Temperature

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CPC
H01J37/32522

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Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge

Current Industry

H01J37/32522Temperature

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device and film forming appar...
- Patent number 12,191,193
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Tatsuya Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chamber and methods of treating a substrate after exposure to radia...
- Patent number 12,181,801
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Dmitry Lubomirsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote source pulsing with advanced pulse control
- Patent number 12,183,583
- Issue date Dec 31, 2024
- Tokyo Electron Limited
- Peter Lowell George Ventzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ semiconductor processing chamber temperature apparatus
- Patent number 12,183,605
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Andrew Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for temperature control in a substrate processing chamber
- Patent number 12,183,559
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Vishwas Kumar Pandey
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for processing substrate using plasma
- Patent number 12,176,185
- Issue date Dec 24, 2024
- Semes Co., Ltd.
- Min Sung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and interlock method thereof
- Patent number 12,170,188
- Issue date Dec 17, 2024
- Jusung Engineering Co., Ltd.
- Sang Kyo Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma generation
- Patent number 12,159,765
- Issue date Dec 3, 2024
- MKS Instruments, Inc.
- Ron Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooled shield for ICP source
- Patent number 12,159,770
- Issue date Dec 3, 2024
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Maolin Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 12,154,765
- Issue date Nov 26, 2024
- HITACHI HIGH-TECH CORPORATION
- Nanako Tamari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion source having different modes of operation
- Patent number 12,154,766
- Issue date Nov 26, 2024
- Applied Materials, Inc.
- Graham Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 12,148,598
- Issue date Nov 19, 2024
- Tokyo Electron Limited
- Lifu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembled monolayer deposition from low vapor pressure organic...
- Patent number 12,142,467
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF pulsing assisted low-k film deposition with high mechanical stre...
- Patent number 12,125,675
- Issue date Oct 22, 2024
- Applied Materials, Inc.
- Ruitong Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated epitaxy and preclean system
- Patent number 12,125,698
- Issue date Oct 22, 2024
- Applied Materials, Inc.
- Lara Hawrylchak
- B08 - CLEANING
Information Patent Grant
Temperature controlled reaction chamber
- Patent number 12,125,684
- Issue date Oct 22, 2024
- ASM IP Holding B.V.
- Jun Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition apparatus and method with EM radiation
- Patent number 12,110,587
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tze-Liang Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,094,694
- Issue date Sep 17, 2024
- Tokyo Electron Limited
- Sumi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Oxidative conversion in atomic layer deposition processes
- Patent number 12,087,574
- Issue date Sep 10, 2024
- Lam Research Corporation
- Douglas Walter Agnew
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etalon thermometry for plasma environments
- Patent number 12,078,547
- Issue date Sep 3, 2024
- Applied Materials, Inc.
- Bruce E. Adams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing chamber
- Patent number 12,080,524
- Issue date Sep 3, 2024
- BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Yan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma source having a dielectric plasma chamber with improved plas...
- Patent number 12,075,554
- Issue date Aug 27, 2024
- MKS Instruments, Inc.
- Xing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition part coating chamber
- Patent number 12,074,010
- Issue date Aug 27, 2024
- Applied Materials, Inc.
- Michael R. Rice
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Active gas generation apparatus
- Patent number 12,074,012
- Issue date Aug 27, 2024
- TMEIC Corporation
- Kensuke Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for cooling plasma treatment components
- Patent number 12,062,523
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng Kuang Tso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hydrogen peroxide plasma etch of ashable hard mask
- Patent number 12,057,320
- Issue date Aug 6, 2024
- RASIRO, Inc.
- Jeffrey J. Spiegelman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connect structure for semiconductor processing equipment
- Patent number 12,040,163
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Sze Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,040,179
- Issue date Jul 16, 2024
- Kokusai Electric Corporation
- Takaaki Noda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Nitriding apparatus and nitriding method
- Patent number 12,033,836
- Issue date Jul 9, 2024
- Kobe Steel, Ltd.
- Maiko Abe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Active temperature control for RF window in immersed antenna source
- Patent number 12,014,898
- Issue date Jun 18, 2024
- Applied Materials, Inc.
- Adam Calkins
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANIFOLD FOR SUPPLYING COOLANT TO COMPONENTS OF SUBSTRATE PROCESSIN...
- Publication number 20250006469
