Tantalum (Ta) as principal constituent

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H01L2224/45681

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/45681Tantalum (Ta) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Coating layer for a conductive structure
- Patent number 9,337,164
- Issue date May 10, 2016
- Freescale Semiconductors, Inc.
- Rama I. Hegde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a layer including niobium, and/or tantalu...
- Patent number 8,836,120
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting wire and method for manufacturing same
- Patent number 8,450,611
- Issue date May 28, 2013
- Heraeus Materials Technology GmbH & Co. KG
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component of a high frequency current suppression type a...
- Patent number 6,903,440
- Issue date Jun 7, 2005
- NEC Tokin Corp.
- Shigeyoshi Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component of a high frequency current suppression type a...
- Patent number 6,635,961
- Issue date Oct 21, 2003
- NEC Tokin Corp.
- Shigeyoshi Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COATING LAYER FOR A CONDUCTIVE STRUCTURE
- Publication number 20150214177
- Publication date Jul 30, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Rama I. Hegde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Bonding Wire
- Publication number 20120267784
- Publication date Oct 25, 2012
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20100108359
- Publication date May 6, 2010
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component of a high frequency current suppression type a...
- Publication number 20040188833
- Publication date Sep 30, 2004
- Shigeyoshi Yoshida
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Electronic component of a high frequency current suppression type a...
- Publication number 20010026016
- Publication date Oct 4, 2001
- Shigeyoshi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS