Template for holding a PCB having mounted components thereon

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CPC
H05K2203/0173

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0173Template for holding a PCB having mounted components thereon

Industries

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Patents Grantslast 30 patents

Information Patent Grant
On-demand method of making PCB pallets using additive manufacturing
- Patent number 12,041,723
- Issue date Jul 16, 2024
- JABIL INC.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wave solder pallets for optimal solder flow and methods of manufact...
- Patent number 11,850,684
- Issue date Dec 26, 2023
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
On-demand method of making PCB pallets using additive manufacturing
- Patent number 11,589,487
- Issue date Feb 21, 2023
- Jabil Inc.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus for holding a printed circuit board
- Patent number 10,798,856
- Issue date Oct 6, 2020
- PROTOSONIC LIMITED
- Niall Barrett
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wave solder pallet
- Patent number 10,737,344
- Issue date Aug 11, 2020
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Scalable fabrication techniques and circuit packaging devices
- Patent number 10,506,715
- Issue date Dec 10, 2019
- The Regents of the University of California
- Todd Prentice Coleman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Occam process for components having variations in part dimensions
- Patent number 9,894,771
- Issue date Feb 13, 2018
- Joseph Charles Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembling lighting elements onto a substrate
- Patent number 8,398,448
- Issue date Mar 19, 2013
- Koninklijke Electronics N.V.
- Josef Andreas Schug
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for connecting a wiring board
- Patent number 8,108,991
- Issue date Feb 7, 2012
- Sony Chemical & Information Device Corporation
- Masao Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for controlling alignment between precision ground plates...
- Patent number 8,106,331
- Issue date Jan 31, 2012
- International Business Machines Corporation
- Anthony F. Coneski
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Retaining apparatus for a flexible printed circuit board
- Patent number 8,009,432
- Issue date Aug 30, 2011
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Ying Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder and lead-free electronic circuit and method of manufacturing...
- Patent number 8,004,856
- Issue date Aug 23, 2011
- Carmen Rapisarda
- A43 - FOOTWEAR
Information Patent Grant
Transfer assembly for manufacturing electronic devices
- Patent number 7,931,063
- Issue date Apr 26, 2011
- Alien Technology Corporation
- Gordon S. W. Craig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a circuit assembly
- Patent number 7,926,173
- Issue date Apr 19, 2011
- Occam Portfolio LLC
- Joseph C. Fjelstad
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic component mounting method
- Patent number 7,921,551
- Issue date Apr 12, 2011
- Panasonic Corporation
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package structures and methods
- Patent number 7,777,313
- Issue date Aug 17, 2010
- Analog Devices, Inc.
- Roy Vesper Buck, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing apparatus and method for bonding material
- Patent number 7,712,432
- Issue date May 11, 2010
- Panasonic Corporation
- Naoichi Chikahisa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting electronic components on a substrate
- Patent number 7,621,042
- Issue date Nov 24, 2009
- Alps Electric Co., Ltd.
- Yasushi Watanbe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite base plate for a data storage device having an integral p...
- Patent number 7,483,237
- Issue date Jan 27, 2009
- Seagate Technology LLC
- Yiren Hong
- G11 - INFORMATION STORAGE
Information Patent Grant
Laminated printed circuit board fixture assembly and method
- Patent number 7,359,207
- Issue date Apr 15, 2008
- Bruce Arnold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Singular molded and co-molded electronic's packaging pre-forms
- Patent number 7,357,886
- Issue date Apr 15, 2008
- Lauren A. Groth
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Transfer assembly for manufacturing electronic devices
- Patent number 7,244,326
- Issue date Jul 17, 2007
- Alien Technology Corporation
- Gordon S. W. Craig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic apparatus and method for manufacturing the same
- Patent number 7,209,367
- Issue date Apr 24, 2007
- Denso Corporation
- Tetsuo Nakano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for clamping printed circuit boards inside an electronic...
- Patent number 7,162,793
- Issue date Jan 16, 2007
- Northrop Grumman Corporation
- Mark Kintis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a bonding tool
- Patent number 6,860,418
- Issue date Mar 1, 2005
- Lockheed Martin Corporation
- Mary Patricia Thomas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount IC stacking method and device
- Patent number 6,849,480
- Issue date Feb 1, 2005
- Seagate Technology LLC
- Chau Chin Low
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated printed circuit board fixture assembly and method
- Patent number 6,775,146
- Issue date Aug 10, 2004
- Bruce Arnold
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of attaching printed circuits boards within an electronic mo...
- Patent number 6,708,400
- Issue date Mar 23, 2004
- Northrop Grumman Corporation
- Mark Kintis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for electronics board retention during manufac...
- Patent number 6,635,308
- Issue date Oct 21, 2003
- Motorola, Inc.
- Jeff Forrest
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ignition coil cassette assembly
- Patent number 6,622,711
- Issue date Sep 23, 2003
- Delphi Technologies, Inc.
- Albert Anthony Skinner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
System, process and a jig for forming conformal EMI shield on packa...
- Publication number 20220386450
- Publication date Dec 1, 2022
- Inari Technology Sdn Bhd
- Boon Siew Ng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE-SIDED ASSEMBLY ON FLEXIBLE SUBSTRATES
- Publication number 20210076504
- Publication date Mar 11, 2021
- Molex, LLC
- Michael DEPPE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAVE SOLDER PALLETS FOR OPTIMAL SOLDER FLOW AND METHODS OF MANUFACT...
- Publication number 20200180059
- Publication date Jun 11, 2020
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAVE SOLDER PALLETS FOR OPTIMAL SOLDER FLOW AND METHODS OF MANUFACT...
- Publication number 20200180060
- Publication date Jun 11, 2020
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Burned-in Component Assembly
- Publication number 20190174630
- Publication date Jun 6, 2019
- VNS Portfolio LLC
- Joseph Charles Fjelstad
- B32 - LAYERED PRODUCTS
Information Patent Application
SCALABLE FABRICATION TECHNIQUES AND CIRCUIT PACKAGING DEVICES
- Publication number 20160330837
- Publication date Nov 10, 2016
- The Regents of the University of California
- Todd Prentice Coleman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BONDING METHOD
- Publication number 20140263581
- Publication date Sep 18, 2014
- ALPHA DESIGN CO., LTD.
- Toshiyuki SHIRATORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVABLE CONFORMAL RADIO FREQUENCY SHIELDS
- Publication number 20140215805
- Publication date Aug 7, 2014
- QUALCOMM Incorporated
- Yang ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder-Less Electrical Assembly
- Publication number 20130329407
- Publication date Dec 12, 2013
- CARMEN RAPISARDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULAR AND CO-MOLDED PRE-FORMS
- Publication number 20120323352
- Publication date Dec 20, 2012
- Lauren Groth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Occam Process for Components Having Variations in Part Dimensions
- Publication number 20110315302
- Publication date Dec 29, 2011
- OCCAM PORTFOLIO LLC
- Joseph Charles Fjelstad
- B32 - LAYERED PRODUCTS
Information Patent Application
Electronic Assemblies without Solder and Methods for their Manufacture
- Publication number 20110182042
- Publication date Jul 28, 2011
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- B32 - LAYERED PRODUCTS
Information Patent Application
WIRING BOARD RECEIVING PLATE, AND DEVICE AND METHOD FOR CONNECTION...
- Publication number 20100251541
- Publication date Oct 7, 2010
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Masao Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder and Lead-Free Electronic Circuit and Method of Manufacturing...
- Publication number 20100208425
- Publication date Aug 19, 2010
- Carmen Rapisarda
- A43 - FOOTWEAR
Information Patent Application
Electronic Assemblies without Solder and Method for their Design, P...
- Publication number 20090277677
- Publication date Nov 12, 2009
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR PLACING SUBSTRATE SUPPORT COMPONENTS
- Publication number 20090255426
- Publication date Oct 15, 2009
- Illinois Tool Works Inc.
- Dennis G. Doyle
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Electronic Component Mounting Method and Electronic Circuit Device
- Publication number 20090223705
- Publication date Sep 10, 2009
- Yoshihisa Yamashita
- B30 - PRESSES
Information Patent Application
METHOD AND APPARATUS FOR CONTROLLING SIZE AND ALIGNMENT OF PRECISIO...
- Publication number 20090090229
- Publication date Apr 9, 2009
- International Business Machines Corporation
- Anthony F. Coneski
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
CIRCUIT BOARD CONNECTION STRUCTURE AND CIRCUIT BOARD CONNECTION METHOD
- Publication number 20090067147
- Publication date Mar 12, 2009
- Matsushita Electric Industrial Co., Ltd.
- Hiroyuki Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic appliance and method for manufacturing the same
- Publication number 20090059498
- Publication date Mar 5, 2009
- Samsung Electronics Co., Ltd.
- Jeo Woo Jeong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic Assemblies Without Solder and Methods for their Manufacture
- Publication number 20090008140
- Publication date Jan 8, 2009
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- B32 - LAYERED PRODUCTS
Information Patent Application
Assembling Lighting Elements Onto a Substrate
- Publication number 20080284311
- Publication date Nov 20, 2008
- Koninklijke Philips Electronics, N.V.
- Josef Andreas Schug
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MOUNTING SUPPORT FOR A FLEXIBLE PRINTED CIRCUIT BOARD AND RETAINING...
- Publication number 20080266819
- Publication date Oct 30, 2008
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- YING SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transfer assembly for manufacturing electronic devices
- Publication number 20080156445
- Publication date Jul 3, 2008
- Gordon S.W. Craig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Lighting systems for attachment to wearing apparel
- Publication number 20080019120
- Publication date Jan 24, 2008
- Carmen Rapisarda
- A43 - FOOTWEAR
Information Patent Application
Through-hole machining apparatus of green sheet and through-hole ma...
- Publication number 20070240814
- Publication date Oct 18, 2007
- Alps Electric Co., Ltd.
- Yuji Sakuma
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Cutting fixture for printed circuit board mounted with electronic c...
- Publication number 20070113717
- Publication date May 24, 2007
- Inventec Corporation
- Yan-Jun Feng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board structure integrated with semiconductor chip and meth...
- Publication number 20070020812
- Publication date Jan 25, 2007
- Phoenix Precision Technology Corp.
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic package structures and methods
- Publication number 20060273447
- Publication date Dec 7, 2006
- Analog Devices, Inc.
- Roy Vesper Buck
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic apparatus and method for manufacturing the same
- Publication number 20060234528
- Publication date Oct 19, 2006
- DENSO CORPORATION
- Tetsuo Nakano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Template for holding a PCB having mounted components thereon

