Temperature range 400 C=<T<450 C, 673.15K =<T< 723.15K

Industry

CPC
H01L2924/2011

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/2011Temperature range 400 C=<T<450 C, 673.15K =<T< 723.15K

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Process flow for fabrication of cap metal over top metal with sinte...
- Patent number 12,159,846
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for fabricating hybrid bonded structure
- Patent number 12,021,103
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including buffer layer
- Patent number 11,810,879
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3DIC formation with dies bonded to formed RDLs
- Patent number 11,810,899
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonded structure
- Patent number 11,437,422
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 11,417,619
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of designing a layout, method of making a semiconductor stru...
- Patent number 11,309,268
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,195,849
- Issue date Dec 7, 2021
- TOSHIBA MEMORY CORPORATION
- Yasuhito Yoshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC formation with dies bonded to formed RDLs
- Patent number 11,004,826
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Thermal bonding sheet, thermal bonding sheet with dicing tape, bond...
- Patent number 10,748,866
- Issue date Aug 18, 2020
- Nitto Denko Corporation
- Yuki Sugo
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device with post passivation structure
- Patent number 10,727,191
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid bonded structure
- Patent number 10,672,820
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste and die bonding method
- Patent number 10,615,144
- Issue date Apr 7, 2020
- Kaken Tech Co., Ltd.
- Shigeo Hori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Carrier-bonding methods and articles for semiconductor and interpos...
- Patent number 10,510,576
- Issue date Dec 17, 2019
- Corning Incorporated
- Darwin Gene Enicks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a die
- Patent number 10,340,227
- Issue date Jul 2, 2019
- Infineon Technologies AG
- Markus Zundel
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Nickel particle composition, bonding material, and bonding method i...
- Patent number 10,207,373
- Issue date Feb 19, 2019
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Takayuki Shimizu
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device with post passivation structure and fabricatio...
- Patent number 10,163,831
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device interconnections for high temperature operability
- Patent number 10,153,242
- Issue date Dec 11, 2018
- Kulite Semiconductor Products, Inc.
- Sorin Stefanescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method using bonding material
- Patent number 10,090,275
- Issue date Oct 2, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3DIC formation with dies bonded to formed RDLs
- Patent number 10,026,716
- Issue date Jul 17, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding material and bonding method using the same
- Patent number 10,008,471
- Issue date Jun 26, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device interconnections for high temperature operability
- Patent number 9,917,067
- Issue date Mar 13, 2018
- Kulite Semiconductor Products, Inc.
- Sorin Stefanescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source down semiconductor devices and methods of formation thereof
- Patent number 9,911,686
- Issue date Mar 6, 2018
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermo-compression bonding system, subsystems, and methods of use
- Patent number 9,911,710
- Issue date Mar 6, 2018
- MRSI Systems, LLC
- Nicholas Samuel Celia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste and die bonding method
- Patent number 9,818,718
- Issue date Nov 14, 2017
- Kaken Tech Co., Ltd.
- Shigeo Hori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass/ceramic replacement of epoxy for high temperature hermeticall...
- Patent number 9,601,400
- Issue date Mar 21, 2017
- Semtech Corporation
- Victor Hugo Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device use and method of production...
- Patent number 9,543,266
- Issue date Jan 10, 2017
- Nippon Micrometal Corporation
- Takashi Yamada
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...

