Temporary metallic carrier

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CPC
H05K2203/0152

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0152Temporary metallic carrier

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned conductive article
- Patent number 12,048,092
- Issue date Jul 23, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 12,027,481
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing transparent circuit board
- Patent number 11,950,371
- Issue date Apr 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for fabrication of a printed circuit board using a semi-add...
- Patent number 11,638,354
- Issue date Apr 25, 2023
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 11,569,186
- Issue date Jan 31, 2023
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stack structure and method for manufacturing the same
- Patent number 11,516,925
- Issue date Nov 29, 2022
- Siliconware Precision Industries Co., Ltd.
- Han-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wiring board or wiring board material
- Patent number 11,490,522
- Issue date Nov 1, 2022
- Daiwa Co., Ltd.
- Yoshimura Eiji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing coreless substrate
- Patent number 11,399,440
- Issue date Jul 26, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio-frequency identification (RFID) label or conductive trace the...
- Patent number 11,363,721
- Issue date Jun 14, 2022
- Xerox Corporation
- Marc D. Daniels
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board assembly sheet
- Patent number 11,229,116
- Issue date Jan 18, 2022
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier-foil-attached ultra-thin copper foil
- Patent number 11,166,378
- Issue date Nov 2, 2021
- Iljin Materials Co., Ltd.
- Won Jin Beom
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing multilayer wiring board
- Patent number 11,071,214
- Issue date Jul 20, 2021
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 10,903,180
- Issue date Jan 26, 2021
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly thermally conductive dielectric structure for heat spreading...
- Patent number 10,880,988
- Issue date Dec 29, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Silvano De Sousa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for electromechanical transfer printing of two...
- Patent number 10,828,878
- Issue date Nov 10, 2020
- Massachusetts Institute of Technology
- Sanha Kim
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Radio-frequency identification (RFID) label or conductive trace the...
- Patent number 10,813,225
- Issue date Oct 20, 2020
- Xerox Corporation
- Marc D. Daniels
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for printed circuit boards using backing foil
- Patent number 10,765,012
- Issue date Sep 1, 2020
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing through wiring substrate and method for ma...
- Patent number 10,667,392
- Issue date May 26, 2020
- Canon Kabushiki Kaisha
- Shinan Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Fabrication of flexible electronic devices
- Patent number 10,582,618
- Issue date Mar 3, 2020
- The Regents of the University of California
- Todd Prentice Coleman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning of graphene circuits on flexible substrates
- Patent number 10,362,680
- Issue date Jul 23, 2019
- Compass Technology Company, Limited
- Kelvin Po Leung Pun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible substrate assembly and its application for fabricating fle...
- Patent number 10,334,738
- Issue date Jun 25, 2019
- Taimide Technology Incorporation
- Yen-Po Huang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Carrier-attached copper foil, laminate, method for manufacturing pr...
- Patent number 10,332,756
- Issue date Jun 25, 2019
- JX Nippon Mining & Metals Corporation
- Terumasa Moriyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed wiring board for mounting electronic component
- Patent number 10,231,336
- Issue date Mar 12, 2019
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible substrate assembly and its application for fabricating fle...
- Patent number 10,212,821
- Issue date Feb 19, 2019
- Taimide Technology Incorporation
- Yen-Po Huang
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Copper foil provided with carrier foil, manufacturing method of the...
- Patent number 10,212,814
- Issue date Feb 19, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Kazuhiro Yoshikawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Chip package structure
- Patent number 10,211,139
- Issue date Feb 19, 2019
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Manufacturing method of circuit substrate including electronic device
- Patent number 10,201,099
- Issue date Feb 5, 2019
- Chung W. Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil provided with carrier, laminate, printed wiring board,...
- Patent number 10,178,775
- Issue date Jan 8, 2019
- JX Nippon Mining & Metals Corporation
- Yoshiyuki Miyoshi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal foil with carrier
- Patent number 9,992,874
- Issue date Jun 5, 2018
