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Temperature range 350 C=<T<400 C, 623.15K =<T< 673.15K
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Temperature range 350 C=<T<400 C, 623.15K =<T< 673.15K
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last 30 patents
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Patent Grant
Process flow for fabrication of cap metal over top metal with sinte...
Patent number
12,159,846
Issue date
Dec 3, 2024
Texas Instruments Incorporated
Richard Allen Faust
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low pressure sintering powder
Patent number
12,113,039
Issue date
Oct 8, 2024
Alpha Assembly Solutions Inc.
Shamik Ghoshal
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Method for fabricating hybrid bonded structure
Patent number
12,021,103
Issue date
Jun 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Bo-Tsung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure including buffer layer
Patent number
11,810,879
Issue date
Nov 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Gulbagh Singh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
3DIC formation with dies bonded to formed RDLs
Patent number
11,810,899
Issue date
Nov 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for the manufacture of integrated devices including a die fi...
Patent number
11,756,916
Issue date
Sep 12, 2023
STMicroelectronics S.r.l.
Michele Calabretta
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for the manufacture of integrated devices including a die fi...
Patent number
11,482,503
Issue date
Oct 25, 2022
STMicroelectronics S.r.l.
Michele Calabretta
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
11,456,264
Issue date
Sep 27, 2022
Renesas Electronics Corporation
Yoshiaki Sato
G11 - INFORMATION STORAGE
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Patent Grant
Hybrid bonded structure
Patent number
11,437,422
Issue date
Sep 6, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Bo-Tsung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Film-shaped firing material and film-shaped firing material with a...
Patent number
11,420,255
Issue date
Aug 23, 2022
Lintec Corporation
Isao Ichikawa
B22 - CASTING POWDER METALLURGY
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Patent Grant
Package and manufacturing method thereof
Patent number
11,417,619
Issue date
Aug 16, 2022
Taiwan Semiconductor Manufacturing Company Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sintering materials and attachment methods using same
Patent number
11,389,865
Issue date
Jul 19, 2022
Alpha Assembly Solutions Inc.
Shamik Ghoshal
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Method of designing a layout, method of making a semiconductor stru...
Patent number
11,309,268
Issue date
Apr 19, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Gulbagh Singh
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
3DIC formation with dies bonded to formed RDLs
Patent number
11,004,826
Issue date
May 11, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low pressure sintering powder
Patent number
10,998,284
Issue date
May 4, 2021
Alpha Assembly Solutions Inc.
Shamik Ghoshal
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Semiconductor device with post passivation structure
Patent number
10,727,191
Issue date
Jul 28, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Gulbagh Singh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Hybrid bonded structure
Patent number
10,672,820
Issue date
Jun 2, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Bo-Tsung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive paste and die bonding method
Patent number
10,615,144
Issue date
Apr 7, 2020
Kaken Tech Co., Ltd.
Shigeo Hori
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Method for processing a die
Patent number
10,340,227
Issue date
Jul 2, 2019
Infineon Technologies AG
Markus Zundel
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Nickel particle composition, bonding material, and bonding method i...
Patent number
10,207,373
Issue date
Feb 19, 2019
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Takayuki Shimizu
B22 - CASTING POWDER METALLURGY
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Patent Grant
Vertical nanoribbon array (VERNA) thermal interface materials with...
Patent number
10,170,338
Issue date
Jan 1, 2019
Northrop Grumman Systems Corporation
John A. Starkovich
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Semiconductor device with post passivation structure and fabricatio...
Patent number
10,163,831
Issue date
Dec 25, 2018
Taiwan Semiconductor Manufacturing Company, Ltd
Gulbagh Singh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Electronic device interconnections for high temperature operability
Patent number
10,153,242
Issue date
Dec 11, 2018
Kulite Semiconductor Products, Inc.
Sorin Stefanescu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding method using bonding material
Patent number
10,090,275
Issue date
Oct 2, 2018
Dowa Electronics Materials Co., Ltd.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
3DIC formation with dies bonded to formed RDLs
Patent number
10,026,716
Issue date
Jul 17, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding material and bonding method using the same
Patent number
10,008,471
Issue date
Jun 26, 2018
Dowa Electronics Materials Co., Ltd.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic device interconnections for high temperature operability
Patent number
9,917,067
Issue date
Mar 13, 2018
Kulite Semiconductor Products, Inc.
Sorin Stefanescu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Source down semiconductor devices and methods of formation thereof
Patent number
9,911,686
Issue date
Mar 6, 2018
Infineon Technologies AG
Manfred Schneegans
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive paste and die bonding method
Patent number
9,818,718
Issue date
Nov 14, 2017
Kaken Tech Co., Ltd.
Shigeo Hori
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor structure and fabrication method thereof
Patent number
9,754,893
Issue date
Sep 5, 2017
Semiconductor Manufacturing International (Shanghai) Corporation
Jingxiu Ding
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
LOW PRESSURE SINTERING POWDER
Publication number
20240413117
Publication date
Dec 12, 2024
Alpha Assembly Solutions Inc.