- Publication date Jan 2, 2025
- LAM RESEARCH CORPORATION
- Miguel Benjamin VASQUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION PART COATING CHAMBER
- Publication number 20240420926
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Michael R. RICE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS CHAMBERS HAVING MULTIPLE COOLING PLATES
- Publication number 20240412954
- Publication date Dec 12, 2024
- Dinkesh HUDERI SOMANNA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TEMPERATURE ADJUSTING SYSTEM, TEMPERATURE ADJUSTING METHOD, SUBSTRA...
- Publication number 20240412955
- Publication date Dec 12, 2024
- TOKYO ELECTRON LIMITED
- Masahiko YOKOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Workpiece Processing Apparatus and Methods for the Treatment of Wor...
- Publication number 20240404797
- Publication date Dec 5, 2024
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Ting Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION APPARATUS AND METHOD WITH EM RADIATION
- Publication number 20240384409
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tze-Liang Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETALON THERMOMETRY FOR PLASMA ENVIRONMENTS
- Publication number 20240385048
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Bruce E. ADAMS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PROCESSING SUBSTRATE
- Publication number 20240379332
- Publication date Nov 14, 2024
- PSK INC.
- Kwang-Sung YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR ION SOURCE TEMPERATURE CONTROL USING SYMMETRI...
- Publication number 20240371608
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Ryan Prager
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR COOLING PLASMA TREATMENT COMPONENTS
- Publication number 20240363312
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng Kuang Tso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAMBER LID Temperature COOLING SYSTEM
- Publication number 20240363313
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Santosh S. NESARKAR
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONNECT STRUCTURE FOR SEMICONDUCTOR PROCESSING EQUIPMENT
- Publication number 20240355591
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Sze Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHOWERHEAD TEMPERATURE BASED DEPOSITION TIME COMPENSATION FOR THICK...
- Publication number 20240344201
- Publication date Oct 17, 2024
- LAM RESEARCH CORPORATION
- Dong WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REGENERATOR FOR FORELINE HEATING
- Publication number 20240337449
- Publication date Oct 10, 2024
- Applied Materials, Inc.
- Santosh S. Nesarkar
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PLASMA ENHANCED EPITAXIAL CHEMICAL VAPOR DEPOSITION SYSTEM
- Publication number 20240331984
- Publication date Oct 3, 2024
- ASM IP HOLDING B.V.
- Yanfu Lu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INDIRECT PLASMA HEALTH MONITORING
- Publication number 20240321564
- Publication date Sep 26, 2024
- Applied Materials, Inc.
- Tobin Kaufman-Osborn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20240321559
- Publication date Sep 26, 2024
- TOKYO ELECTRON LIMITED
- Satoshi TAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20240321550
- Publication date Sep 26, 2024
- TOKYO ELECTRON LIMITED
- Masaki HIRAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SHOWERHEAD WITH THERMAL CONTROL FOR DELIVERING RADICAL A...
- Publication number 20240318312
- Publication date Sep 26, 2024
- LAM RESEARCH CORPORATION
- Rachel E. BATZER
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
ETCHING PROCESSING METHOD
- Publication number 20240312789
- Publication date Sep 19, 2024
- Hitachi High-Tech Corporation
- Takashi HATTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING...
- Publication number 20240312801
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Shohei ARAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS COOLING-WATER ISOLATION
- Publication number 20240312768
- Publication date Sep 19, 2024
- LAM RESEARCH CORPORATION
- Sreeram SONTI
- G01 - MEASURING TESTING
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20240297021
- Publication date Sep 5, 2024
- Hitachi High-Tech Corporation
- Yoshinori YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHER PRESSURE PURGE FOR IMPURITY REDUCTION IN RADICAL TREATMENT C...
- Publication number 20240290585
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Pradeep SAMPATH KUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD USING THE SAME
- Publication number 20240282586
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- Chanyeong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING CHAMBER
- Publication number 20240266150
- Publication date Aug 8, 2024
- Beijing NAURA Microelectronics Equipment Co., Ltd.
- Yan LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING GROUP III-NITRIDE SEMICONDUCTOR
- Publication number 20240266168
- Publication date Aug 8, 2024
- SCREEN Holdings Co., Ltd.
- Masaki INABA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20240263304
- Publication date Aug 8, 2024
- ASM IP HOLDING B.V.
- Seung Wook Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
UPPER ELECTRODE STRUCTURE AND PLASMA PROCESSING APPARATUS
- Publication number 20240249907
- Publication date Jul 25, 2024
- TOKYO ELECTRON LIMITED
- Tetsuji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS-FLOW-ENGINEERED PLASMA REACTOR FOR EFFICIENTLY PRODUCING FIXED...
- Publication number 20240234098
- Publication date Jul 11, 2024
- Nitricity Inc.
- John A. SCHWALBE
- H01 - BASIC ELECTRIC ELEMENTS

Temperature

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing semiconductor device and film forming appar...