- JX Nippon Mining & Metals Corporation
- Masayuki Takamori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20240355767
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20240306290
- Publication date Sep 12, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPARENT CIRCUIT BOARD
- Publication number 20240196541
- Publication date Jun 13, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20230170319
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FOIL WITH CARRIER
- Publication number 20230072120
- Publication date Mar 9, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Yukiko KITABATAKE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMI ADDITIVE MANUFACTURING PROCESS FOR PRODUCING PRINTED ELECTRONICS
- Publication number 20230074639
- Publication date Mar 9, 2023
- CREATIVE IC3D LTD.
- Yacov MAZUZ
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method And Apparatus For Singulation Detachment
- Publication number 20230025354
- Publication date Jan 26, 2023
- Hutchinson Technology Incorporated
- Erich W. Bierbrauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF ASSEMBLING AND EFFICIENT MANUFACTURE OF HIGH PERFORMANCE...
- Publication number 20230012133
- Publication date Jan 12, 2023
- Amphenol Corporation
- Michael D. Long
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20220167499
- Publication date May 26, 2022
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPORARY CARRIER AND METHOD FOR MANUFACTURING CORELESS SUBSTRATE T...
- Publication number 20210410297
- Publication date Dec 30, 2021
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20210151401
- Publication date May 20, 2021
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY IDENTIFICATION (RFID) LABEL OR CONDUCTIVE TRACE THE...
- Publication number 20200389981
- Publication date Dec 10, 2020
- Xerox Corporation
- Marc D. Daniels
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Additive Process for Printed Circuit Boards
- Publication number 20200389983
- Publication date Dec 10, 2020
- CATLAM LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER-FOIL-ATTACHED ULTRA-THIN COPPER FOIL
- Publication number 20190364664
- Publication date Nov 28, 2019
- ILJIN Materials Co., Ltd.
- Won Jin Beom
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD
- Publication number 20190335594
- Publication date Oct 31, 2019
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-additive process for printed circuit boards
- Publication number 20190014667
- Publication date Jan 10, 2019
- SIERRA CIRCUITS, INC.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC PARTICLE EMBEDDED FLEX OR PRINTED FLEX FOR MAGNETIC TRAY O...
- Publication number 20180376591
- Publication date Dec 27, 2018
- Intel Corporation
- Yoshihiro Tomita
- A41 - WEARING APPAREL
Information Patent Application
SURFACE TREATED COPPER FOIL, LAMINATE USING THE SAME, COPPER FOIL W...
- Publication number 20180288867
- Publication date Oct 4, 2018
- JX NIPPON MINING & METALS CORPORATION
- RYO FUKUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD,...
- Publication number 20180063950
- Publication date Mar 1, 2018
- JX NIPPON MINING & METALS CORPORATION
- Michiya Kohiki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180047662
- Publication date Feb 15, 2018
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF FLEXIBLE ELECTRONIC DEVICES
- Publication number 20170079144
- Publication date Mar 16, 2017
- The Regents of the University of California
- Todd Prentice Coleman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD COMBINED WITH CARRIER BOARD AND MANUFACTURIN...
- Publication number 20160360611
- Publication date Dec 8, 2016
- ADVANCED FLEXIBLE CIRCUITS CO., LTD.
- KUO-FU SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING HYBRID WIRING BOARD WITH BUILT-IN STIFFENER AND IN...
- Publication number 20140291001
- Publication date Oct 2, 2014
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROVIDING AN ELECTRONIC DEVICE STRUCTURE AND RELATED ELEC...
- Publication number 20140254113
- Publication date Sep 11, 2014
- Arizona Board of Regents, a body corporate of the State of Arizona Acting for...
- Emmett Howard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHODS...
- Publication number 20140239475
- Publication date Aug 28, 2014
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140182895
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Doo Hwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING A RELEASE LAYER
- Publication number 20140177193
- Publication date Jun 26, 2014
- Liwen Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER FOIL STRUCTURE HAVING BLACKENED ULTRA-THIN FOIL AND MANUFACT...
- Publication number 20140141274
- Publication date May 22, 2014
- Nan Ya Plastics Corporation
- MING-JEN TZOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTERPOSED SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20140138142
- Publication date May 22, 2014
- Unimicron Technology Corp.
- Dyi-Chung Hu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF MANUFACTURING A LAMINATE CIRCUIT BOARD
- Publication number 20140115889
- Publication date May 1, 2014
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Temporary metallic carrier

