taking regard of the pH-value of lapping agents

Industry

CPC
B24B37/0056

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/0056taking regard of the pH-value of lapping agents

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of polishing silicon wafer
- Patent number 11,890,719
- Issue date Feb 6, 2024
- Sumco Corporation
- Shuhei Matsuda
- B24 - GRINDING POLISHING
Information Patent Grant
Low-debris fluopolymer composite CMP polishing pad
- Patent number 11,638,978
- Issue date May 2, 2023
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Nan-Rong Chiou
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Cationic fluoropolymer composite polishing method
- Patent number 11,577,360
- Issue date Feb 14, 2023
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Matthew R. Gadinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluopolymer composite CMP polishing method
- Patent number 11,491,605
- Issue date Nov 8, 2022
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Matthew R. Gadinski
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing agent, stock solution for polishing agent, and polishing...
- Patent number 10,946,494
- Issue date Mar 16, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Masayuki Hanano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for polishing silicon wafer
- Patent number 10,460,947
- Issue date Oct 29, 2019
- Shin-Etsu Handotai Co., Ltd.
- Masanao Sasaki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing agent for synthetic quartz glass substrate
- Patent number 9,919,962
- Issue date Mar 20, 2018
- Shin-Etsu Chemical Co., Ltd.
- Daijitsu Harada
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method, polishing apparatus and GaN wafer
- Patent number 9,233,449
- Issue date Jan 12, 2016
- Osaka University
- Yasuhisa Sano
- B24 - GRINDING POLISHING
Information Patent Grant
Method of polishing object to be polished
- Patent number 9,033,764
- Issue date May 19, 2015
- NGK Insulators, Ltd.
- Kazumasa Kitamura
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing a semiconductor wafer
- Patent number 8,882,565
- Issue date Nov 11, 2014
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Tunable polish rates by varying dissolved oxygen content
- Patent number 8,778,203
- Issue date Jul 15, 2014
- Clarkson University
- P. R. Veera Dandu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing slurry and polishing method
- Patent number 8,696,929
- Issue date Apr 15, 2014
- Hitachi Chemical Co., Ltd.
- Yasushi Kurata
- B24 - GRINDING POLISHING
Information Patent Grant
CMP sensor and control system
- Patent number 8,460,507
- Issue date Jun 11, 2013
- Cabot Microelectronics Corporation
- Clifford Spiro
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad and method for polishing a semiconductor wafer
- Patent number 8,444,455
- Issue date May 21, 2013
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing liquid and polishing method
- Patent number 8,349,042
- Issue date Jan 8, 2013
- Asahi Glass Company, Limited
- Katsuaki Miyatani
- B24 - GRINDING POLISHING
Information Patent Grant
Method of polishing compound semiconductor substrate, compound semi...
- Patent number 8,133,815
- Issue date Mar 13, 2012
- Sumitomo Electric Industries, Ltd.
- Yoshio Mezaki
- B24 - GRINDING POLISHING
Information Patent Grant
Method for chemical mechanical polishing a substrate
- Patent number 8,119,529
- Issue date Feb 21, 2012
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Yi Guo
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing compound for semiconductor integrated circuit device, pol...
- Patent number 8,030,213
- Issue date Oct 4, 2011
- Asahi Glass Company, Limited
- Iori Yoshida
- B24 - GRINDING POLISHING
Information Patent Grant
Compositions and methods for dielectric CMP
- Patent number 7,677,956
- Issue date Mar 16, 2010
- Cabot Microelectronics Corporation
- Phillip Carter
- B24 - GRINDING POLISHING
Information Patent Grant
CMP process
- Patent number 7,510,974
- Issue date Mar 31, 2009
- United Microelectronics Corp.
- Chih-Yueh Li
- B24 - GRINDING POLISHING
Information Patent Grant
Fixed-abrasive chemical-mechanical planarization of titanium nitride
- Patent number 7,402,094
- Issue date Jul 22, 2008
- Micron Technology, Inc.
- Dinesh Chopra
- B24 - GRINDING POLISHING
Information Patent Grant
Electrolyte with good planarization capability, high removal rate a...
- Patent number 7,384,534
- Issue date Jun 10, 2008
- Applied Materials, Inc.
- Lizhong Sun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for planarizing microelectronic devices with Ge...
- Patent number 7,381,647
- Issue date Jun 3, 2008
- Micron Technology, Inc.
- Nagasubramaniyan Chandrasekaran
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing fluid and polishing method
- Patent number 7,367,870
- Issue date May 6, 2008
- Hitachi Chemical Co. Ltd.
- Yasushi Kurata
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing a substrate surface
- Patent number 7,323,414
- Issue date Jan 29, 2008
- Crystal IS, Inc.
- Leo J. Schowalter
- B24 - GRINDING POLISHING
Information Patent Grant
Method and composition for polishing a substrate
- Patent number 7,232,514
- Issue date Jun 19, 2007
- Applied Materials, Inc.
- Feng Q. Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hydrogen bubble reduction on the cathode using double-cell designs
- Patent number 7,229,535
- Issue date Jun 12, 2007
- Applied Materials, Inc.
- Yan Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for controlling pH during planarization and cleaning of micr...
- Patent number 7,214,125
- Issue date May 8, 2007
- Micron Technology, Inc.
- Judson R. Sharples
- B24 - GRINDING POLISHING
Information Patent Grant
Powder for disks
- Patent number 7,201,639
- Issue date Apr 10, 2007
- Hitachi Global Storage Technologies Netherlands B.V.
- Patrick Michael McCaffrey
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and method of polishing work piece
- Patent number 7,195,546
- Issue date Mar 27, 2007
- Fujikoshi Machinery Corp.
- Toshiro Doi