Chamber and methods of treating a substrate after exposure to radia...

Remote source pulsing with advanced pulse control

In-situ semiconductor processing chamber temperature apparatus

Apparatus for temperature control in a substrate processing chamber

Apparatus and method for processing substrate using plasma

Substrate processing apparatus and interlock method thereof

Method and apparatus for plasma generation

Cooled shield for ICP source

Plasma processing apparatus and plasma processing method

Ion source having different modes of operation

Plasma processing apparatus

Self-assembled monolayer deposition from low vapor pressure organic...

RF pulsing assisted low-k film deposition with high mechanical stre...

Integrated epitaxy and preclean system

Temperature controlled reaction chamber

Deposition apparatus and method with EM radiation

Substrate processing apparatus and substrate processing method

Oxidative conversion in atomic layer deposition processes

Etalon thermometry for plasma environments

Semiconductor processing chamber

Plasma source having a dielectric plasma chamber with improved plas...

Atomic layer deposition part coating chamber

Active gas generation apparatus

Methods and systems for cooling plasma treatment components

Hydrogen peroxide plasma etch of ashable hard mask

Connect structure for semiconductor processing equipment

Method of manufacturing semiconductor device, substrate processing...

Nitriding apparatus and nitriding method

Active temperature control for RF window in immersed antenna source

Patents Applicationslast 30 patents

MANIFOLD FOR SUPPLYING COOLANT TO COMPONENTS OF SUBSTRATE PROCESSIN...

ATOMIC LAYER DEPOSITION PART COATING CHAMBER

PROCESS CHAMBERS HAVING MULTIPLE COOLING PLATES

TEMPERATURE ADJUSTING SYSTEM, TEMPERATURE ADJUSTING METHOD, SUBSTRA...

Workpiece Processing Apparatus and Methods for the Treatment of Wor...

DEPOSITION APPARATUS AND METHOD WITH EM RADIATION

ETALON THERMOMETRY FOR PLASMA ENVIRONMENTS

APPARATUS FOR PROCESSING SUBSTRATE

SYSTEM AND METHOD FOR ION SOURCE TEMPERATURE CONTROL USING SYMMETRI...

METHODS AND SYSTEMS FOR COOLING PLASMA TREATMENT COMPONENTS

CHAMBER LID Temperature COOLING SYSTEM

CONNECT STRUCTURE FOR SEMICONDUCTOR PROCESSING EQUIPMENT

SHOWERHEAD TEMPERATURE BASED DEPOSITION TIME COMPENSATION FOR THICK...

REGENERATOR FOR FORELINE HEATING

PLASMA ENHANCED EPITAXIAL CHEMICAL VAPOR DEPOSITION SYSTEM

INDIRECT PLASMA HEALTH MONITORING

PLASMA PROCESSING APPARATUS

PLASMA PROCESSING APPARATUS

INTEGRATED SHOWERHEAD WITH THERMAL CONTROL FOR DELIVERING RADICAL A...

ETCHING PROCESSING METHOD

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING...

PROCESS COOLING-WATER ISOLATION

PLASMA PROCESSING APPARATUS

HIGHER PRESSURE PURGE FOR IMPURITY REDUCTION IN RADICAL TREATMENT C...

WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD USING THE SAME

SEMICONDUCTOR PROCESSING CHAMBER

METHOD OF MANUFACTURING GROUP III-NITRIDE SEMICONDUCTOR

SUBSTRATE PROCESSING APPARATUS

UPPER ELECTRODE STRUCTURE AND PLASMA PROCESSING APPARATUS

GAS-FLOW-ENGINEERED PLASMA REACTOR FOR EFFICIENTLY PRODUCING FIXED...