taking regard of the temperature during grinding

Industry

CPC
B24B49/14

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work Arrangements of indicating or measuring equipment

Current Industry

B24B49/14taking regard of the temperature during grinding

Industries

Patents Grantslast 30 patents

Information Patent Grant
Pad-temperature regulating apparatus, method of regulating pad-temp...
- Patent number 11,919,124
- Issue date Mar 5, 2024
- Ebara Corporation
- Toru Maruyama
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing system with platen temperature control
- Patent number 11,911,869
- Issue date Feb 27, 2024
- Applied Materials, Inc.
- Jeonghoon Oh
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing a gear worm which is located in particular on...
- Patent number 11,904,381
- Issue date Feb 20, 2024
- Robert Bosch GmbH
- Jie Bao
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Low-temperature metal CMP for minimizing dishing and corrosion, and...
- Patent number 11,897,079
- Issue date Feb 13, 2024
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Temperature-based in-situ edge assymetry correction during CMP
- Patent number 11,865,671
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing system, learning device, and learning method of learning...
- Patent number 11,833,635
- Issue date Dec 5, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Keitaro Fujii
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing tool wear amount prediction device, machine learning devi...
- Patent number 11,822,308
- Issue date Nov 21, 2023
- FANUC CORPORATION
- He Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chemical mechanical polishing temperature scanning apparatus for te...
- Patent number 11,752,589
- Issue date Sep 12, 2023
- Applied Materials, Inc.
- Hari Soundararajan
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer thermal removal control
- Patent number 11,707,813
- Issue date Jul 25, 2023
- GlobalWafers Co., Ltd.
- Emanuele Corsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-modifying agitation process and apparatus for support removal...
- Patent number 11,701,829
- Issue date Jul 18, 2023
- PostProcess Technologies, Inc.
- Daniel Joshua Hutchinson
- B08 - CLEANING
Information Patent Grant
Temperature-based assymetry correction during CMP and nozzle for me...
- Patent number 11,697,187
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Haosheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical-mechanical polishing apparatus
- Patent number 11,679,467
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
External heating system for use in chemical mechanical polishing sy...
- Patent number 11,633,829
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Sheng Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 11,612,983
- Issue date Mar 28, 2023
- Ebara Corporation
- Hiroshi Sotozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for assisting grinding machine
- Patent number 11,597,056
- Issue date Mar 7, 2023
- JTEKT CORPORATION
- Yuki Masuda
- B24 - GRINDING POLISHING
Information Patent Grant
Machining machine and method for operating a machining machine
- Patent number 11,273,533
- Issue date Mar 15, 2022
- Lapmaster Wolters GmbH
- Hans-Peter Boller
- B24 - GRINDING POLISHING
Information Patent Grant
Support base
- Patent number 11,241,770
- Issue date Feb 8, 2022
- Disco Corporation
- Sakae Matsuzaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chemical-mechanical planarization system
- Patent number 11,103,970
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Co, , Ltd.
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 11,007,621
- Issue date May 18, 2021
- Ebara Corporation
- Hiroshi Sotozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and systems for polishing pad control
- Patent number 10,960,513
- Issue date Mar 30, 2021
- Global Wafers Co., Ltd
- Emanuele Corsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for polishing pad control
- Patent number 10,946,493
- Issue date Mar 16, 2021
- GlobalWafers Co., Ltd.
- Emanuele Corsi
- B24 - GRINDING POLISHING
Information Patent Grant
Method of controlling a temperature of a chemical mechanical polish...
- Patent number 10,821,572
- Issue date Nov 3, 2020
- Samsung Electronics Co., Ltd.
- Suk-Hoon Jeong
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing device
- Patent number 10,780,549
- Issue date Sep 22, 2020
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Haiyang Shen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer polishing method and apparatus
- Patent number 10,744,616
- Issue date Aug 18, 2020
- Sumco Corporation
- Tomonori Kawasaki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method and polishing apparatus
- Patent number 10,710,208
- Issue date Jul 14, 2020
- Ebara Corporation
- Toru Maruyama
- B24 - GRINDING POLISHING
Information Patent Grant
Multi-angle two-dimensional ultrasonic vibration assisted nanofluid...
- Patent number 10,695,889
- Issue date Jun 30, 2020
- Qingdao Technological University
- Changhe Li
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and systems for polishing pad control
- Patent number 10,654,145
- Issue date May 19, 2020
- GlobalWafers Co., Ltd.
- Emanuele Corsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for combining CMP process tracking data with 3D printed...
- Patent number 10,593,574
- Issue date Mar 17, 2020
- Applied Materials, Inc.
- Jason G. Fung
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Heat exchanger for regulating surface temperature of a polishing pa...
- Patent number 10,589,398
- Issue date Mar 17, 2020
- Ebara Corporation
- Yohei Eto
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Polishing method and polishing apparatus
- Patent number 10,537,972
- Issue date Jan 21, 2020