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD
- Publication number 20240087963
- Publication date Mar 14, 2024
- EBARA CORPORATION
- Akira FUKUNAGA
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POL...
- Publication number 20240051079
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Eunkyoung Kim
- G05 - CONTROLLING REGULATING
Information Patent Application
SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD
- Publication number 20210166967
- Publication date Jun 3, 2021
- EBARA CORPORATION
- Akira FUKUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-DEBRIS FLUOPOLYMER COMPOSITE CMP POLISHING PAD
- Publication number 20200384603
- Publication date Dec 10, 2020
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Nan-Rong Chiou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FLUOPOLYMER COMPOSITE CMP POLISHING METHOD
- Publication number 20200384602
- Publication date Dec 10, 2020
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Matthew R. Gadinski
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CATIONIC FLUOROPOLYMER COMPOSITE POLISHING METHOD
- Publication number 20200384605
- Publication date Dec 10, 2020
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Matthew R. Gadinski
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF POLISHING SILICON WAFER
- Publication number 20200306922
- Publication date Oct 1, 2020
- SUMCO CORPORATION
- Shuhei MATSUDA
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY AND POLISHING METHOD
- Publication number 20200016721
- Publication date Jan 16, 2020
- Hitachi Chemical Company, Ltd.
- Mayumi OOUCHI
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING SILICON WAFER
- Publication number 20170345662
- Publication date Nov 30, 2017
- Shin-Etsu Handotai Co., Ltd.
- Masanao SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR JUDGING POLISHING PERFORMANCE OF POLISHING...
- Publication number 20150346088
- Publication date Dec 3, 2015
- EBARA CORPORATION
- Chikako TAKATOH
- G01 - MEASURING TESTING
Information Patent Application
Tunable Polish Rates By Varying Dissolved Oxygen Content
- Publication number 20140299271
- Publication date Oct 9, 2014
- Clarkson University
- P.R. Veera Dandu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Polishing Pad and Method For Polishing A Semiconductor Wafer
- Publication number 20130157543
- Publication date Jun 20, 2013
- Siltronic AG
- Juergen Schwandner
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF POLISHING OBJECT TO BE POLISHED AND POLISHING PAD
- Publication number 20120064803
- Publication date Mar 15, 2012
- NGK Insulators, Ltd.
- Kazumasa Kitamura
- B24 - GRINDING POLISHING
Information Patent Application
Polishing method, polishing apparatus and GaN wafer
- Publication number 20120001193
- Publication date Jan 5, 2012
- Yasuhisa Sano
- B24 - GRINDING POLISHING
Information Patent Application
Tunable Polish Rates By Varying Dissolved Oxygen Content
- Publication number 20110294404
- Publication date Dec 1, 2011
- Clarkson University
- P.R. Veera Dandu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR POLISHING A SEMICONDUCTOR WAFER
- Publication number 20110244760
- Publication date Oct 6, 2011
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Application
Methods and Systems for Retaining Grinding Efficiency During Backgr...
- Publication number 20110201260
- Publication date Aug 18, 2011
- SEMATECH, Inc.
- Sharath Hosali
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING LIQUID AND POLISHING METHOD
- Publication number 20110175018
- Publication date Jul 21, 2011
- ASAHI GLASS COMPANY, LIMITED
- Katsuaki MIYATANI
- B24 - GRINDING POLISHING
Information Patent Application
Polishing Pad and Method For Polishing A Semiconductor Wafer
- Publication number 20100330882
- Publication date Dec 30, 2010
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Application
Method for chemical mechanical polishing a substrate
- Publication number 20100279507
- Publication date Nov 4, 2010
- Yi Guo
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING AGENT FOR SYNTHETIC QUARTZ GLASS SUBSTRATE
- Publication number 20100243950
- Publication date Sep 30, 2010
- Daijitsu Harada
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING COMPOSITION
- Publication number 20100190413
- Publication date Jul 29, 2010
- Kazuhiko NISHIMOTO
- B24 - GRINDING POLISHING
Information Patent Application
CMP SENSOR AND CONTROL SYSTEM
- Publication number 20100187200
- Publication date Jul 29, 2010
- Clifford Spiro
- B24 - GRINDING POLISHING
Information Patent Application
WATER-BASED POLISHING SLURRY FOR POLISHING SILICON CARBIDE SINGLE C...
- Publication number 20100092366
- Publication date Apr 15, 2010
- Showa Denko K.K.
- Hisao Kogoi
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD OF RECYCLING ABRASIVE SLURRY
- Publication number 20090053981
- Publication date Feb 26, 2009
- SUMCO TECHXIV CORPORATION
- Kazuaki Kozasa
- B24 - GRINDING POLISHING
Information Patent Application
Method of Polishing Compound Semiconductor Substrate, Compound Semi...
- Publication number 20080299350
- Publication date Dec 4, 2008
- Sumitomo Electric Industries, Ltd.
- Yoshio Mezaki
- B24 - GRINDING POLISHING
Information Patent Application
Compositions, methods and systems for polishing aluminum oxide and...
- Publication number 20080283502
- Publication date Nov 20, 2008
- Kevin Moeggenborg
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING METHOD AND APPARATUS FOR REDUCING MAT...
- Publication number 20080242106
- Publication date Oct 2, 2008
- Anuj Sarveshwar Narain
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING COMPOUND FOR SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, POL...
- Publication number 20080070412
- Publication date Mar 20, 2008
- ASAHI GLASS COMPANY, LIMITED
- Iori Yoshida
- B24 - GRINDING POLISHING
Information Patent Application
DUAL REDUCED AGENTS FOR BARRIER REMOVAL IN CHEMICAL MECHANICAL POLI...
- Publication number 20080045021
- Publication date Feb 21, 2008
- Stan D. Tsai
- B24 - GRINDING POLISHING

