Temperature

Industry

CPC
H01J37/32724

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Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge

Current Industry

H01J37/32724Temperature

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Edge seal for lower electrode assembly
- Patent number 12,368,025
- Issue date Jul 22, 2025
- Lam Research Corporation
- David Schaefer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lamellar ceramic structure
- Patent number 12,368,029
- Issue date Jul 22, 2025
- Lam Research Corporation
- Joel Philip Hollingsworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 12,368,050
- Issue date Jul 22, 2025
- Tokyo Electron Limited
- Masahiko Yokoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition method and deposition apparatus
- Patent number 12,368,030
- Issue date Jul 22, 2025
- Tokyo Electron Limited
- Hitoshi Kato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus and semiconductor fabrication method us...
- Patent number 12,362,216
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Daehyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, temperature control method of subst...
- Patent number 12,362,155
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Toshiharu Hirata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film formation apparatus
- Patent number 12,354,854
- Issue date Jul 8, 2025
- Shibaura Mechatronics Corporation
- Hisashi Nishigaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High aspect ratio etch with infinite selectivity
- Patent number 12,354,880
- Issue date Jul 8, 2025
- Lam Research Corporation
- Leonid Belau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck, substrate processing apparatus, and substrate...
- Patent number 12,354,852
- Issue date Jul 8, 2025
- Semes Co., Ltd.
- Hyun Tak Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and plasma etching apparatus
- Patent number 12,354,853
- Issue date Jul 8, 2025
- Tokyo Electron Limited
- Koki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-zone heater tuning in substrate heater
- Patent number 12,351,917
- Issue date Jul 8, 2025
- Applied Materials, Inc.
- Jun Ma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for treating substrate
- Patent number 12,347,694
- Issue date Jul 1, 2025
- Semes Co., Ltd.
- Dong-Hun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Susceptor assembly for plasma apparatus
- Patent number 12,347,644
- Issue date Jul 1, 2025
- ASM IP Holding B.V.
- Sam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stage and plasma processing apparatus
- Patent number 12,347,658
- Issue date Jul 1, 2025
- Tokyo Electron Limited
- Ryota Sakane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic filter and plasma processing apparatus having the same
- Patent number 12,347,655
- Issue date Jul 1, 2025
- FNS.INC.
- Kwankoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck assembly for cryogenic applications
- Patent number 12,347,659
- Issue date Jul 1, 2025
- Applied Materials, Inc.
- Vijay D. Parkhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member for semiconductor manufacturing apparatus
- Patent number 12,340,990
- Issue date Jun 24, 2025
- NGK Insulators, Ltd.
- Hiroshi Takebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature control apparatus for semiconductor processing equipmen...
- Patent number 12,341,037
- Issue date Jun 24, 2025
- ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA
- Kui Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck including a heater element with mutiple heating...
- Patent number 12,341,049
- Issue date Jun 24, 2025
- Toto Ltd.
- Akihito Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate fixing device
- Patent number 12,340,991
- Issue date Jun 24, 2025
- Shinko Electric Industries Co., Ltd.
- Aya Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooled substrate support assembly for radio frequency environments
- Patent number 12,334,315
- Issue date Jun 17, 2025
- Applied Materials, Inc.
- Vijay D. Parkhe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate support gap pumping to prevent glow discharge and light-up
- Patent number 12,334,383
- Issue date Jun 17, 2025
- Applied Materials, Inc.
- James David Carducci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cryogenic micro-zone electrostatic chuck connector assembly
- Patent number 12,331,984
- Issue date Jun 17, 2025
- Applied Materials, Inc.
- Vijay D. Parkhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter device and plasma processing apparatus
- Patent number 12,334,309
- Issue date Jun 17, 2025
- Tokyo Electron Limited
- Naohiko Okunishi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 12,334,316
- Issue date Jun 17, 2025
- HITACHI HIGH-TECH CORPORATION
- Takamasa Ichino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing substrate
- Patent number 12,327,735
- Issue date Jun 10, 2025
- Semes Co., Ltd.
- Seong Gil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck with improved temperature control
- Patent number 12,322,633
- Issue date Jun 3, 2025
- Applied Materials, Inc.
- Hanish Kumar Panavalappil Kumarankutty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-zone heater control for wafer processing equipment
- Patent number 12,317,378
- Issue date May 27, 2025
- Applied Materials, Inc.
- Uwe P. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting table structure, substrate processing apparatus, and metho...
- Patent number 12,315,707
- Issue date May 27, 2025
- Tokyo Electron Limited
- Motoi Yamagata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for treating substrate
- Patent number 12,315,708
