TREA

Temperature settings

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  • CPC
  • H01L2224/84095
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/84095Temperature settings
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor module
    • Patent number 9,397,030
    • Issue date Jul 19, 2016
    • NSK Ltd.
    • Takashi Sunaga
    • B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS

Patents Applicationslast 30 patents