Shamik Ghoshal
B22 - CASTING POWDER METALLURGY
Information
Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
Publication number
20240313026
Publication date
Sep 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Bo-Tsung TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
Publication number
20240128227
Publication date
Apr 18, 2024
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Perceval COUDRAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
Publication number
20220359601
Publication date
Nov 10, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Bo-Tsung TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20220336395
Publication date
Oct 20, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20210057362
Publication date
Feb 25, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESS FLOW FOR FABRICATION OF CAP METAL OVER TOP METAL WITH SINTE...
Publication number
20210005560
Publication date
Jan 7, 2021
TEXAS INSTRUMENTS INCORPORATED
Richard Allen Faust
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR THE MANUFACTURE OF INTEGRATED DEVICES INCLUDING A DIE FI...
Publication number
20200294950
Publication date
Sep 17, 2020
STMicroelectronics S.r.l.
Michele CALABRETTA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
HYBRID BONDED STRUCTURE
Publication number
20200295070
Publication date
Sep 17, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Bo-Tsung TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FILM-SHAPED FIRING MATERIAL AND FILM-SHAPED FIRING MATERIAL WITH A...
Publication number
20200276645
Publication date
Sep 3, 2020
LINTEC CORPORATION
Isao ICHIKAWA
B22 - CASTING POWDER METALLURGY
Information
Patent Application
HYBRID BONDED STRUCTURE
Publication number
20190157333
Publication date
May 23, 2019
Taiwan Semiconductor Manufacturing Co., Ltd.
Bo-Tsung TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VERTICAL NANORIBBON ARRAY (VERNA) THERMAL INTERFACE MATERIALS WITH...
Publication number
20180342405
Publication date
Nov 29, 2018
Northrop Grumman Systems Corporation
John A. Starkovich
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
3DIC Formation with Dies Bonded to Formed RDLs
Publication number
20180323177
Publication date
Nov 8, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE INTERCONNECTIONS FOR HIGH TEMPERATURE OPERABILITY
Publication number
20180218988
Publication date
Aug 2, 2018
Kulite Semiconductor Products, Inc.
Sorin Stefanescu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
Publication number
20180122765
Publication date
May 3, 2018
NIPPON MICROMETAL CORPORATION
Daizo ODA
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
3DIC Formation with Dies Bonded to Formed RDLs
Publication number
20170301650
Publication date
Oct 19, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NICKEL PARTICLE COMPOSITION, BONDING MATERIAL, AND BONDING METHOD I...
Publication number
20170136585
Publication date
May 18, 2017
NIPPON STEEL & SUMIKIN CHEMICAL CO.,LTD.
Takayuki SHIMIZU
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR PROCESSING A DIE
Publication number
20160284648
Publication date
Sep 29, 2016
INFINEON TECHNOLOGIES AG
Markus ZUNDEL
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...
Publication number
20160111389
Publication date
Apr 21, 2016
NIPPON MICROMETAL CORPORATION
Takashi YAMADA
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...
Publication number
20160104687
Publication date
Apr 14, 2016
NIPPON MICROMETAL CORPORATION
Takashi YAMADA
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
Publication number
20160093601
Publication date
Mar 31, 2016
Semiconductor Manufacturing International (Shanghai) Corporation
JINGXIU DING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Source Down Semiconductor Devices and Methods of Formation Thereof
Publication number
20160035654
Publication date
Feb 4, 2016
INFINEON TECHNOLOGIES AG
Manfred Schneegans
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING A DIELECTRIC MATERIAL
Publication number
20150235890
Publication date
Aug 20, 2015
INFINEON TECHNOLOGIES AG
Bernhard Goller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND RELATED MANUFACTURING METHOD
Publication number
20150187736
Publication date
Jul 2, 2015
Semiconductor Manufacturing International (Shanghai) Corporation
Fucheng CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TWO-STEP METHOD FOR JOINING A SEMICONDUCTOR TO A SUBSTRATE WITH CON...
Publication number
20150123263
Publication date
May 7, 2015
ROBERT BOSCH GmbH
Christiane Frueh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
Publication number
20140110740
Publication date
Apr 24, 2014
Nichia Corporation.
Masafumi KURAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
Publication number
20120298009
Publication date
Nov 29, 2012
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INTEGRATED CIRCUIT INCLUDING BOND WIRE DIRECTLY BONDED TO PAD
Publication number
20110260307
Publication date
Oct 27, 2011
INFINEON TECHNOLOGIES AG
Manfred Schneegans
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
Publication number
20100187563
Publication date
Jul 29, 2010
Masafumi Kuramoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP CHIP SEMICONDUCTOR ASSEMBLY WITH VARIABLE VOLUME SOLDER BUMPS
Publication number
20090218689
Publication date
Sep 3, 2009
ATI Technologies ULC
Vincent K. CHAN
H01 - BASIC ELECTRIC ELEMENTS