Temporarily stacked PCBs

Industry

CPC
H05K2203/1536

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1536Temporarily stacked PCBs

Industries

Patents Grantslast 30 patents

Information Patent Grant
Pressure sintering device and method for manufacturing an electroni...
- Patent number 12,046,576
- Issue date Jul 23, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal substrate and method of manufacturing the same
- Patent number 11,483,934
- Issue date Oct 25, 2022
- AZOTEK CO., LTD.
- Hung-Jung Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wiring board manufacturing method
- Patent number 11,317,522
- Issue date Apr 26, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Toshimi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Supporting substrate, supporting substrate-attached laminate and me...
- Patent number 11,217,445
- Issue date Jan 4, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carriers sandwiching a sacrificial structure and having p...
- Patent number 11,051,410
- Issue date Jun 29, 2021
- AT&S (China) Co. Ltd.
- Annie Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sacrificial structure with dummy core and two sections of separate...
- Patent number 10,973,133
- Issue date Apr 6, 2021
- AT&S (China) Co. Ltd.
- Annie Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-finished product for the production of connection systems for...
- Patent number 10,729,013
- Issue date Jul 28, 2020
- AT&S (CHINA) (CO., LTD.
- Peiwang Chen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Embedded board and method of manufacturing the same
- Patent number 10,129,982
- Issue date Nov 13, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Jae Hoon Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-layered laminate having metal foil cladded on its one surface,...
- Patent number 10,051,743
- Issue date Aug 14, 2018
- Hitachi Chemical Company, Ltd.
- Hitoshi Onozeki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 10,045,436
- Issue date Aug 7, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Suk Hyeon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 9,756,735
- Issue date Sep 5, 2017
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board with conductive post...
- Patent number 9,713,267
- Issue date Jul 18, 2017
- Ibiden Co., Ltd.
- Toru Furuta
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Printed circuit board, electronic module and method of manufacturin...
- Patent number 9,706,668
- Issue date Jul 11, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Da-Hee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad-less interconnect for electrical coreless substrate
- Patent number 9,691,727
- Issue date Jun 27, 2017
- Intel Corporation
- Javier Soto Gonzalez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of microfluidic devices in package struct...
- Patent number 9,674,945
- Issue date Jun 6, 2017
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of circuit substrate
- Patent number 9,655,254
- Issue date May 16, 2017
- Subtron Technology Co. Ltd.
- Tzu-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit substrate
- Patent number 9,603,263
- Issue date Mar 21, 2017
- Subtron Technology Co., Ltd.
- Chih-Hong Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package carrier and manufacturing method thereof
- Patent number 9,578,750
- Issue date Feb 21, 2017
- Subtron Technology Co., Ltd.
- Shih-Hao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper clad laminate, printed circuit board, and method of manufact...
- Patent number 9,578,740
- Issue date Feb 21, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Ho Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier substrate
- Patent number 9,491,871
- Issue date Nov 8, 2016
- Unimicron Technology Corp.
- Ying-Chih Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing printed circuit boards with stacked micro...
- Patent number 9,485,876
- Issue date Nov 1, 2016
- Viasystems Technologies Corp., L.L.C.
- Raj Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,474,158
- Issue date Oct 18, 2016
- Ibiden Co., Ltd.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded architecture using resin coated copper
- Patent number 9,451,696
- Issue date Sep 20, 2016
- Intel Corporation
- Dilan Seneviratne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector
- Patent number 9,420,690
- Issue date Aug 16, 2016
- Unimicron Technology Corp.
- Chih-Peng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Peelable metal substrate having modified surface and method of manu...
- Patent number 9,414,485
- Issue date Aug 9, 2016
- AZOTEK CO., LTD.
- Hung-Jung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 9,391,044
- Issue date Jul 12, 2016
- Ibiden Co., Ltd.
- Keisuke Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 9,392,699
- Issue date Jul 12, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Hyun Noh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuit board, method of manufacturing elec...
- Patent number 9,386,700
- Issue date Jul 5, 2016
- Fujitsu Limited
- Kazuya Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coreless package structure and method for manufacturing same
- Patent number 9,362,248
- Issue date Jun 7, 2016
- Zhen Ding Technology Co., Ltd.
- Yong Ha Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming molded panel embedded die structure
- Patent number 9,312,233
- Issue date Apr 12, 2016
- Intel Corporation
- Rahul N. Manepalli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240147634
- Publication date May 2, 2024
- Samsung Electro-Mechanics Co., Ltd.
- In Gun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND ME...
- Publication number 20210257207
- Publication date Aug 19, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD MANUFACTURING METHOD
- Publication number 20200113066
- Publication date Apr 9, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Toshimi NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carriers Sandwiching a Sacrificial Structure and Having P...
- Publication number 20180255650
- Publication date Sep 6, 2018
- AT&S (China) Co. Ltd.
- Annie Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT...
- Publication number 20140345125
- Publication date Nov 27, 2014
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT EMBEDDED THEREIN
- Publication number 20140345930
- Publication date Nov 27, 2014
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT...
- Publication number 20140345126
- Publication date Nov 27, 2014
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20140332253
- Publication date Nov 13, 2014
- Unimicron Technology Corp.
- Chun-Ting Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140174810
- Publication date Jun 26, 2014
- Samsung Electro-mechanics Co., Ltd.
- Seung Hyun Noh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID SUBSTRATE WITH HIGH DENSITY AND LOW DENSITY SUBSTRATE AREAS,...
- Publication number 20140175672
- Publication date Jun 26, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jin Won CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF PACKAGING SUBSTRATE
- Publication number 20140174644
- Publication date Jun 26, 2014
- ADVANCE MATERIALS CORPORATION
- Lee-Sheng Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20140124475
- Publication date May 8, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20140116759
- Publication date May 1, 2014
- IBIDEN CO., LTD.
- Satoshi WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING METAL CORE INSERTED PRINTED CIRCUIT BOARD
- Publication number 20140109402
- Publication date Apr 24, 2014
- Samsung Electro-mechanics Co., Ltd.
- Sang Hyuk Son
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20140099488
- Publication date Apr 10, 2014
- IBIDEN CO., LTD.
- Naohiko YAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20140090245
- Publication date Apr 3, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Sun HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED ARCHITECTURE USING RESIN COATED COPPER
- Publication number 20140090879
- Publication date Apr 3, 2014
- Dilan SENEVIRATNE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION OF MICROFLUIDIC DEVICES IN PACKAGE STRUCT...
- Publication number 20140083858
- Publication date Mar 27, 2014
- Weng Hong Teh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER TYPE CORELESS SUBSTRATE AND METHOD OF MANUFACTURING THE...
- Publication number 20140027156
- Publication date Jan 30, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ki Hwan Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20140027167
- Publication date Jan 30, 2014
- Min Sung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20140000952
- Publication date Jan 2, 2014
- Young Gwan KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE
- Publication number 20130313004
- Publication date Nov 28, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jin-Yong An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CERAMIC PLATES
- Publication number 20130277415
- Publication date Oct 24, 2013
- Hiroshi ASANO
- B32 - LAYERED PRODUCTS
Information Patent Application
Carrier For Manufacturing Substrate and Method Of Manufacturing Sub...
- Publication number 20130243995
- Publication date Sep 19, 2013
- Jin Ho KIM
- B32 - LAYERED PRODUCTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20130235543
- Publication date Sep 12, 2013
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER WIRING BOARD
- Publication number 20130219712
- Publication date Aug 29, 2013
- NGK SPARK PLUG CO., LTD.
- Kenji SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130180766
- Publication date Jul 18, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Dong Uk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MULTI-LAYER WIRING BOARD
- Publication number 20130160290
- Publication date Jun 27, 2013
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20130161079
- Publication date Jun 27, 2013
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20130146220
- Publication date Jun 13, 2013
- Shinko Electric Industries Co., Ltd.
- Tatsuya NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Temporarily stacked PCBs