- Issue date May 27, 2025
- Semes Co., Ltd.
- Su Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ETCHING METHOD, PRECOAT METHOD, AND ETCHING APPARATUS
- Publication number 20250239476
- Publication date Jul 24, 2025
- TOKYO ELECTRON LIMITED
- Takamitsu TAKAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA MULTI-WAFER ASHING SYSTEM
- Publication number 20250237959
- Publication date Jul 24, 2025
- Rockwell Collins, Inc.
- Mark J. Reimer
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Substrate Processing Apparatus
- Publication number 20250232963
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Motoi YAMAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20250232962
- Publication date Jul 17, 2025
- Hitachi High-Tech Corporation
- Yuki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SYSTEM AND PROCESSING METHOD
- Publication number 20250232967
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Norihiko AMIKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGE AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250226190
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Takayuki ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20250226207
- Publication date Jul 10, 2025
- Kokusai Electric Corporation
- Yasunobu KOSHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250218825
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- Jae Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR HEATING A WIDE BANDGAP SUBSTRATE
- Publication number 20250215551
- Publication date Jul 3, 2025
- Silanna UV Technologies Pte Ltd
- Petar Atanackovic
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE HOLDING UNIT AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250218843
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Iksu BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20250218744
- Publication date Jul 3, 2025
- TOKYO ELECTRON LIMITED
- Naoki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATING APPARATUS AND METHOD
- Publication number 20250218741
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- Jin Hyeok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20250210326
- Publication date Jun 26, 2025
- NGK Insulators, Ltd.
- Seiya INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT TRANSFER MEMBER, METHOD FOR MANUFACTURING HEAT TRANSFER MEMBER...
- Publication number 20250210318
- Publication date Jun 26, 2025
- MITSUBISHI MATERIALS CORPORATION
- Miho Shoji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20250210328
- Publication date Jun 26, 2025
- TOKYO ELECTRON LIMITED
- Sho KUMAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS INCLUDING SUBSTRATE SUPPORT UNIT
- Publication number 20250210395
- Publication date Jun 26, 2025
- SEMES CO., LTD.
- Kuk Saeng KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250210327
- Publication date Jun 26, 2025
- TOKYO ELECTRON LIMITED
- Takahiro YONEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING OF SILICON OXIDE AT CRYOGENIC TEMPERATURE
- Publication number 20250210367
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Sonam Dorje SHERPA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESC DESIGN WITH ENHANCED TUNABILITY FOR WAFER FAR EDGE PLASMA PROFI...
- Publication number 20250201538
- Publication date Jun 19, 2025
- Applied Materials, Inc.
- Jian LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND TEMPERATURE MEASUREMENT METHOD
- Publication number 20250201601
- Publication date Jun 19, 2025
- TOKYO ELECTRON LIMITED
- Kazuhito YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR DEPOSITING A LAYER
- Publication number 20250201526
- Publication date Jun 19, 2025
- ASM IP HOLDING B.V.
- Daniele Piumi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HEATER CIRCUIT, CONTROLLING METHOD THEREOF, AND SUBSTRATE PROCESSIN...
- Publication number 20250201615
- Publication date Jun 19, 2025
- SEMES CO., LTD.
- Byeong Hyeon KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK DEVICE AND COOLING PLATE
- Publication number 20250191956
- Publication date Jun 12, 2025
- HORIBA STEC, CO., LTD.
- Esteban GONZALEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOWRATE CONTROL UNIT FOR TEMPERATURE ADJUSTMENT AND SEMICONDUCTOR...
- Publication number 20250191895
- Publication date Jun 12, 2025
- CKD CORPORATION
- Yuko SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPARK PLASMA SINTERED COMPONENT FOR CRYO-PLASMA PROCESSING
- Publication number 20250191893
- Publication date Jun 12, 2025
- LAM RESEARCH CORPORATION
- Lin XU
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
SUBSTRATE TREATMENT APPARATUS AND METHOD OF CLEANING INSIDE OF CHAMBER
- Publication number 20250191896
- Publication date Jun 12, 2025
- ASM IP HOLDING B.V.
- Ryo MIYAMA
- B08 - CLEANING
Information Patent Application
Electrostatic Chuck Assembly for Plasma Processing Apparatus
- Publication number 20250191958
- Publication date Jun 12, 2025
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Maolin Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER CABLE FOR HEATED COMPONENTS IN RF ENVIRONMENT
- Publication number 20250183015
- Publication date Jun 5, 2025
- LAM RESEARCH CORPORATION
- Seyed Jafar JAFARIAN-TEHRANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS INCLUDING THE SAME
- Publication number 20250183014
- Publication date Jun 5, 2025
- SEMES CO., LTD.
- Won Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEDESTAL THERMAL PROFILE TUNING USING MULTIPLE HEATED ZONES AND THE...
- Publication number 20250179633
- Publication date Jun 5, 2025
- LAM RESEARCH CORPORATION
- Gary B. LIND
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Temperature

