Temperature ranges

Industry

CPC
H01L2924/201

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/201Temperature ranges

Industries

Patents Grantslast 30 patents

Information Patent Grant
Process flow for fabrication of cap metal over top metal with sinte...
- Patent number 12,159,846
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for fabricating hybrid bonded structure
- Patent number 12,021,103
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer and integrated circuit including redistributio...
- Patent number 12,021,046
- Issue date Jun 25, 2024
- STMicroelectronics S.r.l.
- Paolo Colpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage curing methodology by inducing curvature
- Patent number 11,929,260
- Issue date Mar 12, 2024
- Applied Materials, Inc.
- Fang Jie Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of power semiconductor device, power semicondu...
- Patent number 11,894,337
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Keisuke Kawamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, wire bonding structure, semic...
- Patent number 11,876,066
- Issue date Jan 16, 2024
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and manufacturing method thereof
- Patent number 11,817,414
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including buffer layer
- Patent number 11,810,879
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3DIC formation with dies bonded to formed RDLs
- Patent number 11,810,899
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding structures and semiconductor devices including the same
- Patent number 11,804,462
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the manufacture of integrated devices including a die fi...
- Patent number 11,756,916
- Issue date Sep 12, 2023
- STMicroelectronics S.r.l.
- Michele Calabretta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,652,072
- Issue date May 16, 2023
- Renesas Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method and mounting device
- Patent number 11,495,571
- Issue date Nov 8, 2022
- Toray Engineering Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the manufacture of integrated devices including a die fi...
- Patent number 11,482,503
- Issue date Oct 25, 2022
- STMicroelectronics S.r.l.
- Michele Calabretta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a redistribution layer, redistribution laye...
- Patent number 11,469,194
- Issue date Oct 11, 2022
- STMicroelectronics S.r.l.
- Paolo Colpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,456,264
- Issue date Sep 27, 2022
- Renesas Electronics Corporation
- Yoshiaki Sato
- G11 - INFORMATION STORAGE
Information Patent Grant
Joining material and joining method using same
- Patent number 11,453,053
- Issue date Sep 27, 2022
- Dowa Electronics Materials Co., Ltd.
- Satoru Kurita
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Integrated circuit (IC) packages employing split, double-sided meta...
- Patent number 11,456,291
- Issue date Sep 27, 2022
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonded structure
- Patent number 11,437,422
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating high-power module
- Patent number 11,426,793
- Issue date Aug 30, 2022
- National Cheng Kung University
- In-Gann Chen
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Film-shaped firing material and film-shaped firing material with a...
- Patent number 11,420,255
- Issue date Aug 23, 2022
- Lintec Corporation
- Isao Ichikawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Package and manufacturing method thereof
- Patent number 11,417,619
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced solder alloys for electronic interconnects
- Patent number 11,411,150
- Issue date Aug 9, 2022
- Alpha Assembly Solutions Inc.
- Morgana de Avila Ribas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Package structure and method for connecting components
- Patent number 11,355,472
- Issue date Jun 7, 2022
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dismantling a stack of at least three substrates
- Patent number 11,335,584
- Issue date May 17, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Pierre Montmeat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary bonding scheme
- Patent number 11,328,972
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of designing a layout, method of making a semiconductor stru...
- Patent number 11,309,268
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING STRESS CONTROL LAYER AND METHODS OF...
- Publication number 20240413034
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
- Publication number 20240404988
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
- Publication number 20240404989
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD
- Publication number 20240332116
- Publication date Oct 3, 2024
- Intel Corporation
- Chun Keang Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312868
- Publication date Sep 19, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20240313026
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...
- Publication number 20240274563
- Publication date Aug 15, 2024
- INFINEON TECHNOLOGIES AG
- Hock Heng CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...
- Publication number 20240258258
- Publication date Aug 1, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDE COOLED POWER MODULES
- Publication number 20240178126
- Publication date May 30, 2024
- Virginia Tech Intellectual Properties, Inc.
- Guo-Quan LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A HEAT DISSIPATION MEMBER
- Publication number 20240170366
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Jonggyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240164118
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuaki TSUCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128217
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
- Publication number 20240128227
- Publication date Apr 18, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Perceval COUDRAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING METHOD
- Publication number 20240038705
- Publication date Feb 1, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yunzhi LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU-CU DIRECT WELDING FOR PACKAGING APPLICATION IN SEMICONDUCTOR IND...
- Publication number 20240021574
- Publication date Jan 18, 2024
- The University of Hong Kong
- Mingxin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR AN ELECTRONIC CHIP
- Publication number 20230371167
- Publication date Nov 16, 2023
- CENTRE NATIONAL D'ETUDES SPATIALES
- Pascal FEBVRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230361062
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Huan Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE DIRECT BONDING
- Publication number 20230361074
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonding Pads and Methods of Forming the Same
- Publication number 20230307392
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230282611
- Publication date Sep 7, 2023
- FUJI ELECTRIC CO., LTD.
- Hiroki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AG PASTE COMPOSITION AND BONDING FILM PRODUCED USING SAME
- Publication number 20230260946
- Publication date Aug 17, 2023
- AMOGREENTECH CO., LTD.
- Younghwan JUN
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...
- Publication number 20230230950
- Publication date Jul 20, 2023
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Yuechen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230115289
- Publication date Apr 13, 2023
- Mitsubishi Electric Corporation
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...
- Publication number 20230005848
- Publication date Jan 5, 2023
- STMicroelectronics S.r.l.
- Paolo COLPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20220359601
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220336395
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER NANOPARTICLES SYNTHESIS METHOD FOR LOW TEMPERATURE AND PRESS...
- Publication number 20220108975
- Publication date Apr 7, 2022
- STMicroelectronics S.r.l.
- Cristina MANOLA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME
- Publication number 20220077100
- Publication date Mar 10, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...
- Publication number 20220077104
- Publication date Mar 10, 2022
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS

Temperature ranges

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process flow for fabrication of cap metal over top metal with sinte...

Solder reflow apparatus and method of manufacturing an electronic d...

Low pressure sintering powder

Method for fabricating hybrid bonded structure

Redistribution layer and integrated circuit including redistributio...

Low warpage curing methodology by inducing curvature

Manufacturing method of power semiconductor device, power semicondu...

Palladium-coated copper bonding wire, wire bonding structure, semic...

Display module and manufacturing method thereof

Semiconductor structure including buffer layer

3DIC formation with dies bonded to formed RDLs

Hybrid bonding structures and semiconductor devices including the same

Method for the manufacture of integrated devices including a die fi...

Semiconductor device and method of manufacturing the same

Mounting method and mounting device

Method for the manufacture of integrated devices including a die fi...

Method of manufacturing a redistribution layer, redistribution laye...

Method of manufacturing semiconductor device

Joining material and joining method using same

Integrated circuit (IC) packages employing split, double-sided meta...

Hybrid bonded structure

Method of fabricating high-power module

Film-shaped firing material and film-shaped firing material with a...

Package and manufacturing method thereof

Advanced solder alloys for electronic interconnects

Sintering materials and attachment methods using same

Package structure and method for connecting components

Method of dismantling a stack of at least three substrates

Temporary bonding scheme

Method of designing a layout, method of making a semiconductor stru...

Patents Applicationslast 30 patents

LOW PRESSURE SINTERING POWDER

SEMICONDUCTOR DEVICE INCLUDING STRESS CONTROL LAYER AND METHODS OF...

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...

SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD

SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...

SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...

DOUBLE-SIDE COOLED POWER MODULES

SEMICONDUCTOR PACKAGE WITH A HEAT DISSIPATION MEMBER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE

SUBSTRATE BONDING METHOD

CU-CU DIRECT WELDING FOR PACKAGING APPLICATION IN SEMICONDUCTOR IND...

SUBSTRATE FOR AN ELECTRONIC CHIP

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

LOW TEMPERATURE DIRECT BONDING

Die Bonding Pads and Methods of Forming the Same

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

AG PASTE COMPOSITION AND BONDING FILM PRODUCED USING SAME

SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

PACKAGE AND MANUFACTURING METHOD THEREOF

SILVER NANOPARTICLES SYNTHESIS METHOD FOR LOW TEMPERATURE AND PRESS...

HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME

METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...