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pressure sintering device and method for manufacturing an electroni...

Metal substrate and method of manufacturing the same

Wiring board manufacturing method

Supporting substrate, supporting substrate-attached laminate and me...

Component carriers sandwiching a sacrificial structure and having p...

Sacrificial structure with dummy core and two sections of separate...

Semi-finished product for the production of connection systems for...

Embedded board and method of manufacturing the same

Two-layered laminate having metal foil cladded on its one surface,...

Printed circuit board and method of manufacturing the same

Method for manufacturing printed wiring board

Method for manufacturing printed wiring board with conductive post...

Printed circuit board, electronic module and method of manufacturin...

Pad-less interconnect for electrical coreless substrate

Heterogeneous integration of microfluidic devices in package struct...

Manufacturing method of circuit substrate

Manufacturing method of circuit substrate

Package carrier and manufacturing method thereof

Copper clad laminate, printed circuit board, and method of manufact...

Carrier substrate

Methods of manufacturing printed circuit boards with stacked micro...

Printed wiring board

Embedded architecture using resin coated copper

Connector

Peelable metal substrate having modified surface and method of manu...

Printed wiring board and method for manufacturing printed wiring board

Printed circuit board and method of manufacturing the same

Method of manufacturing circuit board, method of manufacturing elec...

Coreless package structure and method for manufacturing same

Method of forming molded panel embedded die structure

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND ME...

WIRING BOARD MANUFACTURING METHOD

Component Carriers Sandwiching a Sacrificial Structure and Having P...

METHOD OF FABRICATING PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT...

PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT EMBEDDED THEREIN

METHOD OF FABRICATING PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT...

CARRIER SUBSTRATE AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

HYBRID SUBSTRATE WITH HIGH DENSITY AND LOW DENSITY SUBSTRATE AREAS,...

FABRICATION METHOD OF PACKAGING SUBSTRATE

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

METHOD OF MANUFACTURING METAL CORE INSERTED PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

EMBEDDED ARCHITECTURE USING RESIN COATED COPPER

HETEROGENEOUS INTEGRATION OF MICROFLUIDIC DEVICES IN PACKAGE STRUCT...

MULTILAYER TYPE CORELESS SUBSTRATE AND METHOD OF MANUFACTURING THE...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

PACKAGE SUBSTRATE

METHOD FOR MANUFACTURING CERAMIC PLATES

Carrier For Manufacturing Substrate and Method Of Manufacturing Sub...

WIRING BOARD AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING MULTILAYER WIRING BOARD

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING MULTI-LAYER WIRING BOARD

MULTI-LAYER WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING WIRING SUBSTRATE