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Edge seal for lower electrode assembly

Lamellar ceramic structure

Plasma processing method and plasma processing apparatus

Deposition method and deposition apparatus

Plasma processing apparatus and semiconductor fabrication method us...

Substrate processing apparatus, temperature control method of subst...

Film formation apparatus

High aspect ratio etch with infinite selectivity

Electrostatic chuck, substrate processing apparatus, and substrate...

Etching method and plasma etching apparatus

Multi-zone heater tuning in substrate heater

Method and apparatus for treating substrate

Susceptor assembly for plasma apparatus

Stage and plasma processing apparatus

Electromagnetic filter and plasma processing apparatus having the same

Electrostatic chuck assembly for cryogenic applications

Member for semiconductor manufacturing apparatus

Temperature control apparatus for semiconductor processing equipmen...

Electrostatic chuck including a heater element with mutiple heating...

Substrate fixing device

Cooled substrate support assembly for radio frequency environments

Substrate support gap pumping to prevent glow discharge and light-up

Cryogenic micro-zone electrostatic chuck connector assembly

Filter device and plasma processing apparatus

Plasma processing apparatus and plasma processing method

Apparatus and method for processing substrate

Electrostatic chuck with improved temperature control

Multi-zone heater control for wafer processing equipment

Mounting table structure, substrate processing apparatus, and metho...

Apparatus for treating substrate

Patents Applicationslast 30 patents

ETCHING METHOD, PRECOAT METHOD, AND ETCHING APPARATUS

PLASMA MULTI-WAFER ASHING SYSTEM

Substrate Processing Apparatus

PLASMA PROCESSING APPARATUS

PROCESSING SYSTEM AND PROCESSING METHOD

STAGE AND SUBSTRATE PROCESSING APPARATUS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

SUBSTRATE PROCESSING APPARATUS

METHODS AND SYSTEMS FOR HEATING A WIDE BANDGAP SUBSTRATE

SUBSTRATE HOLDING UNIT AND SUBSTRATE PROCESSING APPARATUS

PLASMA PROCESSING APPARATUS

SUBSTRATE TREATING APPARATUS AND METHOD

MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS

HEAT TRANSFER MEMBER, METHOD FOR MANUFACTURING HEAT TRANSFER MEMBER...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

SUBSTRATE PROCESSING APPARATUS INCLUDING SUBSTRATE SUPPORT UNIT

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

ATOMIC LAYER ETCHING OF SILICON OXIDE AT CRYOGENIC TEMPERATURE

ESC DESIGN WITH ENHANCED TUNABILITY FOR WAFER FAR EDGE PLASMA PROFI...

PLASMA PROCESSING APPARATUS AND TEMPERATURE MEASUREMENT METHOD

METHODS AND SYSTEMS FOR DEPOSITING A LAYER

HEATER CIRCUIT, CONTROLLING METHOD THEREOF, AND SUBSTRATE PROCESSIN...

ELECTROSTATIC CHUCK DEVICE AND COOLING PLATE

FLOWRATE CONTROL UNIT FOR TEMPERATURE ADJUSTMENT AND SEMICONDUCTOR...

SPARK PLASMA SINTERED COMPONENT FOR CRYO-PLASMA PROCESSING

SUBSTRATE TREATMENT APPARATUS AND METHOD OF CLEANING INSIDE OF CHAMBER

Electrostatic Chuck Assembly for Plasma Processing Apparatus

HIGH POWER CABLE FOR HEATED COMPONENTS IN RF ENVIRONMENT

ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS INCLUDING THE SAME

PEDESTAL THERMAL PROFILE TUNING USING MULTIPLE HEATED ZONES AND THE...