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

On-demand method of making PCB pallets using additive manufacturing

Wave solder pallets for optimal solder flow and methods of manufact...

On-demand method of making PCB pallets using additive manufacturing

Apparatus for holding a printed circuit board

Method of manufacturing a wave solder pallet

Scalable fabrication techniques and circuit packaging devices

Occam process for components having variations in part dimensions

Assembling lighting elements onto a substrate

Method and device for connecting a wiring board

Apparatus for controlling alignment between precision ground plates...

Retaining apparatus for a flexible printed circuit board

Solder and lead-free electronic circuit and method of manufacturing...

Transfer assembly for manufacturing electronic devices

Method of making a circuit assembly

Electronic component mounting method

Electronic package structures and methods

Printing apparatus and method for bonding material

Method for mounting electronic components on a substrate

Composite base plate for a data storage device having an integral p...

Laminated printed circuit board fixture assembly and method

Singular molded and co-molded electronic's packaging pre-forms

Transfer assembly for manufacturing electronic devices

Electronic apparatus and method for manufacturing the same

Apparatus for clamping printed circuit boards inside an electronic...

Method for making a bonding tool

Surface mount IC stacking method and device

Laminated printed circuit board fixture assembly and method

Method of attaching printed circuits boards within an electronic mo...

Method and apparatus for electronics board retention during manufac...

Ignition coil cassette assembly

Patents Applicationslast 30 patents

System, process and a jig for forming conformal EMI shield on packa...

DOUBLE-SIDED ASSEMBLY ON FLEXIBLE SUBSTRATES

WAVE SOLDER PALLETS FOR OPTIMAL SOLDER FLOW AND METHODS OF MANUFACT...

WAVE SOLDER PALLETS FOR OPTIMAL SOLDER FLOW AND METHODS OF MANUFACT...

Burned-in Component Assembly

SCALABLE FABRICATION TECHNIQUES AND CIRCUIT PACKAGING DEVICES

ELECTRONIC COMPONENT BONDING METHOD

REMOVABLE CONFORMAL RADIO FREQUENCY SHIELDS

Solder-Less Electrical Assembly

SINGULAR AND CO-MOLDED PRE-FORMS

Occam Process for Components Having Variations in Part Dimensions

Electronic Assemblies without Solder and Methods for their Manufacture

WIRING BOARD RECEIVING PLATE, AND DEVICE AND METHOD FOR CONNECTION...

Solder and Lead-Free Electronic Circuit and Method of Manufacturing...

Electronic Assemblies without Solder and Method for their Design, P...

METHOD AND APPARATUS FOR PLACING SUBSTRATE SUPPORT COMPONENTS

Electronic Component Mounting Method and Electronic Circuit Device

METHOD AND APPARATUS FOR CONTROLLING SIZE AND ALIGNMENT OF PRECISIO...

CIRCUIT BOARD CONNECTION STRUCTURE AND CIRCUIT BOARD CONNECTION METHOD

Electronic appliance and method for manufacturing the same

Electronic Assemblies Without Solder and Methods for their Manufacture

Assembling Lighting Elements Onto a Substrate

MOUNTING SUPPORT FOR A FLEXIBLE PRINTED CIRCUIT BOARD AND RETAINING...

Transfer assembly for manufacturing electronic devices

Lighting systems for attachment to wearing apparel

Through-hole machining apparatus of green sheet and through-hole ma...

Cutting fixture for printed circuit board mounted with electronic c...

Circuit board structure integrated with semiconductor chip and meth...

Electronic package structures and methods

Electronic apparatus and method for manufacturing the same