Temperature range 300 C=<T<350 C, 573.15K =<T< 623.15K

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H01L2924/20108

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/20108Temperature range 300 C=<T<350 C, 573.15K =<T< 623.15K

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Process flow for fabrication of cap metal over top metal with sinte...
- Patent number 12,159,846
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for fabricating hybrid bonded structure
- Patent number 12,021,103
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including buffer layer
- Patent number 11,810,879
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3DIC formation with dies bonded to formed RDLs
- Patent number 11,810,899
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,456,264
- Issue date Sep 27, 2022
- Renesas Electronics Corporation
- Yoshiaki Sato
- G11 - INFORMATION STORAGE
Information Patent Grant
Hybrid bonded structure
- Patent number 11,437,422
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating high-power module
- Patent number 11,426,793
- Issue date Aug 30, 2022
- National Cheng Kung University
- In-Gann Chen
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Package and manufacturing method thereof
- Patent number 11,417,619
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of designing a layout, method of making a semiconductor stru...
- Patent number 11,309,268
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3DIC formation with dies bonded to formed RDLs
- Patent number 11,004,826
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Power electronic assemblies with high purity aluminum plated substr...
- Patent number 10,804,236
- Issue date Oct 13, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with post passivation structure
- Patent number 10,727,191
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid bonded structure
- Patent number 10,672,820
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste and die bonding method
- Patent number 10,615,144
- Issue date Apr 7, 2020
- Kaken Tech Co., Ltd.
- Shigeo Hori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for processing a die
- Patent number 10,340,227
- Issue date Jul 2, 2019
- Infineon Technologies AG
- Markus Zundel
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Nickel particle composition, bonding material, and bonding method i...
- Patent number 10,207,373
- Issue date Feb 19, 2019
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Takayuki Shimizu
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Vertical nanoribbon array (VERNA) thermal interface materials with...
- Patent number 10,170,338
- Issue date Jan 1, 2019
- Northrop Grumman Systems Corporation
- John A. Starkovich
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device with post passivation structure and fabricatio...
- Patent number 10,163,831
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device interconnections for high temperature operability
- Patent number 10,153,242
- Issue date Dec 11, 2018
- Kulite Semiconductor Products, Inc.
- Sorin Stefanescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method using bonding material
- Patent number 10,090,275
- Issue date Oct 2, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component support and semiconductor device
- Patent number 10,068,821
- Issue date Sep 4, 2018
- Nichia Corporation
- Takeaki Shirase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step processes for high temperature bonding and bonded substr...
- Patent number 10,043,731
- Issue date Aug 7, 2018
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3DIC formation with dies bonded to formed RDLs
- Patent number 10,026,716
- Issue date Jul 17, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding material and bonding method using the same
- Patent number 10,008,471
- Issue date Jun 26, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for permanent bonding
- Patent number 9,947,638
- Issue date Apr 17, 2018
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device interconnections for high temperature operability
- Patent number 9,917,067
- Issue date Mar 13, 2018
- Kulite Semiconductor Products, Inc.
- Sorin Stefanescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device, and electronic device...
- Patent number 9,911,642
- Issue date Mar 6, 2018
- Fujitsu Limited
- Taiji Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20240313026
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...
- Publication number 20240274563
- Publication date Aug 15, 2024
- INFINEON TECHNOLOGIES AG
- Hock Heng CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
- Publication number 20240128227
- Publication date Apr 18, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Perceval COUDRAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING METHOD
- Publication number 20240038705
- Publication date Feb 1, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yunzhi LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230361062
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Huan Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AG PASTE COMPOSITION AND BONDING FILM PRODUCED USING SAME
- Publication number 20230260946
- Publication date Aug 17, 2023
- AMOGREENTECH CO., LTD.
- Younghwan JUN
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20220359601
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220336395
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210057362
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FLOW FOR FABRICATION OF CAP METAL OVER TOP METAL WITH SINTE...
- Publication number 20210005560
- Publication date Jan 7, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED STRUCTURE
- Publication number 20200295070
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating High-Power Module
- Publication number 20200171578
- Publication date Jun 4, 2020
- National Cheng Kung University
- In-Gann Chen
- B22 - CASTING POWDER METALLURGY
Information Patent Application
POWER ELECTRONIC ASSEMBLIES WITH HIGH PURITY ALUMINUM PLATED SUBSTR...
- Publication number 20200135681
- Publication date Apr 30, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINTERING BONDING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20190252348
- Publication date Aug 15, 2019
- Hyundai Motor Company
- Hiyoshi Michiaki
- B22 - CASTING POWDER METALLURGY
Information Patent Application
HYBRID BONDED STRUCTURE
- Publication number 20190157333
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL NANORIBBON ARRAY (VERNA) THERMAL INTERFACE MATERIALS WITH...
- Publication number 20180342405
- Publication date Nov 29, 2018
- Northrop Grumman Systems Corporation
- John A. Starkovich
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
3DIC Formation with Dies Bonded to Formed RDLs
- Publication number 20180323177
- Publication date Nov 8, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INTERCONNECTIONS FOR HIGH TEMPERATURE OPERABILITY
- Publication number 20180218988
- Publication date Aug 2, 2018
- Kulite Semiconductor Products, Inc.
- Sorin Stefanescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180122765
- Publication date May 3, 2018
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
3DIC Formation with Dies Bonded to Formed RDLs
- Publication number 20170301650
- Publication date Oct 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NICKEL PARTICLE COMPOSITION, BONDING MATERIAL, AND BONDING METHOD I...
- Publication number 20170136585
- Publication date May 18, 2017
- NIPPON STEEL & SUMIKIN CHEMICAL CO.,LTD.
- Takayuki SHIMIZU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-Step Processes For High Temperature Bonding And Bonded Substr...
- Publication number 20170062304
- Publication date Mar 2, 2017
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR PERMANENT BONDING
- Publication number 20170053892
- Publication date Feb 23, 2017
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Configured for Connection to a Board
- Publication number 20160329292
- Publication date Nov 10, 2016
- INFINEON TECHNOLOGIES AG
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20160308100
- Publication date Oct 20, 2016
- CHIPMOS TECHNOLOGIES INC.
- TUNG BAO LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20160293568
- Publication date Oct 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- LAKSHMINARAYAN VISWANATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A DIE
- Publication number 20160284648
- Publication date Sep 29, 2016
- INFINEON TECHNOLOGIES AG
- Markus ZUNDEL
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160233202
- Publication date Aug 11, 2016
- MITSUBISHI ELECTRIC CORPORATION
- Hideo KOMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIAS AND THERMOCOMPRESSION BONDING USING INKJET-PRI...
- Publication number 20160148840
- Publication date May 26, 2016
- The Regents of the University of California
- Vivek Subramanian
- H01 - BASIC ELECTRIC ELEMENTS

