Temperature monitoring

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CPC
H01L21/67248

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67248Temperature monitoring

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus and substrate temperature correction...
- Patent number 12,266,514
- Issue date Apr 1, 2025
- Tokyo Electron Limited
- Rei Ibuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for non-contact temperature monitorin...
- Patent number 12,266,551
- Issue date Apr 1, 2025
- Applied Materials, Inc.
- Bhaskar Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for thermal control of devices in electronics tester
- Patent number 12,265,136
- Issue date Apr 1, 2025
- AEHR Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric cooling pedestal for substrate processing systems
- Patent number 12,266,588
- Issue date Apr 1, 2025
- Lam Research Corporation
- Mrinal Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and stage cleaning method
- Patent number 12,261,060
- Issue date Mar 25, 2025
- Tokyo Electron Limited
- Tsutomu Hiroki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processing chamber with annealing mini-environment
- Patent number 12,249,522
- Issue date Mar 11, 2025
- Applied Materials, Inc.
- Michael Honan
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Grant
Using spectroscopic measurements for substrate temperature monitoring
- Patent number 12,249,525
- Issue date Mar 11, 2025
- Applied Materials, Inc.
- Ian McDonald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,243,847
- Issue date Mar 4, 2025
- Semes Co., Ltd.
- Gil Yong Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and ceiling heater
- Patent number 12,241,159
- Issue date Mar 4, 2025
- Kokusai Electric Corporation
- Tetsuya Kosugi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Temperature controlled substrate support assembly
- Patent number 12,243,756
- Issue date Mar 4, 2025
- Applied Materials, Inc.
- Vijay D. Parkhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support with varying depths of areas between mesas and co...
- Patent number 12,227,840
- Issue date Feb 18, 2025
- Lam Research Corporation
- Keith Gaff
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Light irradiation type heat treatment apparatus
- Patent number 12,230,518
- Issue date Feb 18, 2025
- SCREEN Holdings Co., Ltd.
- Nobuhiko Nishide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for non-contact low substrate temperature measurement
- Patent number 12,230,521
- Issue date Feb 18, 2025
- Applied Materials, Inc.
- Kim Ramkumar Vellore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for providing variable ramp-up control for an ele...
- Patent number 12,225,635
- Issue date Feb 11, 2025
- Watlow Electric Manufacturing Company
- Brittany Phillips
- G05 - CONTROLLING REGULATING
Information Patent Grant
System and apparatus for a valve assembly
- Patent number 12,224,190
- Issue date Feb 11, 2025
- ASM IP Holding B.V.
- Andrew Michael Yednak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for providing line end extensions for fin-type...
- Patent number 12,218,239
- Issue date Feb 4, 2025
- Mosaid Technologies Incorporated
- Shao-Ming Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for processing a wafer, and method of controlling such an...
- Patent number 12,217,980
- Issue date Feb 4, 2025
- Lam Research AG
- Daniel Brien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum transfer device, substrate processing system, and substrate...
- Patent number 12,211,720
- Issue date Jan 28, 2025
- Tokyo Electron Limited
- Tatsuo Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Time-varying frequency powered heat source
- Patent number 12,208,033
- Issue date Jan 28, 2025
- Anand Deo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Baking apparatus
- Patent number 12,211,711
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Bumjin Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling substrate transfer system and the substrate t...
- Patent number 12,211,719
- Issue date Jan 28, 2025
- Tokyo Electron Limited
- Wataru Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus having closed loop IR camera heat detection system and me...
- Patent number 12,205,835
- Issue date Jan 21, 2025
- Illinois Tool Works Inc.
- Eric Wayne Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature calibration methods for semiconductor machine
- Patent number 12,205,834
- Issue date Jan 21, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- ShihChieh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature change rate control device, method, and semiconductor p...
- Patent number 12,205,836
- Issue date Jan 21, 2025
- BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Hongwei Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature profile measurement and synchronized control on substra...
- Patent number 12,196,617
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Zuoming Zhu
- G01 - MEASURING TESTING
Information Patent Grant
Method of cleaning, method of manufacturing semiconductor device, s...
- Patent number 12,195,848
- Issue date Jan 14, 2025
- Kokusai Electric Corporation
- Kazuhiro Harada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition system and method
- Patent number 12,198,927
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hsi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adaptive baking method
- Patent number 12,196,491
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzung-Chen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of calibrating radiation thermometer and system thereof
- Patent number 12,181,345
- Issue date Dec 31, 2024
- Ebara Corporation
- Shuji Uozumi
- B24 - GRINDING POLISHING
Information Patent Grant
In-situ semiconductor processing chamber temperature apparatus
- Patent number 12,183,605
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Andrew Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR...
- Publication number 20250112063
- Publication date Apr 3, 2025
- Kokusai Electric Corporation
- Kimihiko NAKATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAMBER ARRANGEMENTS, SEMICONDUCTOR PROCESSING SYSTEMS INCLUDING CH...