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Patterned article including electrically conductive elements

Patterned conductive article

Device including semiconductor chips and method for producing such...

Method for manufacturing transparent circuit board

Process for fabrication of a printed circuit board using a semi-add...

Device including semiconductor chips and method for producing such...

Package stack structure and method for manufacturing the same

Method for manufacturing wiring board or wiring board material

Method for manufacturing coreless substrate

Radio-frequency identification (RFID) label or conductive trace the...

Board assembly sheet

Carrier-foil-attached ultra-thin copper foil

Method for manufacturing multilayer wiring board

Device including semiconductor chips and method for producing such...

Highly thermally conductive dielectric structure for heat spreading...

Systems and methods for electromechanical transfer printing of two...

Radio-frequency identification (RFID) label or conductive trace the...

Process for printed circuit boards using backing foil

Method for manufacturing through wiring substrate and method for ma...

Fabrication of flexible electronic devices

Patterning of graphene circuits on flexible substrates

Flexible substrate assembly and its application for fabricating fle...

Carrier-attached copper foil, laminate, method for manufacturing pr...

Printed wiring board for mounting electronic component

Flexible substrate assembly and its application for fabricating fle...

Copper foil provided with carrier foil, manufacturing method of the...

Chip package structure

Manufacturing method of circuit substrate including electronic device

Copper foil provided with carrier, laminate, printed wiring board,...

Metal foil with carrier

Patents Applicationslast 30 patents

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

PATTERNED CONDUCTIVE ARTICLE

TRANSPARENT CIRCUIT BOARD

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

METAL FOIL WITH CARRIER

SEMI ADDITIVE MANUFACTURING PROCESS FOR PRODUCING PRINTED ELECTRONICS

Method And Apparatus For Singulation Detachment

METHOD OF ASSEMBLING AND EFFICIENT MANUFACTURE OF HIGH PERFORMANCE...

PATTERNED CONDUCTIVE ARTICLE

TEMPORARY CARRIER AND METHOD FOR MANUFACTURING CORELESS SUBSTRATE T...

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

RADIO-FREQUENCY IDENTIFICATION (RFID) LABEL OR CONDUCTIVE TRACE THE...

Semi-Additive Process for Printed Circuit Boards

CARRIER-FOIL-ATTACHED ULTRA-THIN COPPER FOIL

METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

Semi-additive process for printed circuit boards

MAGNETIC PARTICLE EMBEDDED FLEX OR PRINTED FLEX FOR MAGNETIC TRAY O...

SURFACE TREATED COPPER FOIL, LAMINATE USING THE SAME, COPPER FOIL W...

COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD,...

INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

FABRICATION OF FLEXIBLE ELECTRONIC DEVICES

FLEXIBLE CIRCUIT BOARD COMBINED WITH CARRIER BOARD AND MANUFACTURIN...

METHOD OF MAKING HYBRID WIRING BOARD WITH BUILT-IN STIFFENER AND IN...

METHOD OF PROVIDING AN ELECTRONIC DEVICE STRUCTURE AND RELATED ELEC...

PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHODS...

MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING A RELEASE LAYER

COPPER FOIL STRUCTURE HAVING BLACKENED ULTRA-THIN FOIL AND MANUFACT...

INTERPOSED SUBSTRATE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING A LAMINATE CIRCUIT BOARD