Technetium [Tc]

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CPC
H01L2924/01043

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01043Technetium [Tc]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic module with EMI protection
- Patent number 10,470,346
- Issue date Nov 5, 2019
- GE Embedded Electronics Oy
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module with EMI protection
- Patent number 10,010,019
- Issue date Jun 26, 2018
- GE Embedded Electronics Oy
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition for encapsulating semiconductor device and...
- Patent number 9,735,076
- Issue date Aug 15, 2017
- Samsung SDI Co., Ltd.
- Yoon Man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer dispose...
- Patent number 9,666,500
- Issue date May 30, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple access over proximity communication
- Patent number 9,472,498
- Issue date Oct 18, 2016
- Oracle International Corporation
- Alex Chow
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Self-aligned protection layer for copper post structure
- Patent number 9,214,428
- Issue date Dec 15, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for lead free solder interconnections for integrated circ...
- Patent number 9,142,500
- Issue date Sep 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer dispose...
- Patent number 9,087,930
- Issue date Jul 21, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,082,708
- Issue date Jul 14, 2015
- Sumitomo Bakelite Co., Ltd.
- Shinichi Zenbutsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Through wire interconnect (TWI) for semiconductor components having...
- Patent number 9,013,044
- Issue date Apr 21, 2015
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple access over proximity communication
- Patent number 8,975,752
- Issue date Mar 10, 2015
- Oracle America, Inc.
- Alex Chow
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic module with EMI protection
- Patent number 8,964,409
- Issue date Feb 24, 2015
- GE Embedded Electronics Oy
- Risto Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gel package structural enhancement of compression system board conn...
- Patent number 8,929,086
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing printed circuit b...
- Patent number 8,842,440
- Issue date Sep 23, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing printed circuit b...
- Patent number 8,830,691
- Issue date Sep 9, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for discharging a fixed amount of liquid
- Patent number 8,770,439
- Issue date Jul 8, 2014
- Musashi Engineering, Inc.
- Kazumasa Ikushima
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semiconductor device
- Patent number 8,766,420
- Issue date Jul 1, 2014
- Sumitomo Bakelite Co., Ltd.
- Shingo Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 8,763,241
- Issue date Jul 1, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming insulating layer dispose...
- Patent number 8,759,155
- Issue date Jun 24, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component and method for producing a component
- Patent number 8,742,563
- Issue date Jun 3, 2014
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 8,717,772
- Issue date May 6, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-aligned protection layer for copper post structure
- Patent number 8,623,755
- Issue date Jan 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection layer for preventing UBM layer from chemical attack and...
- Patent number 8,569,897
- Issue date Oct 29, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of fabricating the same
- Patent number 8,558,400
- Issue date Oct 15, 2013
- Samsung Electronics Co., Ltd.
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor component having through wire interconnect (T...
- Patent number 8,513,797
- Issue date Aug 20, 2013
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned protection layer for copper post structure
- Patent number 8,501,616
- Issue date Aug 6, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of mechanical stress in metal stacks of sophisticated sem...
- Patent number 8,501,545
- Issue date Aug 6, 2013
- GLOBALFOUNDRIES Inc.
- Michael Grillberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor apparatus
- Patent number 8,492,256
- Issue date Jul 23, 2013
- Fuji Electric Co., Ltd.
- Yuichi Urano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer dispose...
- Patent number 8,456,002
- Issue date Jun 4, 2013
- Stats Chippac Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board manufacturing method
- Patent number 8,453,323
- Issue date Jun 4, 2013
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20190088618
- Publication date Mar 21, 2019
- Toshiba Memory Corporation
- Kazumichi TSUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module with EMI protection
- Publication number 20180352689
- Publication date Dec 6, 2018
- GE EMBEDDED ELECTRONICS OY
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...
- Publication number 20160351461
- Publication date Dec 1, 2016
- Samsung SDI Co., Ltd.
- Yoon Man LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Dispose...
- Publication number 20140246779
- Publication date Sep 4, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR LEAD FREE SOLDER INTERCONNECTIONS FOR INTEGRATED CIRC...
- Publication number 20140231994
- Publication date Aug 21, 2014
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE
- Publication number 20140103526
- Publication date Apr 17, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140035115
- Publication date Feb 6, 2014
- SUMITOMO BAKELITE CO., LTD.
- Shin-ichi Zenbutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE
- Publication number 20130299972
- Publication date Nov 14, 2013
- Chung-Shi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Wire Interconnect (TWI) For Semiconductor Components Having...
- Publication number 20130299983
- Publication date Nov 14, 2013
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20130286615
- Publication date Oct 31, 2013
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Dispose...
- Publication number 20130175696
- Publication date Jul 11, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING INSULATING LAYER DISPOSE...
- Publication number 20130113092
- Publication date May 9, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET PRODUCT
- Publication number 20130078406
- Publication date Mar 28, 2013
- NITTO DENKO CORPORATION
- Akira Shouji
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE
- Publication number 20130049194
- Publication date Feb 28, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Lead Free Solder Interconnections for Integrated Circuits
- Publication number 20120270369
- Publication date Oct 25, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR COMPONENT HAVING THROUGH WIRE INTERCONNECT (T...
- Publication number 20120228781
- Publication date Sep 13, 2012
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120175761
- Publication date Jul 12, 2012
- Shinichi Zenbutsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120168927
- Publication date Jul 5, 2012
- Shingo Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR DISCHARGING A FIXED AMOUNT OF LIQUID
- Publication number 20120132671
- Publication date May 31, 2012
- MUSASHI ENGINEERING, INC.
- Kazumasa Ikushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Dispose...
- Publication number 20120112340
- Publication date May 10, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK ARREST VIAS FOR IC DEVICES
- Publication number 20120104604
- Publication date May 3, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Robert Fabian McCarthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages And Methods Of Fabricating The Same
- Publication number 20120091579
- Publication date Apr 19, 2012
- Samsung Electronics Co., Ltd.
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE ASSEMBLIES INCLUDING TSV DIE
- Publication number 20120070939
- Publication date Mar 22, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Rajiv Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL FLEX CONTACT CARRIERS #2
- Publication number 20120012365
- Publication date Jan 19, 2012
- GABE CHERIAN
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20120006469
- Publication date Jan 12, 2012
- IBIDEN CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING METHOD
- Publication number 20120000068
- Publication date Jan 5, 2012
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS
- Publication number 20110256668
- Publication date Oct 20, 2011
- Fuji Electric Co., Ltd.
- Yuichi URANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduction of Mechanical Stress in Metal Stacks of Sophisticated Sem...
- Publication number 20110244632
- Publication date Oct 6, 2011
- GLOBALFOUNDRIES INC.
- Michael Grillberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Robust Flip Chip Interconnections
- Publication number 20110193227
- Publication date Aug 11, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL CARRIER FOR JOINING IC DIE OR WAFERS TO TSV WAFERS
- Publication number 20110183464
- Publication date Jul 28, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Yoshimi Takahashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Technetium [Tc]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic module with EMI protection