- Publication number 20250112064
- Publication date Apr 3, 2025
- ASM IP HOLDING B.V.
- Amir Kajbafvala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET PROCESSING WITH AUTOMATIC PROCESS CONTROL
- Publication number 20250105036
- Publication date Mar 27, 2025
- Yield Engineering Systems, Inc.
- Venugopal Govindarajulu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT TRANSFER APPARATUS AND TRANSFER METHOD USING...
- Publication number 20250105047
- Publication date Mar 27, 2025
- Hyundai Motor Company
- Tae Woo KWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE MEASUREMENT ASSEMBLY, SUBSTRATE PROCESSING APPARATUS, M...
- Publication number 20250102373
- Publication date Mar 27, 2025
- Kokusai Electric Corporation
- Tokunobu AKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE OFFSET AND ZONE CONTROL TUNING
- Publication number 20250105035
- Publication date Mar 27, 2025
- Applied Materials, Inc.
- Ole LUCKNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR SUBSTRATE SUPPORT ASSEMBLY
- Publication number 20250105051
- Publication date Mar 27, 2025
- Applied Materials, Inc.
- Arvinder Manmohan Singh Chadha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Control System For Adaptive Control Of A Thermal Processing System
- Publication number 20250093852
- Publication date Mar 20, 2025
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Michael X. Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RING ASSEMBLY FOR SEMICONDUCTOR PROCESS, SUBSTRATE PROCESSING APPAR...
- Publication number 20250087465
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Hyungsik KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR PROVIDING VARIABLE RAMP-UP CONTROL FOR AN ELE...
- Publication number 20250089130
- Publication date Mar 13, 2025
- WATLOW ELECTRIC MANUFACTURING COMPANY
- Brittany PHILLIPS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONITORING DEVICE FOR MEASURING CHARACTERISTICS OF EDGE AREA AND ME...
- Publication number 20250087508
- Publication date Mar 13, 2025
- WIT CORPORATION
- Jae Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE ANNEALING FOR LOW THERMAL BUDGET APPLICATIONS
- Publication number 20250087505
- Publication date Mar 13, 2025
- Applied Materials, Inc.
- Shashank Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PROCESSING APPARATUS, SUBSTRATE PROCESSING APPARATUS, DISPL...
- Publication number 20250079210
- Publication date Mar 6, 2025
- Kokusai Electric Corporation
- Shinichiro MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PLACEMENT TABLE AND METHOD OF USING THE SAME
- Publication number 20250079230
- Publication date Mar 6, 2025
- NGK Insulators, Ltd.
- Ikuhisa MORIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE TRANSPORT UNIT AND CHAMBER INCLUDING SEMICONDU...
- Publication number 20250073915
- Publication date Mar 6, 2025
- ATECO INC.
- Taek Seon LEE
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, ROTATION STATE DETECTION METHOD, ME...
- Publication number 20250079231
- Publication date Mar 6, 2025
- Kokusai Electric Corporation
- Naofumi OHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONTROL DEVICE FOR TEMPERATURE CONTROL, THERMAL PROCESSING SY...
- Publication number 20250076906
- Publication date Mar 6, 2025
- AP SYSTEMS INC
- Sang Hyun JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI ZONE SPOT HEATING IN EPI
- Publication number 20250066918
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Shu-Kwan LAU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IN SITU REAL-TIME SENSING AND COMPENSATION OF NON-UNIFORMITIES IN S...
- Publication number 20250069866
- Publication date Feb 27, 2025
- LAM RESEARCH CORPORATION
- Changyou JING
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IN-SITU SEMICONDUCTOR PROCESSING CHAMBER TEMPERATURE APPARATUS
- Publication number 20250069921
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Andrew NGUYEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOAD LOCK ARRANGEMENTS, SEMICONDUCTOR PROCESSING SYSTEMS INCLUDING...
- Publication number 20250069920
- Publication date Feb 27, 2025
- ASM IP HOLDING B.V.
- Masaei Suwada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RTP SUBSTRATE TEMPERATURE ONE FOR ALL CONTROL ALGORITHM
- Publication number 20250067511
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Wolfgang Aderhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE ANNEALER FOR SEMICONDUCTOR WAFERS
- Publication number 20250063641
- Publication date Feb 20, 2025
- Cornell University
- James C. M. Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CLEANING APPARATUS AND METHOD
- Publication number 20250062140
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jieh-Chau HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT DEVICE WITH DIAGNOSTIC CAPABILITIES
- Publication number 20250062143
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Deepak Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL WAFER MANUFACTURING METHOD AND EPITAXIAL WAFER MANUFACTUR...
- Publication number 20250051959
- Publication date Feb 13, 2025
- SUMCO CORPORATION
- Masayuki TSUJI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PIPELINE TEMPERATURE CONTROL EQUIPMENT AND PIPELINE TEMPERATURE CON...
- Publication number 20250053183
- Publication date Feb 13, 2025
- Beijing NAURA Microelectronics Equipment Co., Ltd.
- Caifeng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVE RELEASE OF COMPONENTS USING THERMAL RELEASE LAYER
- Publication number 20250054785
- Publication date Feb 13, 2025
- Deca Technologies USA, Inc.
- Benedict SAN JOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IDENTIFICATION OF AND COMPENSATION FOR A FAILURE IN A HEATER ARRAY
- Publication number 20250054788
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Changyou Jing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIRTUAL MEASUREMENT OF CONDITIONS PROXIMATE TO A SUBSTRATE WITH PHY...
- Publication number 20250053715
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Preetham Prahallada Rao
- G06 - COMPUTING CALCULATING COUNTING

Temperature monitoring

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate processing apparatus and substrate temperature correction...