taking regard of the pH-value of lapping agents

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of polishing silicon wafer

Low-debris fluopolymer composite CMP polishing pad

Cationic fluoropolymer composite polishing method

Fluopolymer composite CMP polishing method

Polishing agent, stock solution for polishing agent, and polishing...

Method for polishing silicon wafer

Polishing agent for synthetic quartz glass substrate

Polishing method, polishing apparatus and GaN wafer

Method of polishing object to be polished

Method for polishing a semiconductor wafer

Tunable polish rates by varying dissolved oxygen content

Polishing slurry and polishing method

CMP sensor and control system

Polishing pad and method for polishing a semiconductor wafer

Polishing liquid and polishing method

Method of polishing compound semiconductor substrate, compound semi...

Method for chemical mechanical polishing a substrate

Polishing compound for semiconductor integrated circuit device, pol...

Compositions and methods for dielectric CMP

CMP process

Fixed-abrasive chemical-mechanical planarization of titanium nitride

Electrolyte with good planarization capability, high removal rate a...

Methods and systems for planarizing microelectronic devices with Ge...

Polishing fluid and polishing method

Method for polishing a substrate surface

Method and composition for polishing a substrate

Hydrogen bubble reduction on the cathode using double-cell designs

Method for controlling pH during planarization and cleaning of micr...

Powder for disks

Polishing apparatus and method of polishing work piece

Patents Applicationslast 30 patents

SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD

CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POL...

SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD

LOW-DEBRIS FLUOPOLYMER COMPOSITE CMP POLISHING PAD

FLUOPOLYMER COMPOSITE CMP POLISHING METHOD

CATIONIC FLUOROPOLYMER COMPOSITE POLISHING METHOD

METHOD OF POLISHING SILICON WAFER

SLURRY AND POLISHING METHOD

METHOD FOR POLISHING SILICON WAFER

METHOD AND APPARATUS FOR JUDGING POLISHING PERFORMANCE OF POLISHING...

Tunable Polish Rates By Varying Dissolved Oxygen Content

Polishing Pad and Method For Polishing A Semiconductor Wafer

METHOD OF POLISHING OBJECT TO BE POLISHED AND POLISHING PAD

Polishing method, polishing apparatus and GaN wafer

Tunable Polish Rates By Varying Dissolved Oxygen Content

METHOD FOR POLISHING A SEMICONDUCTOR WAFER

Methods and Systems for Retaining Grinding Efficiency During Backgr...

POLISHING LIQUID AND POLISHING METHOD

Polishing Pad and Method For Polishing A Semiconductor Wafer

Method for chemical mechanical polishing a substrate

POLISHING AGENT FOR SYNTHETIC QUARTZ GLASS SUBSTRATE

POLISHING COMPOSITION

CMP SENSOR AND CONTROL SYSTEM

WATER-BASED POLISHING SLURRY FOR POLISHING SILICON CARBIDE SINGLE C...

METHOD OF RECYCLING ABRASIVE SLURRY

Method of Polishing Compound Semiconductor Substrate, Compound Semi...

Compositions, methods and systems for polishing aluminum oxide and...

CHEMICAL MECHANICAL POLISHING METHOD AND APPARATUS FOR REDUCING MAT...

POLISHING COMPOUND FOR SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, POL...

DUAL REDUCED AGENTS FOR BARRIER REMOVAL IN CHEMICAL MECHANICAL POLI...