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TE...
- Publication number 20230356351
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Hari Soundararajan
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND PROCESSING METHOD
- Publication number 20230352326
- Publication date Nov 2, 2023
- EBARA CORPORATION
- Kuniaki YAMAGUCHI
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR WAFER THERMAL REMOVAL CONTROL
- Publication number 20230347469
- Publication date Nov 2, 2023
- GLOBALWAFERS CO., LTD.
- Emanuele Corsi
- B24 - GRINDING POLISHING
Information Patent Application
HIGH-PRECISION SUBSTRATE POLISHING SYSTEM
- Publication number 20230339070
- Publication date Oct 26, 2023
- KCTECH CO., LTD.
- Ki Hyuk YANG
- B24 - GRINDING POLISHING
Information Patent Application
EXTERNAL HEATING SYSTEM FOR USE IN CHEMICAL MECHANICAL POLISHING SY...
- Publication number 20230294237
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Sheng LIN
- B24 - GRINDING POLISHING
Information Patent Application
NOVEL CHEMICAL-MECHANICAL POLISHING APPARATUS
- Publication number 20230286106
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Application
SELF-MODIFYING AGITATION PROCESS AND APPARATUS FOR SUPPORT REMOVAL...
- Publication number 20230278289
- Publication date Sep 7, 2023
- PostProcess Technologies, Inc.
- Daniel Joshua Hutchinson
- B08 - CLEANING
Information Patent Application
AUTOMATED APPARATUS AND METHOD FOR OBJECT FACETING
- Publication number 20230100222
- Publication date Mar 30, 2023
- ZALIRIAN LTD.
- Oded BEN SHMUEL
- B24 - GRINDING POLISHING
Information Patent Application
PIPE COATING REMOVAL APPARATUS
- Publication number 20230072691
- Publication date Mar 9, 2023
- Decom Engineering Ltd
- Sean CONWAY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR POLISHING A SPECIMEN
- Publication number 20220395955
- Publication date Dec 15, 2022
- TURUN YLIOPISTO
- Arto PELTOLA
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS COMPRISING AN ABRADING HEAD
- Publication number 20220379430
- Publication date Dec 1, 2022
- Mirka Ltd
- Jani KAHARI
- B24 - GRINDING POLISHING
Information Patent Application
Method for Determining State Information Relating to a Belt Grinder...
- Publication number 20220305616
- Publication date Sep 29, 2022
- ROBERT BOSCH GmbH
- Wolfgang Pleuger
- B24 - GRINDING POLISHING
Information Patent Application
DOUBLE-SIDE OR ONE-SIDE MACHINE TOOL
- Publication number 20220258300
- Publication date Aug 18, 2022
- Lapmaster Wolters GmbH
- Hans-Peter Boller
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF MONITORING A VIBRATORY GRINDING PROCESS
- Publication number 20220226964
- Publication date Jul 21, 2022
- RÕster Holding GmbH
- Marco Liske
- B24 - GRINDING POLISHING
Information Patent Application
AUTOMATED DIAMOND POLISHING METHODS AND SYSTEMS
- Publication number 20220152772
- Publication date May 19, 2022
- ZALIRIAN LTD.
- Oded BEN SHMUEL
- B24 - GRINDING POLISHING
Information Patent Application
PAD-TEMPERATURE REGULATING APPARATUS, METHOD OF REGULATING PAD-TEMP...
- Publication number 20220072679
- Publication date Mar 10, 2022
- EBARA CORPORATION
- Toru MARUYAMA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR PRODUCING A GEAR WORM WHICH IS LOCATED IN PARTICULAR ON...
- Publication number 20220055092
- Publication date Feb 24, 2022
- Jie Bao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLISHING APPARATUS AND PROGRAM
- Publication number 20210394338
- Publication date Dec 23, 2021
- EBARA CORPORATION
- Akira Nakamura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR SUBSTRATE POLISHING WITH POLISHING PAD TEMPERATURE CO...
- Publication number 20210394331
- Publication date Dec 23, 2021
- GLOBALWAFERS CO., LTD.
- Masaaki Ikeda
- B24 - GRINDING POLISHING
Information Patent Application
Novel chemical-mechanical polishing apparatus
- Publication number 20210370462
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Application
A SYSTEM FOR MONITORING ONE OR MORE OF AN ABRADING TOOL, A CONSUMAB...
- Publication number 20210308825
- Publication date Oct 7, 2021
- Nicholas T. Gabriel
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20210229240
- Publication date Jul 29, 2021
- EBARA CORPORATION
- Hiroshi SOTOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR WAFER THERMAL REMOVAL CONTROL
- Publication number 20210178547
- Publication date Jun 17, 2021
- GLOBALWAFERS CO., LTD.
- Emanuele Corsi
- B24 - GRINDING POLISHING
Information Patent Application
EXTERNAL HEATING SYSTEM FOR USE IN CHEMICAL MECHANICAL POLISHING SY...
- Publication number 20210078129
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Sheng LIN
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY TEMPERATURE CONTROL BY MIXING AT DISPENSING
- Publication number 20210046603
- Publication date Feb 18, 2021
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Application
LOW-TEMPERATURE METAL CMP FOR MINIMIZING DISHING AND CORROSION, AND...
- Publication number 20210046602
- Publication date Feb 18, 2021
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND PROCESSING METHOD
- Publication number 20210013071
- Publication date Jan 14, 2021
- EBARA CORPORATION
- Kuniaki YAMAGUCHI
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR ASSISTING GRINDING MACHINE
- Publication number 20200306928
- Publication date Oct 1, 2020
- JTEKT Corporation
- Yuki MASUDA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING SYSTEM, LEARNING DEVICE, AND LEARNING METHOD OF LEARNING...
- Publication number 20200262023
- Publication date Aug 20, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- KEITARO FUJII
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING SYSTEM WITH PLATEN TEMPERATURE CONTROL
- Publication number 20200246935
- Publication date Aug 6, 2020
- Applied Materials, Inc.
- Jeonghoon OH
- B24 - GRINDING POLISHING