Apparatus, system, and method for non-contact temperature monitorin...

Method and system for thermal control of devices in electronics tester

Thermoelectric cooling pedestal for substrate processing systems

Substrate processing apparatus and stage cleaning method

Processing chamber with annealing mini-environment

Using spectroscopic measurements for substrate temperature monitoring

Bonding apparatus and bonding method

Substrate processing apparatus and ceiling heater

Temperature controlled substrate support assembly

Substrate support with varying depths of areas between mesas and co...

Light irradiation type heat treatment apparatus

Method for non-contact low substrate temperature measurement

Method and system for providing variable ramp-up control for an ele...

System and apparatus for a valve assembly

Structure and method for providing line end extensions for fin-type...

Apparatus for processing a wafer, and method of controlling such an...

Vacuum transfer device, substrate processing system, and substrate...

Time-varying frequency powered heat source

Baking apparatus

Method of controlling substrate transfer system and the substrate t...

Apparatus having closed loop IR camera heat detection system and me...

Temperature calibration methods for semiconductor machine

Temperature change rate control device, method, and semiconductor p...

Temperature profile measurement and synchronized control on substra...

Method of cleaning, method of manufacturing semiconductor device, s...

Deposition system and method

Adaptive baking method

Method of calibrating radiation thermometer and system thereof

In-situ semiconductor processing chamber temperature apparatus

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR...

CHAMBER ARRANGEMENTS, SEMICONDUCTOR PROCESSING SYSTEMS INCLUDING CH...

WET PROCESSING WITH AUTOMATIC PROCESS CONTROL

SEMICONDUCTOR ELEMENT TRANSFER APPARATUS AND TRANSFER METHOD USING...

TEMPERATURE MEASUREMENT ASSEMBLY, SUBSTRATE PROCESSING APPARATUS, M...

TEMPERATURE OFFSET AND ZONE CONTROL TUNING

MODULAR SUBSTRATE SUPPORT ASSEMBLY

Control System For Adaptive Control Of A Thermal Processing System

RING ASSEMBLY FOR SEMICONDUCTOR PROCESS, SUBSTRATE PROCESSING APPAR...

METHOD AND SYSTEM FOR PROVIDING VARIABLE RAMP-UP CONTROL FOR AN ELE...

MONITORING DEVICE FOR MEASURING CHARACTERISTICS OF EDGE AREA AND ME...

MICROWAVE ANNEALING FOR LOW THERMAL BUDGET APPLICATIONS

DISPLAY PROCESSING APPARATUS, SUBSTRATE PROCESSING APPARATUS, DISPL...

WAFER PLACEMENT TABLE AND METHOD OF USING THE SAME

SEMICONDUCTOR DEVICE TRANSPORT UNIT AND CHAMBER INCLUDING SEMICONDU...

SUBSTRATE PROCESSING APPARATUS, ROTATION STATE DETECTION METHOD, ME...

POWER CONTROL DEVICE FOR TEMPERATURE CONTROL, THERMAL PROCESSING SY...

MULTI ZONE SPOT HEATING IN EPI

IN SITU REAL-TIME SENSING AND COMPENSATION OF NON-UNIFORMITIES IN S...

IN-SITU SEMICONDUCTOR PROCESSING CHAMBER TEMPERATURE APPARATUS

LOAD LOCK ARRANGEMENTS, SEMICONDUCTOR PROCESSING SYSTEMS INCLUDING...

RTP SUBSTRATE TEMPERATURE ONE FOR ALL CONTROL ALGORITHM

MICROWAVE ANNEALER FOR SEMICONDUCTOR WAFERS

WAFER CLEANING APPARATUS AND METHOD

SUBSTRATE SUPPORT DEVICE WITH DIAGNOSTIC CAPABILITIES

EPITAXIAL WAFER MANUFACTURING METHOD AND EPITAXIAL WAFER MANUFACTUR...

PIPELINE TEMPERATURE CONTROL EQUIPMENT AND PIPELINE TEMPERATURE CON...

METHOD OF SELECTIVE RELEASE OF COMPONENTS USING THERMAL RELEASE LAYER

IDENTIFICATION OF AND COMPENSATION FOR A FAILURE IN A HEATER ARRAY

VIRTUAL MEASUREMENT OF CONDITIONS PROXIMATE TO A SUBSTRATE WITH PHY...