Patents Applicationslast 30 patents

Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20240313026
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20220359601
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220336395
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210057362
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FLOW FOR FABRICATION OF CAP METAL OVER TOP METAL WITH SINTE...
- Publication number 20210005560
- Publication date Jan 7, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200303408
- Publication date Sep 24, 2020
- Toshiba Memory Corporation
- Yasuhito YOSHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED STRUCTURE
- Publication number 20200295070
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED STRUCTURE
- Publication number 20190157333
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Bonding Sheet, Thermal Bonding Sheet with Dicing Tape, Bond...
- Publication number 20190043824
- Publication date Feb 7, 2019
- NITTO DENKO CORPORATION
- Yuki Sugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Formation with Dies Bonded to Formed RDLs
- Publication number 20180323177
- Publication date Nov 8, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INTERCONNECTIONS FOR HIGH TEMPERATURE OPERABILITY
- Publication number 20180218988
- Publication date Aug 2, 2018
- Kulite Semiconductor Products, Inc.
- Sorin Stefanescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180122765
- Publication date May 3, 2018
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
3DIC Formation with Dies Bonded to Formed RDLs
- Publication number 20170301650
- Publication date Oct 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NICKEL PARTICLE COMPOSITION, BONDING MATERIAL, AND BONDING METHOD I...
- Publication number 20170136585
- Publication date May 18, 2017
- NIPPON STEEL & SUMIKIN CHEMICAL CO.,LTD.
- Takayuki SHIMIZU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PROCESSING A DIE
- Publication number 20160284648
- Publication date Sep 29, 2016
- INFINEON TECHNOLOGIES AG
- Markus ZUNDEL
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...
- Publication number 20160111389
- Publication date Apr 21, 2016
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...
- Publication number 20160104687
- Publication date Apr 14, 2016
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Source Down Semiconductor Devices and Methods of Formation Thereof
- Publication number 20160035654
- Publication date Feb 4, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Glass/Ceramic Replacement of Epoxy for High Temperature Hermeticall...
- Publication number 20150380333
- Publication date Dec 31, 2015
- SEMTECH CORPORATION
- Victor Hugo Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A DIELECTRIC MATERIAL
- Publication number 20150235890
- Publication date Aug 20, 2015
- INFINEON TECHNOLOGIES AG
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-STEP METHOD FOR JOINING A SEMICONDUCTOR TO A SUBSTRATE WITH CON...
- Publication number 20150123263
- Publication date May 7, 2015
- ROBERT BOSCH GmbH
- Christiane Frueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER-BONDING METHODS AND ARTICLES FOR SEMICONDUCTOR AND INTERPOS...
- Publication number 20150102498
- Publication date Apr 16, 2015
- Corning Incorporated
- Darwin Gene Enicks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140110740
- Publication date Apr 24, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS/CERAMICS REPLACEMENT OF EPOXY FOR HIGH TEMPERATURE HERMETICAL...
- Publication number 20130026490
- Publication date Jan 31, 2013
- Victor H. Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
- Publication number 20120298009
- Publication date Nov 29, 2012
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20100187563
- Publication date Jul 29, 2010
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS

Temperature range 400 C=<T<450 C, 673.15K =<T< 723.15K

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process flow for fabrication of cap metal over top metal with sinte...

Low pressure sintering powder

Method for fabricating hybrid bonded structure

Semiconductor structure including buffer layer

3DIC formation with dies bonded to formed RDLs

Hybrid bonded structure

Package and manufacturing method thereof

Sintering materials and attachment methods using same

Method of designing a layout, method of making a semiconductor stru...

Semiconductor device and method of manufacturing the same

3DIC formation with dies bonded to formed RDLs

Low pressure sintering powder

Thermal bonding sheet, thermal bonding sheet with dicing tape, bond...

Semiconductor device with post passivation structure

Hybrid bonded structure

Conductive paste and die bonding method

Carrier-bonding methods and articles for semiconductor and interpos...

Method for processing a die

Nickel particle composition, bonding material, and bonding method i...

Semiconductor device with post passivation structure and fabricatio...

Electronic device interconnections for high temperature operability

Bonding method using bonding material

3DIC formation with dies bonded to formed RDLs

Bonding material and bonding method using the same

Electronic device interconnections for high temperature operability

Source down semiconductor devices and methods of formation thereof

Thermo-compression bonding system, subsystems, and methods of use

Conductive paste and die bonding method

Glass/ceramic replacement of epoxy for high temperature hermeticall...

Bonding wire for semiconductor device use and method of production...

Patents Applicationslast 30 patents

LOW PRESSURE SINTERING POWDER

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE AND MANUFACTURING METHOD THEREOF

PROCESS FLOW FOR FABRICATION OF CAP METAL OVER TOP METAL WITH SINTE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

HYBRID BONDED STRUCTURE

HYBRID BONDED STRUCTURE

Thermal Bonding Sheet, Thermal Bonding Sheet with Dicing Tape, Bond...

3DIC Formation with Dies Bonded to Formed RDLs

ELECTRONIC DEVICE INTERCONNECTIONS FOR HIGH TEMPERATURE OPERABILITY

BONDING WIRE FOR SEMICONDUCTOR DEVICE

3DIC Formation with Dies Bonded to Formed RDLs

NICKEL PARTICLE COMPOSITION, BONDING MATERIAL, AND BONDING METHOD I...

METHOD FOR PROCESSING A DIE

BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...

BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...

Source Down Semiconductor Devices and Methods of Formation Thereof

Glass/Ceramic Replacement of Epoxy for High Temperature Hermeticall...

SEMICONDUCTOR DEVICE INCLUDING A DIELECTRIC MATERIAL

TWO-STEP METHOD FOR JOINING A SEMICONDUCTOR TO A SUBSTRATE WITH CON...

CARRIER-BONDING METHODS AND ARTICLES FOR SEMICONDUCTOR AND INTERPOS...

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

GLASS/CERAMICS REPLACEMENT OF EPOXY FOR HIGH TEMPERATURE HERMETICAL...

BONDING MATERIAL AND BONDING METHOD USING THE SAME

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR