Publication number 20170229375
- Publication date Aug 10, 2017
- University of Virginia Patent Foundation
- Hossein Haj-Hariri
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THREE-DIMENSIONAL HYBRID PACKAGING WITH THROUGH-SILICON-VIAS AND TA...
- Publication number 20170200698
- Publication date Jul 13, 2017
- GLOBAL FOUNDRIES Inc.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE INTEGRATED CIRCUIT (IC) PACKAGE COMPRISING A PLURALITY...
- Publication number 20160372446
- Publication date Dec 22, 2016
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Semiconductor Device, Sheet-Shaped Resin C...
- Publication number 20160240523
- Publication date Aug 18, 2016
- NITTO DENKO CORPORATION
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERY EXTREMELY THIN SEMICONDUCTOR PACKAGE
- Publication number 20140015117
- Publication date Jan 16, 2014
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RAMP-STACK CHIP PACKAGE WITH VARIABLE CHIP SPACING
- Publication number 20130299977
- Publication date Nov 14, 2013
- Oracle International Corporation
- Michael H. S. Dayringer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME LAND GRID ARRAY
- Publication number 20130234307
- Publication date Sep 12, 2013
- UTAC Thai Limited
- Somchai Nondhasittichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20130193561
- Publication date Aug 1, 2013
- TEREPAC CORPORATION
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING...
- Publication number 20130115734
- Publication date May 9, 2013
- Micron Technology, Inc.
- Swee Seng Eric Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIPS WITH DIFFERENT T...
- Publication number 20120302007
- Publication date Nov 29, 2012
- Elpida Memory, Inc.
- Mitsuaki KATAGIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging an Electronic Device
- Publication number 20120261814
- Publication date Oct 18, 2012
- ST-ERICSSON SA
- Nedialko Slavov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONALLY INTEGRATED SEMICONDUCTOR DEVICE AND ELECTRONIC...
- Publication number 20120181683
- Publication date Jul 19, 2012
- TAKAO YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A MICROELECTRONIC DEVICE AND A MICROELECTR...
- Publication number 20110266699
- Publication date Nov 3, 2011
- Commissariat a I'Energie Atomique et aux Energies Alternatives
- Thierry Hilt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ARRANGEMENT
- Publication number 20110233783
- Publication date Sep 29, 2011
- SIEMENS MEDICAL INSTRUMENTS PTE. LTD.
- Hock Peng Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING
- Publication number 20110147899
- Publication date Jun 23, 2011
- Frederick Rodriguez Dahilig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Connecting a Die Assembly to a Substrate in an Integrate...
- Publication number 20110097848
- Publication date Apr 28, 2011
- Alvin Seah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY MEMORY ASSEMBLY
- Publication number 20110051385
- Publication date Mar 3, 2011
- GAINTEAM HOLDINGS LIMITED
- Wei-hu Koh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENCAPSULANT INTERPOSER SYSTEM WITH INTEGRATED PASSIVE DEVICES AND M...
- Publication number 20110049687
- Publication date Mar 3, 2011
- Heap Hoe Kuan
- H01 - BASIC ELECTRIC ELEMENTS

TAB carriers beam leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component, electric device including the same, and bondi...

Display device

Electronic component, electric device including the same, and bondi...

Electronic component, electric device including the same, and bondi...

Display device

Semiconductor structure

Mounting structures for integrated device packages

Die stack structure and method of fabricating the same

Display device

Electronic device

Heterogeneous integration of ultrathin functional block by solid ph...

Semiconductor module

Electronic component, electric device including the same, and bondi...

Display device

Semiconductor structure and manufacturing method thereof

Heat transfer device for high heat flux applications and related me...

Package-on-package structure and manufacturing method thereof

Electronic component, electric device including the same, and bondi...

Three-dimensional hybrid packaging with through-silicon-vias and ta...

Display panel, electronic device including the same, and bonding me...

Three-dimensional hybrid packaging with through-silicon-vias and ta...

Low profile integrated circuit (IC) package comprising a plurality...

Chip stack structure using conductive film bridge adhesive technology

Semiconductor device assemblies including face-to-face semiconducto...

Processes and structures for IC fabrication

Method for forming lead frame land grid array

Ramp-stack chip package with variable chip spacing

Processes and structures for IC fabrication

Methods of manufacturing semiconductor device assemblies including...

Methods to fabricate integrated circuits by assembling components

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...

DIE STACK STRUCTURE AND METHOD OF FABRICATING THE SAME

ELECTRONIC DEVICE

MOUNTING STRUCTURES FOR INTEGRATED DEVICE PACKAGES

DISPLAY DEVICE

SEMICONDUCTOR STRUCTURE

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...

SEMICONDUCTOR MODULE

DISPLAY DEVICE

HETEROGENEOUS INTEGRATION OF ULTRATHIN FUNCTIONAL BLOCK BY SOLID PH...

PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

THREE-DIMENSIONAL HYBRID PACKAGING WITH THROUGH-SILICON-VIAS AND TA...

HEAT TRANSFER DEVICE FOR HIGH HEAT FLUX APPLICATIONS AND RELATED ME...

THREE-DIMENSIONAL HYBRID PACKAGING WITH THROUGH-SILICON-VIAS AND TA...

LOW PROFILE INTEGRATED CIRCUIT (IC) PACKAGE COMPRISING A PLURALITY...

Method for Manufacturing Semiconductor Device, Sheet-Shaped Resin C...

VERY EXTREMELY THIN SEMICONDUCTOR PACKAGE

RAMP-STACK CHIP PACKAGE WITH VARIABLE CHIP SPACING

LEAD FRAME LAND GRID ARRAY

Processes and structures for IC fabrication

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING...

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIPS WITH DIFFERENT T...

Packaging an Electronic Device

THREE-DIMENSIONALLY INTEGRATED SEMICONDUCTOR DEVICE AND ELECTRONIC...

METHOD FOR MANUFACTURING A MICROELECTRONIC DEVICE AND A MICROELECTR...

SUBSTRATE ARRANGEMENT

INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING

Method for Connecting a Die Assembly to a Substrate in an Integrate...

HIGH-DENSITY MEMORY ASSEMBLY

ENCAPSULANT INTERPOSER SYSTEM WITH INTEGRATED PASSIVE DEVICES AND M...