Temperature range 300 C=<T<350 C, 573.15K =<T< 623.15K

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process flow for fabrication of cap metal over top metal with sinte...

Low pressure sintering powder

Method for fabricating hybrid bonded structure

Semiconductor structure including buffer layer

3DIC formation with dies bonded to formed RDLs

Method of manufacturing semiconductor device

Hybrid bonded structure

Method of fabricating high-power module

Package and manufacturing method thereof

Sintering materials and attachment methods using same

Method of designing a layout, method of making a semiconductor stru...

3DIC formation with dies bonded to formed RDLs

Low pressure sintering powder

Power electronic assemblies with high purity aluminum plated substr...

Semiconductor device with post passivation structure

Hybrid bonded structure

Conductive paste and die bonding method

Method for processing a die

Nickel particle composition, bonding material, and bonding method i...

Vertical nanoribbon array (VERNA) thermal interface materials with...

Semiconductor device with post passivation structure and fabricatio...

Electronic device interconnections for high temperature operability

Bonding method using bonding material

Semiconductor component support and semiconductor device

Multi-step processes for high temperature bonding and bonded substr...

3DIC formation with dies bonded to formed RDLs

Bonding material and bonding method using the same

Device and method for permanent bonding

Electronic device interconnections for high temperature operability

Method of manufacturing an electronic device, and electronic device...

Patents Applicationslast 30 patents

LOW PRESSURE SINTERING POWDER

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...

SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE

SUBSTRATE BONDING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

AG PASTE COMPOSITION AND BONDING FILM PRODUCED USING SAME

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE AND MANUFACTURING METHOD THEREOF

PROCESS FLOW FOR FABRICATION OF CAP METAL OVER TOP METAL WITH SINTE...

HYBRID BONDED STRUCTURE

Method of Fabricating High-Power Module

POWER ELECTRONIC ASSEMBLIES WITH HIGH PURITY ALUMINUM PLATED SUBSTR...

SINTERING BONDING METHOD FOR SEMICONDUCTOR DEVICE

HYBRID BONDED STRUCTURE

VERTICAL NANORIBBON ARRAY (VERNA) THERMAL INTERFACE MATERIALS WITH...

3DIC Formation with Dies Bonded to Formed RDLs

ELECTRONIC DEVICE INTERCONNECTIONS FOR HIGH TEMPERATURE OPERABILITY

BONDING WIRE FOR SEMICONDUCTOR DEVICE

3DIC Formation with Dies Bonded to Formed RDLs

NICKEL PARTICLE COMPOSITION, BONDING MATERIAL, AND BONDING METHOD I...

Multi-Step Processes For High Temperature Bonding And Bonded Substr...

DEVICE AND METHOD FOR PERMANENT BONDING

Semiconductor Package Configured for Connection to a Board

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THEREOF

METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES

METHOD FOR PROCESSING A DIE

SEMICONDUCTOR DEVICE

THROUGH SILICON VIAS AND THERMOCOMPRESSION BONDING USING INKJET-PRI...