Temperature

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CPC
H01J37/32724

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Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge

Current Industry

H01J37/32724Temperature

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wafer support table and RF rod
- Patent number 12,170,190
- Issue date Dec 17, 2024
- NGK Insulators, Ltd.
- Yutaka Unno
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate supporting apparatus and substrate treating apparatus inc...
- Patent number 12,170,191
- Issue date Dec 17, 2024
- Semes Co., Ltd.
- Jong Gun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method for manufacturing semiconductor structure
- Patent number 12,165,851
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lun Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic heater
- Patent number 12,165,855
- Issue date Dec 10, 2024
- NGK Insulators, Ltd.
- Hideaki Takasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etch process using plasma in conjunction with a rapid...
- Patent number 12,159,789
- Issue date Dec 3, 2024
- BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY, CO., LTD
- Shawming Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck sidewall gas curtain
- Patent number 12,154,813
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ian Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support
- Patent number 12,148,636
- Issue date Nov 19, 2024
- Tokyo Electron Limited
- Masanori Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma uniformity control in pulsed DC plasma chamber
- Patent number 12,148,595
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Linying Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and temperature control method
- Patent number 12,142,501
- Issue date Nov 12, 2024
- Tokyo Electron Limited
- Kenichiro Yamada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 12,142,465
- Issue date Nov 12, 2024
- Tokyo Electron Limited
- Sho Hiraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress treatments for cover wafers
- Patent number 12,142,468
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Vinayak Vishwanath Hassan
- B24 - GRINDING POLISHING
Information Patent Grant
Method of reducing leakage of heat transfer gas and plasma processi...
- Patent number 12,142,462
- Issue date Nov 12, 2024
- Tokyo Electron Limited
- Shinsuke Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In situ real-time sensing and compensation of non-uniformities in s...
- Patent number 12,142,464
- Issue date Nov 12, 2024
- Lam Research Corporation
- Changyou Jing
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing device and method for manufacturing same
- Patent number 12,136,540
- Issue date Nov 5, 2024
- LG Display Co., Ltd.
- Young Gon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Operating method of etching device
- Patent number 12,131,892
- Issue date Oct 29, 2024
- NANYA TECHNOLOGY CORPORATION
- Feng-Ju Tsai
- B08 - CLEANING
Information Patent Grant
Chuck for plasma processing chamber
- Patent number 12,131,890
- Issue date Oct 29, 2024
- Lam Research Corporation
- Ann Erickson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate support leveling apparatus
- Patent number 12,131,934
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Katherine Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer placement table
- Patent number 12,131,891
- Issue date Oct 29, 2024
- NGK Insulators, Ltd.
- Seiya Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter unit, substrate treating apparatus including the same, and s...
- Patent number 12,125,678
- Issue date Oct 22, 2024
- Semes Co., Ltd.
- Ogsen Galstyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum seal for electrostatic chuck
- Patent number 12,125,734
- Issue date Oct 22, 2024
- Applied Materials, Inc.
- Vijay D. Parkhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 12,119,211
- Issue date Oct 15, 2024
- ASM IP Holding B.V.
- ChangMin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer support device
- Patent number 12,119,212
- Issue date Oct 15, 2024
- Sumitomo Osaka Cement Co., Ltd.
- Masaki Hirayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rotating biasable pedestal and electrostatic chuck in semiconductor...
- Patent number 12,112,972
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 12,112,921
- Issue date Oct 8, 2024
- Tokyo Electron Limited
- Hiroyuki Ikuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and method of manufacturing semiconduct...
- Patent number 12,106,945
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Siqing Lu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatic chuck
- Patent number 12,106,994
- Issue date Oct 1, 2024
- NGK Insulators, Ltd.
- Tatsuya Kuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and method for dechucking wafer in the...
- Patent number 12,106,942
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Yi Rop Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate halo arrangement for improved process uniformity
- Patent number 12,106,943
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Jay R. Wallace
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stage device and substrate processing apparatus
- Patent number 12,094,753
- Issue date Sep 17, 2024
- Tokyo Electron Limited
- Melvin Verbaas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bipolar esc with balanced RF impedance
- Patent number 12,094,748
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ATOMIC LAYER DEPOSITION PART COATING CHAMBER
- Publication number 20240420926
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Michael R. RICE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT
