Temperature range 450 C=<T<500 C, 723.15K =<T< 773.15K

Industry

CPC
H01L2924/20111

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/20111Temperature range 450 C=<T<500 C, 723.15K =<T< 773.15K

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device interconnections for high temperature operability
- Patent number 10,153,242
- Issue date Dec 11, 2018
- Kulite Semiconductor Products, Inc.
- Sorin Stefanescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method using bonding material
- Patent number 10,090,275
- Issue date Oct 2, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonding method using the same
- Patent number 10,008,471
- Issue date Jun 26, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device interconnections for high temperature operability
- Patent number 9,917,067
- Issue date Mar 13, 2018
- Kulite Semiconductor Products, Inc.
- Sorin Stefanescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source down semiconductor devices and methods of formation thereof
- Patent number 9,911,686
- Issue date Mar 6, 2018
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermo-compression bonding system, subsystems, and methods of use
- Patent number 9,911,710
- Issue date Mar 6, 2018
- MRSI Systems, LLC
- Nicholas Samuel Celia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass/ceramic replacement of epoxy for high temperature hermeticall...
- Patent number 9,601,400
- Issue date Mar 21, 2017
- Semtech Corporation
- Victor Hugo Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device use and method of production...
- Patent number 9,543,266
- Issue date Jan 10, 2017
- Nippon Micrometal Corporation
- Takashi Yamada
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Bonding wire for semiconductor device use and method of production...
- Patent number 9,536,854
- Issue date Jan 3, 2017
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Source down semiconductor devices and methods of formation thereof
- Patent number 9,368,436
- Issue date Jun 14, 2016
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a dielectric material
- Patent number 9,355,881
- Issue date May 31, 2016
- Infineon Technologies AG
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding material and bonding method using the same
- Patent number 9,240,256
- Issue date Jan 19, 2016
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 9,018,664
- Issue date Apr 28, 2015
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 8,642,392
- Issue date Feb 4, 2014
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE INTERCONNECTIONS FOR HIGH TEMPERATURE OPERABILITY
- Publication number 20180218988
- Publication date Aug 2, 2018
- Kulite Semiconductor Products, Inc.
- Sorin Stefanescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180122765
- Publication date May 3, 2018
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...
- Publication number 20160111389
- Publication date Apr 21, 2016
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...
- Publication number 20160104687
- Publication date Apr 14, 2016
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Source Down Semiconductor Devices and Methods of Formation Thereof
- Publication number 20160035654
- Publication date Feb 4, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Glass/Ceramic Replacement of Epoxy for High Temperature Hermeticall...
- Publication number 20150380333
- Publication date Dec 31, 2015
- SEMTECH CORPORATION
- Victor Hugo Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A DIELECTRIC MATERIAL
- Publication number 20150235890
- Publication date Aug 20, 2015
- INFINEON TECHNOLOGIES AG
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-STEP METHOD FOR JOINING A SEMICONDUCTOR TO A SUBSTRATE WITH CON...
- Publication number 20150123263
- Publication date May 7, 2015
- ROBERT BOSCH GmbH
- Christiane Frueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140110740
- Publication date Apr 24, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS/CERAMICS REPLACEMENT OF EPOXY FOR HIGH TEMPERATURE HERMETICAL...
- Publication number 20130026490
- Publication date Jan 31, 2013
- Victor H. Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
- Publication number 20120298009
- Publication date Nov 29, 2012
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20100187563
- Publication date Jul 29, 2010
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS

Temperature range 450 C=<T<500 C, 723.15K =<T< 773.15K

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device interconnections for high temperature operability

Bonding method using bonding material

Bonding material and bonding method using the same

Electronic device interconnections for high temperature operability

Source down semiconductor devices and methods of formation thereof

Thermo-compression bonding system, subsystems, and methods of use

Glass/ceramic replacement of epoxy for high temperature hermeticall...

Bonding wire for semiconductor device use and method of production...

Bonding wire for semiconductor device use and method of production...

Source down semiconductor devices and methods of formation thereof

Semiconductor device including a dielectric material

Bonding material and bonding method using the same

Semiconductor device and production method therefor

Semiconductor device and production method therefor

Patents Applicationslast 30 patents

ELECTRONIC DEVICE INTERCONNECTIONS FOR HIGH TEMPERATURE OPERABILITY

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...

BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...

Source Down Semiconductor Devices and Methods of Formation Thereof

Glass/Ceramic Replacement of Epoxy for High Temperature Hermeticall...

SEMICONDUCTOR DEVICE INCLUDING A DIELECTRIC MATERIAL

TWO-STEP METHOD FOR JOINING A SEMICONDUCTOR TO A SUBSTRATE WITH CON...

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

GLASS/CERAMICS REPLACEMENT OF EPOXY FOR HIGH TEMPERATURE HERMETICAL...

BONDING MATERIAL AND BONDING METHOD USING THE SAME

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR