Tacky flux

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CPC
H05K2203/0485

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0485Tacky flux

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solderable conductive polymer thick film composition
- Patent number 9,986,650
- Issue date May 29, 2018
- Heracus Precious Metals North America Conshohocken LLC
- Samson Shahbazi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally decomposable polymer compositions for forming microelectr...
- Patent number 9,757,818
- Issue date Sep 12, 2017
- Promerus, LLC
- W. C. Peter Tsang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally decomposable polymer compositions for forming microelectr...
- Patent number 9,505,948
- Issue date Nov 29, 2016
- Promerus, LLC
- W. C. Peter Tsang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of mounting components on the prin...
- Patent number 9,345,133
- Issue date May 17, 2016
- Canon Kabushiki Kaisha
- Junnosuke Yokoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coated solder spheres and method for producing the same
- Patent number RE45537
- Issue date Jun 2, 2015
- Senju Metal Industry Co., Ltd.
- Daisuke Sohma
- 001 -
Information Patent Grant
Solder ball loading mask, apparatus and associated methodology
- Patent number 8,448,838
- Issue date May 28, 2013
- Ibiden Co., Ltd.
- Shigeki Sawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive ball mounting apparatus having a movable conductive ball...
- Patent number 8,299,628
- Issue date Oct 30, 2012
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming solder bumps on substrates
- Patent number 8,252,677
- Issue date Aug 28, 2012
- Intel Corporation
- Omar Bchir
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball loading mask, apparatus and associated methodology
- Patent number 8,157,157
- Issue date Apr 17, 2012
- Ibiden Co., Ltd.
- Shigeki Sawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connection and method of manufacturing the same
- Patent number 8,079,141
- Issue date Dec 20, 2011
- Sumitomo Bakelite Co., Ltd.
- Toru Meura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for production of electronic circuit board
- Patent number 8,038,051
- Issue date Oct 18, 2011
- Showa Denko K.K.
- Takekazu Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive ball mounting apparatus and conductive ball mounting method
- Patent number 7,900,807
- Issue date Mar 8, 2011
- Shinko Electric Industries Co., Ltd.
- Kiyoaki Iida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor ball mounting apparatus, conductor ball mounting method,...
- Patent number 7,866,534
- Issue date Jan 11, 2011
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder attach film and assembly
- Patent number 7,859,107
- Issue date Dec 28, 2010
- Amkor Technology, Inc.
- Min Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive ball mounting method and apparatus having a movable sold...
- Patent number 7,829,451
- Issue date Nov 9, 2010
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive ball mounting method
- Patent number 7,820,479
- Issue date Oct 26, 2010
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting chip component and circuit board
- Patent number 7,735,713
- Issue date Jun 15, 2010
- TDK Corporation
- Naruki Kataoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder attach film and method of forming solder ball using the same
- Patent number 7,718,523
- Issue date May 18, 2010
- Amkor Technology, Inc.
- Min Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive ball mounting apparatus and conductive ball mounting method
- Patent number 7,703,662
- Issue date Apr 27, 2010
- Shinko Electric Industries Co., Ltd.
- Kiyoaki Iida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microball attachment using self-assembly for substrate bumping
- Patent number 7,651,021
- Issue date Jan 26, 2010
- Intel Corporation
- Lakshmi Supriya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball mounting method and solder ball mounting apparatus
- Patent number 7,644,856
- Issue date Jan 12, 2010
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for placing conductive balls
- Patent number 7,614,541
- Issue date Nov 10, 2009
- Hitachi Metals, Ltd.
- Motoyuki Itoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method of mounting conductive ball
- Patent number 7,597,233
- Issue date Oct 6, 2009
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for soldering modules to substrates
- Patent number 7,569,474
- Issue date Aug 4, 2009
- Infineon Technologies AG
- Keng Lee Teo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball mounting method and solder ball mounting substrate manu...
- Patent number 7,514,351
- Issue date Apr 7, 2009
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming solder connection portions, method of forming wir...
- Patent number 7,507,655
- Issue date Mar 24, 2009
- Shinko Electric Industries, Co., Ltd.
- Hideaki Sakaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor attachment method
- Patent number 7,452,750
- Issue date Nov 18, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for placing conductive balls
- Patent number 7,431,792
- Issue date Oct 7, 2008
- Hitachi Metals, Ltd.
- Motoyuki Itoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming multi-layer bumps on a substrate
- Patent number 7,422,973
- Issue date Sep 9, 2008
- Freescale Semiconductor, Inc.
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for reducing stress between substrates of differing materials
- Patent number 7,413,110
- Issue date Aug 19, 2008
- Motorola, Inc.
- Vahid Goudarzi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240227089
- Publication date Jul 11, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240131633
- Publication date Apr 25, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE AND ELECTRONIC PART
- Publication number 20160066421
- Publication date Mar 3, 2016
- FUJITSU LIMITED
- Kazuhiro Kitamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE AND METHOD FOR PREPARING A HOUSING TO ACCEPT A COMPONENT...
- Publication number 20150319863
- Publication date Nov 5, 2015
- Dhananjaya Turpuseema
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERABLE CONDUCTIVE POLYMER THICK FILM COMPOSITION
- Publication number 20150257279
- Publication date Sep 10, 2015
- Heraeus Precious Metals North America Conshohocken LLC
- Samson Shahbazi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MOUNTING COMPONENTS ON THE PRIN...
- Publication number 20140318850
- Publication date Oct 30, 2014
- Junnosuke Yokoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Ball Loading Mask, Apparatus And Associated Methodology
- Publication number 20120080504
- Publication date Apr 5, 2012
- IBIDEN, CO., LTD.
- Shigeki Sawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Ball Loading Mask, Apparatus and Associated Methodology
- Publication number 20120080505
- Publication date Apr 5, 2012
- IBIDEN, CO., LTD.
- Shigeki Sawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BALL MOUNTING METHOD AND APPARATUS
- Publication number 20110023292
- Publication date Feb 3, 2011
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PROVIDING SOLDER CONNECTION, ELECTRONIC EQUIPMENT AND ME...
- Publication number 20100313416
- Publication date Dec 16, 2010
- SUMITOMO BAKELITE CO., LTD.
- Toru Meura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONDUCTIVE BALL MOUNTING APPARATUS AND CONDUCTIVE BALL MOUNTING METHOD
- Publication number 20100230469
- Publication date Sep 16, 2010
- Shinko Electric Industries Co., Ltd.
- Kiyoaki IIDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL IMPLANTATION METHOD AND SYSTEM APPLYING THE METHOD
- Publication number 20100163605
- Publication date Jul 1, 2010
- United Test Center Inc.
- Shiann-Tsong Tsai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING CONDUCTIVE CIRCUIT BOARD
- Publication number 20100038411
- Publication date Feb 18, 2010
- Showa Denko K.K.
- Takashi Shoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting integrated circuit components on substrates
- Publication number 20090294515
- Publication date Dec 3, 2009
- Edward R. Prack
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BALL LOADING MASK, APPARATUS AND ASSOCIATED METHODOLOGY
- Publication number 20090294516
- Publication date Dec 3, 2009
- IBIDEN, CO., LTD.
- Shigeki Sawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BALL MOUNTING APPARATUS AND WIRING BOARD MANUFACTURING METHOD
- Publication number 20090283574
- Publication date Nov 19, 2009
- Ryuichi OKAZAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD OF SOLDER CIRCUIT BOARD
- Publication number 20090261148
- Publication date Oct 22, 2009
- SHOWA DENKO K.K.
- Takashi Shoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROBALL ATTACHMENT USING SELF-ASSEMBLY FOR SUBSTRATE BUMPING
- Publication number 20090166396
- Publication date Jul 2, 2009
- Lakshmi SUPRIYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING SOLDER BUMPS ON SUBSTRATES
- Publication number 20090085206
- Publication date Apr 2, 2009
- Intel Corporation
- Omar Bchir
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD OF MOUNTING CONDUCTIVE BALL
- Publication number 20090026247
- Publication date Jan 29, 2009
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BALL MOUNTING METHOD AND APPARATUS
- Publication number 20090023282
- Publication date Jan 22, 2009
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BALL MOUNTING METHOD
- Publication number 20090020591
- Publication date Jan 22, 2009
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR PLACING CONDUCTIVE BALLS
- Publication number 20090014502
- Publication date Jan 15, 2009
- Motoyuki Itoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTOR BALL MOUNTING APPARATUS, CONDUCTOR BALL MOUNTING METHOD,...
- Publication number 20090008433
- Publication date Jan 8, 2009
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BALL MOUNTING APPARATUS AND CONDUCTIVE BALL MOUNTING METHOD
- Publication number 20080217386
- Publication date Sep 11, 2008
- Shinko Electric Industries Co., Ltd.
- Kiyoaki IIDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BALL MOUNTING METHOD AND SOLDER BALL MOUNTING APPARATUS
- Publication number 20080105734
- Publication date May 8, 2008
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BALL MOUNTING METHOD AND SOLDER BALL MOUNTING SUBSTRATE MANU...
- Publication number 20080102620
- Publication date May 1, 2008
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Production of Electronic Circuit Board
- Publication number 20070284136
- Publication date Dec 13, 2007
- Takekazu Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING SOLDER CONNECTION PORTIONS, METHOD OF FORMING WIR...
- Publication number 20070234563
- Publication date Oct 11, 2007
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitor attachment method
- Publication number 20070202632
- Publication date Aug 30, 2007
- Wai Yew Lo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solderable conductive polymer thick film composition