- Publication number 20240420932
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Yogananda Sarode Vishwanath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSED PLASMA SOURCE AND PROCESS CHAMBER FOR LARGE AREA SUBSTRATES
- Publication number 20240420921
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Kenneth S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTIVITY-CONTROLLED DIELECTRIC MATERIALS FOR SUBSTRATE SUPPORTS...
- Publication number 20240420933
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Amir H. Tavakoli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240414919
- Publication date Dec 12, 2024
- SEMES CO., LTD.
- Sung Min CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH TEMPERATURE BIASABLE HEATER WITH ADVANCED FAR EDGE ELECTRODE,...
- Publication number 20240412957
- Publication date Dec 12, 2024
- Applied Materials, Inc.
- Gautam PISHARODY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PROCESSING APPARATUS, THERMAL PROCESSING METHOD, AND SUBSTR...
- Publication number 20240412989
- Publication date Dec 12, 2024
- SEMES CO., LTD.
- Young Eun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR CLAMPING A SUBSTRATE ON A MONO-POLAR ELECTROSTATIC CH...
- Publication number 20240404861
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- SUSHIM KOSHTI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH POWER ELECTROSTATIC CHUCK WITH FEATURES PREVENTING HE HOLE LIG...
- Publication number 20240404798
- Publication date Dec 5, 2024
- LAM RESEARCH CORPORATION
- Alexander MATYUSHKIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSCEPTOR MANUFACTURING METHOD AND THE MANUFACTURED SUSCEPTOR USING...
- Publication number 20240404779
- Publication date Dec 5, 2024
- ASM IP HOLDING B.V.
- Hoyoun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240404802
- Publication date Dec 5, 2024
- Kokusai Electric Corporation
- Atsushi Moriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20240404799
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Shota EZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Workpiece Processing Apparatus and Methods for the Treatment of Wor...
- Publication number 20240404797
- Publication date Dec 5, 2024
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Ting Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PLACEMENT TABLE
- Publication number 20240395511
- Publication date Nov 28, 2024
- NGK Insulators, Ltd.
- Taro USAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PLASMA PROCESSING AND METHOD OF ETCHING
- Publication number 20240395509
- Publication date Nov 28, 2024
- TOKYO ELECTRON LIMITED
- Chishio KOSHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRESSIVE HEATING OF COMPONENTS OF SUBSTRATE PROCESSING SYSTEMS U...
- Publication number 20240395569
- Publication date Nov 28, 2024
- LAM RESEARCH CORPORATION
- Ramesh CHANDRASEKHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SYSTEM FOR PROCESSING CHAMBER
- Publication number 20240393018
- Publication date Nov 28, 2024
- LAM RESEARCH CORPORATION
- Kevin FLYNN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS WITH IMPROVED PRODUCTION YIELD
- Publication number 20240384404
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jia-Wei XU
- B08 - CLEANING
Information Patent Application
SUBSTRATE SUPPORT APPARATUS AND SUBSTRATE PROCESSING APPARATUS HAVI...
- Publication number 20240387234
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- JUNHYUNG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE PLASMA DEPOSITION WITH ELECTROSTATIC CLAMPING
- Publication number 20240387226
- Publication date Nov 21, 2024
- LAM RESEARCH CORPORATION
- Aaron Blake MILLER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
AFE (ACTIVE FAR EDGE) HEATER/BIPOLAR ESC WITH SIMPLIFIED AND OPTIMI...
- Publication number 20240387154
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Juan Carlos ROCHA-ALVAREZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR ADJUSTING THE GAP BETWEEN A WAFER AND A TOP P...
- Publication number 20240387299
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chan LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electrostatic Chuck Sidewall Gas Curtain
- Publication number 20240387228
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ian HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJ...
- Publication number 20240387185
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHUCK STRUCTURE WITH HOLES IN UPPER SURFACE TO IMPROVE TEMPER...
- Publication number 20240379400
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Jung Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COOLANT TUBE BLOCK ASSEMBLY AND SEMICONDUCTOR PROCESSING DEVICE INC...
- Publication number 20240379334
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Woojin Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CATHODE ASSEMBLY FOR ELECTRON GUN
- Publication number 20240363303
- Publication date Oct 31, 2024
- Freemelt AB
- Ulric LJUNGBLAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE DE-CHUCKING VOLTAGE
- Publication number 20240363315
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Andrew NGUYEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PLACEMENT TABLE
- Publication number 20240355656
- Publication date Oct 24, 2024
- NGK Insulators, Ltd.
- Tatsuya KUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PARAMETER PLASMA ASHING TECHNIQUES
- Publication number 20240355595
- Publication date Oct 24, 2024
- Micron Technology, Inc.
- Rachmat Wibowo
- H01 - BASIC ELECTRIC ELEMENTS

Temperature

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer support table and RF rod

Substrate supporting apparatus and substrate treating apparatus inc...