Electronic module with EMI protection

Epoxy resin composition for encapsulating semiconductor device and...

Semiconductor device and method of forming insulating layer dispose...

Multiple access over proximity communication

Self-aligned protection layer for copper post structure

Apparatus for lead free solder interconnections for integrated circ...

Semiconductor device and method of forming insulating layer dispose...

Semiconductor device

Through wire interconnect (TWI) for semiconductor components having...

Multiple access over proximity communication

Electronic module with EMI protection

Gel package structural enhancement of compression system board conn...

Printed circuit board and method of manufacturing printed circuit b...

Printed circuit board and method of manufacturing printed circuit b...

Method and device for discharging a fixed amount of liquid

Semiconductor device

Method of manufacturing printed wiring board

Semiconductor device and method of forming insulating layer dispose...

Component and method for producing a component

Printed circuit board

Self-aligned protection layer for copper post structure

Protection layer for preventing UBM layer from chemical attack and...

Semiconductor packages and methods of fabricating the same

Stacked semiconductor component having through wire interconnect (T...

Self-aligned protection layer for copper post structure

Reduction of mechanical stress in metal stacks of sophisticated sem...

Method of manufacturing semiconductor apparatus

Semiconductor device and method of forming insulating layer dispose...

Printed circuit board manufacturing method

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Electronic module with EMI protection

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...

Semiconductor Device and Method of Forming Insulating Layer Dispose...

APPARATUS FOR LEAD FREE SOLDER INTERCONNECTIONS FOR INTEGRATED CIRC...

SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE

SEMICONDUCTOR DEVICE

SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE

Through Wire Interconnect (TWI) For Semiconductor Components Having...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

Semiconductor Device and Method of Forming Insulating Layer Dispose...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING INSULATING LAYER DISPOSE...

SHEET PRODUCT

SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE

Methods for Lead Free Solder Interconnections for Integrated Circuits

STACKED SEMICONDUCTOR COMPONENT HAVING THROUGH WIRE INTERCONNECT (T...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD AND DEVICE FOR DISCHARGING A FIXED AMOUNT OF LIQUID

Semiconductor Device and Method of Forming Insulating Layer Dispose...

CRACK ARREST VIAS FOR IC DEVICES

Semiconductor Packages And Methods Of Fabricating The Same

STACKED DIE ASSEMBLIES INCLUDING TSV DIE

THERMAL FLEX CONTACT CARRIERS #2

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

PRINTED CIRCUIT BOARD MANUFACTURING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS

Reduction of Mechanical Stress in Metal Stacks of Sophisticated Sem...

Methods and Apparatus for Robust Flip Chip Interconnections

DUAL CARRIER FOR JOINING IC DIE OR WAFERS TO TSV WAFERS