Thermally decomposable polymer compositions for forming microelectr...

Thermally decomposable polymer compositions for forming microelectr...

Printed circuit board and method of mounting components on the prin...

Coated solder spheres and method for producing the same

Solder ball loading mask, apparatus and associated methodology

Conductive ball mounting apparatus having a movable conductive ball...

Method of forming solder bumps on substrates

Solder ball loading mask, apparatus and associated methodology

Electrical connection and method of manufacturing the same

Method for production of electronic circuit board

Conductive ball mounting apparatus and conductive ball mounting method

Conductor ball mounting apparatus, conductor ball mounting method,...

Solder attach film and assembly

Conductive ball mounting method and apparatus having a movable sold...

Conductive ball mounting method

Method for mounting chip component and circuit board

Solder attach film and method of forming solder ball using the same

Conductive ball mounting apparatus and conductive ball mounting method

Microball attachment using self-assembly for substrate bumping

Solder ball mounting method and solder ball mounting apparatus

Method and apparatus for placing conductive balls

Apparatus and method of mounting conductive ball

Method and apparatus for soldering modules to substrates

Solder ball mounting method and solder ball mounting substrate manu...

Method of forming solder connection portions, method of forming wir...

Capacitor attachment method

Method and apparatus for placing conductive balls

Method for forming multi-layer bumps on a substrate

Method for reducing stress between substrates of differing materials

Patents Applicationslast 30 patents

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

SOLDER PASTE AND ELECTRONIC PART

STRUCTURE AND METHOD FOR PREPARING A HOUSING TO ACCEPT A COMPONENT...

SOLDERABLE CONDUCTIVE POLYMER THICK FILM COMPOSITION

PRINTED CIRCUIT BOARD AND METHOD OF MOUNTING COMPONENTS ON THE PRIN...

Solder Ball Loading Mask, Apparatus And Associated Methodology

Solder Ball Loading Mask, Apparatus and Associated Methodology

CONDUCTIVE BALL MOUNTING METHOD AND APPARATUS

METHOD FOR PROVIDING SOLDER CONNECTION, ELECTRONIC EQUIPMENT AND ME...

CONDUCTIVE BALL MOUNTING APPARATUS AND CONDUCTIVE BALL MOUNTING METHOD

BALL IMPLANTATION METHOD AND SYSTEM APPLYING THE METHOD

METHOD OF PRODUCING CONDUCTIVE CIRCUIT BOARD

Mounting integrated circuit components on substrates

SOLDER BALL LOADING MASK, APPARATUS AND ASSOCIATED METHODOLOGY

SOLDER BALL MOUNTING APPARATUS AND WIRING BOARD MANUFACTURING METHOD

PRODUCTION METHOD OF SOLDER CIRCUIT BOARD

MICROBALL ATTACHMENT USING SELF-ASSEMBLY FOR SUBSTRATE BUMPING

METHOD OF FORMING SOLDER BUMPS ON SUBSTRATES

APPARATUS AND METHOD OF MOUNTING CONDUCTIVE BALL

CONDUCTIVE BALL MOUNTING METHOD AND APPARATUS

CONDUCTIVE BALL MOUNTING METHOD

METHOD AND APPARATUS FOR PLACING CONDUCTIVE BALLS

CONDUCTOR BALL MOUNTING APPARATUS, CONDUCTOR BALL MOUNTING METHOD,...

CONDUCTIVE BALL MOUNTING APPARATUS AND CONDUCTIVE BALL MOUNTING METHOD

SOLDER BALL MOUNTING METHOD AND SOLDER BALL MOUNTING APPARATUS

SOLDER BALL MOUNTING METHOD AND SOLDER BALL MOUNTING SUBSTRATE MANU...

Method for Production of Electronic Circuit Board

METHOD OF FORMING SOLDER CONNECTION PORTIONS, METHOD OF FORMING WIR...

Capacitor attachment method