taking regard of the temperature during grinding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pad-temperature regulating apparatus, method of regulating pad-temp...

Chemical mechanical polishing system with platen temperature control

Method for producing a gear worm which is located in particular on...

Low-temperature metal CMP for minimizing dishing and corrosion, and...

Temperature-based in-situ edge assymetry correction during CMP

Polishing system, learning device, and learning method of learning...

Polishing tool wear amount prediction device, machine learning devi...

Chemical mechanical polishing temperature scanning apparatus for te...

Semiconductor wafer thermal removal control

Self-modifying agitation process and apparatus for support removal...

Temperature-based assymetry correction during CMP and nozzle for me...

Chemical-mechanical polishing apparatus

External heating system for use in chemical mechanical polishing sy...

Polishing apparatus and polishing method

Apparatus and method for assisting grinding machine

Machining machine and method for operating a machining machine

Support base

Chemical-mechanical planarization system

Polishing apparatus and polishing method

Methods and systems for polishing pad control

Methods and systems for polishing pad control

Method of controlling a temperature of a chemical mechanical polish...

Polishing device

Wafer polishing method and apparatus

Polishing method and polishing apparatus

Multi-angle two-dimensional ultrasonic vibration assisted nanofluid...

Methods and systems for polishing pad control

Techniques for combining CMP process tracking data with 3D printed...

Heat exchanger for regulating surface temperature of a polishing pa...

Polishing method and polishing apparatus

Patents Applicationslast 30 patents

CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TE...

SUBSTRATE PROCESSING APPARATUS AND PROCESSING METHOD

SEMICONDUCTOR WAFER THERMAL REMOVAL CONTROL

HIGH-PRECISION SUBSTRATE POLISHING SYSTEM

EXTERNAL HEATING SYSTEM FOR USE IN CHEMICAL MECHANICAL POLISHING SY...

NOVEL CHEMICAL-MECHANICAL POLISHING APPARATUS

SELF-MODIFYING AGITATION PROCESS AND APPARATUS FOR SUPPORT REMOVAL...

AUTOMATED APPARATUS AND METHOD FOR OBJECT FACETING

PIPE COATING REMOVAL APPARATUS

DEVICE AND METHOD FOR POLISHING A SPECIMEN

APPARATUS COMPRISING AN ABRADING HEAD

Method for Determining State Information Relating to a Belt Grinder...

DOUBLE-SIDE OR ONE-SIDE MACHINE TOOL

METHOD OF MONITORING A VIBRATORY GRINDING PROCESS

AUTOMATED DIAMOND POLISHING METHODS AND SYSTEMS

PAD-TEMPERATURE REGULATING APPARATUS, METHOD OF REGULATING PAD-TEMP...

METHOD FOR PRODUCING A GEAR WORM WHICH IS LOCATED IN PARTICULAR ON...

POLISHING APPARATUS AND PROGRAM

SEMICONDUCTOR SUBSTRATE POLISHING WITH POLISHING PAD TEMPERATURE CO...

Novel chemical-mechanical polishing apparatus

A SYSTEM FOR MONITORING ONE OR MORE OF AN ABRADING TOOL, A CONSUMAB...

POLISHING APPARATUS AND POLISHING METHOD

SEMICONDUCTOR WAFER THERMAL REMOVAL CONTROL

EXTERNAL HEATING SYSTEM FOR USE IN CHEMICAL MECHANICAL POLISHING SY...

SLURRY TEMPERATURE CONTROL BY MIXING AT DISPENSING

LOW-TEMPERATURE METAL CMP FOR MINIMIZING DISHING AND CORROSION, AND...

SUBSTRATE PROCESSING APPARATUS AND PROCESSING METHOD

APPARATUS AND METHOD FOR ASSISTING GRINDING MACHINE

POLISHING SYSTEM, LEARNING DEVICE, AND LEARNING METHOD OF LEARNING...

CHEMICAL MECHANICAL POLISHING SYSTEM WITH PLATEN TEMPERATURE CONTROL