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H01L2224/85095

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85095Temperature settings

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Patents Grantslast 30 patents

Information Patent Grant
Multi-chip semiconductor packages and assembly thereof
- Patent number 8,836,101
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Chooi Mei Chong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...
- Publication number 20250197687
- Publication date Jun 19, 2025
- Resonac Corporation
- Yui KUNITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip Semiconductor Packages and Assembly Thereof
- Publication number 20120074546
- Publication date Mar 29, 2012
- Chooi Mei Chong
- H01 - BASIC ELECTRIC ELEMENTS