Plasma processing method for manufacturing semiconductor structure

Ceramic heater

Atomic layer etch process using plasma in conjunction with a rapid...

Electrostatic chuck sidewall gas curtain

Substrate support

Plasma uniformity control in pulsed DC plasma chamber

Substrate processing system and temperature control method

Plasma processing method and plasma processing apparatus

Stress treatments for cover wafers

Method of reducing leakage of heat transfer gas and plasma processi...

In situ real-time sensing and compensation of non-uniformities in s...

Substrate processing device and method for manufacturing same

Operating method of etching device

Chuck for plasma processing chamber

Semiconductor substrate support leveling apparatus

Wafer placement table

Filter unit, substrate treating apparatus including the same, and s...

Vacuum seal for electrostatic chuck

Substrate processing apparatus

Wafer support device

Rotating biasable pedestal and electrostatic chuck in semiconductor...

Plasma processing method and plasma processing apparatus

Plasma processing apparatus and method of manufacturing semiconduct...

Electrostatic chuck

Plasma processing apparatus and method for dechucking wafer in the...

Substrate halo arrangement for improved process uniformity

Stage device and substrate processing apparatus

Bipolar esc with balanced RF impedance

Patents Applicationslast 30 patents

ATOMIC LAYER DEPOSITION PART COATING CHAMBER

SUBSTRATE SUPPORT

IMMERSED PLASMA SOURCE AND PROCESS CHAMBER FOR LARGE AREA SUBSTRATES

RESISTIVITY-CONTROLLED DIELECTRIC MATERIALS FOR SUBSTRATE SUPPORTS...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

HIGH TEMPERATURE BIASABLE HEATER WITH ADVANCED FAR EDGE ELECTRODE,...

THERMAL PROCESSING APPARATUS, THERMAL PROCESSING METHOD, AND SUBSTR...

APPARATUS FOR CLAMPING A SUBSTRATE ON A MONO-POLAR ELECTROSTATIC CH...

HIGH POWER ELECTROSTATIC CHUCK WITH FEATURES PREVENTING HE HOLE LIG...

SUSCEPTOR MANUFACTURING METHOD AND THE MANUFACTURED SUSCEPTOR USING...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

PLASMA PROCESSING APPARATUS

Workpiece Processing Apparatus and Methods for the Treatment of Wor...

WAFER PLACEMENT TABLE

APPARATUS FOR PLASMA PROCESSING AND METHOD OF ETCHING

PROGRESSIVE HEATING OF COMPONENTS OF SUBSTRATE PROCESSING SYSTEMS U...

COOLING SYSTEM FOR PROCESSING CHAMBER

SEMICONDUCTOR MANUFACTURING APPARATUS WITH IMPROVED PRODUCTION YIELD

SUBSTRATE SUPPORT APPARATUS AND SUBSTRATE PROCESSING APPARATUS HAVI...

REMOTE PLASMA DEPOSITION WITH ELECTROSTATIC CLAMPING

AFE (ACTIVE FAR EDGE) HEATER/BIPOLAR ESC WITH SIMPLIFIED AND OPTIMI...

METHOD AND SYSTEM FOR ADJUSTING THE GAP BETWEEN A WAFER AND A TOP P...

Electrostatic Chuck Sidewall Gas Curtain

BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJ...

WAFER CHUCK STRUCTURE WITH HOLES IN UPPER SURFACE TO IMPROVE TEMPER...

COOLANT TUBE BLOCK ASSEMBLY AND SEMICONDUCTOR PROCESSING DEVICE INC...

CATHODE ASSEMBLY FOR ELECTRON GUN

ADJUSTABLE DE-CHUCKING VOLTAGE

WAFER PLACEMENT TABLE

LOW PARAMETER PLASMA ASHING TECHNIQUES