Temporary polymeric carrier or foil

Industry

CPC
H05K2203/0156

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0156Temporary polymeric carrier or foil

Industries

Patents Grantslast 30 patents

Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned conductive article
- Patent number 12,048,092
- Issue date Jul 23, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-demand method of making PCB pallets using additive manufacturing
- Patent number 12,041,723
- Issue date Jul 16, 2024
- JABIL INC.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Stacking arrays and separator bodies during processing of component...
- Patent number 11,943,874
- Issue date Mar 26, 2024
- AT&S (Chongqing) Company Limited
- Amin Nickkolgh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and manufacturing method thereof, electronic de...
- Patent number 11,917,758
- Issue date Feb 27, 2024
- PANELSEMI CORPORATION
- Ya-Che Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density soft-matter electronics
- Patent number 11,903,139
- Issue date Feb 13, 2024
- Carnegie Mellon University
- Carmel Majidi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
On-demand method of making PCB pallets using additive manufacturing
- Patent number 11,589,487
- Issue date Feb 21, 2023
- Jabil Inc.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing wiring board or wiring board material
- Patent number 11,490,522
- Issue date Nov 1, 2022
- Daiwa Co., Ltd.
- Yoshimura Eiji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for depositing functional traces
- Patent number 11,464,115
- Issue date Oct 4, 2022
- MGI Digital Technology
- Edmond Abergel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Removable tabs and methods of making and using the same
- Patent number 11,414,226
- Issue date Aug 16, 2022
- Hutchinson Technology Incorporated
- Erich W. Bierbrauer
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Board assembly sheet
- Patent number 11,229,116
- Issue date Jan 18, 2022
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for preparing patterned coverlay on substrate
- Patent number 11,198,792
- Issue date Dec 14, 2021
- Eternal Materials Co., Ltd.
- Chung-Kai Cheng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Fabrication method of flexible electronic device
- Patent number 11,191,166
- Issue date Nov 30, 2021
- E Ink Holdings Inc.
- Kuo-Feng Chen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,058,012
- Issue date Jul 6, 2021
- Unimicron Technology Corp.
- Chien-Chen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carriers sandwiching a sacrificial structure and having p...
- Patent number 11,051,410
- Issue date Jun 29, 2021
- AT&S (China) Co. Ltd.
- Annie Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sacrificial structure with dummy core and two sections of separate...
- Patent number 10,973,133
- Issue date Apr 6, 2021
- AT&S (China) Co. Ltd.
- Annie Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper clad laminates and method for manufacturing a printed circui...
- Patent number 10,952,329
- Issue date Mar 16, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Youn-Gyu Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-density soft-matter electronics
- Patent number 10,945,339
- Issue date Mar 9, 2021
- Carnegie Mellon University
- Carmel Majidi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Surface treated copper foil, surface treated copper foil with resin...
- Patent number 10,925,170
- Issue date Feb 16, 2021
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil with carrier, copper foil with resin and method for man...
- Patent number 10,772,219
- Issue date Sep 8, 2020
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fabrication method of substrate structure
- Patent number 10,764,995
- Issue date Sep 1, 2020
- Siliconware Precision Industries Co., Ltd.
- Jin-Wei You
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Resin multilayer substrate and method of manufacturing the same
- Patent number 10,743,414
- Issue date Aug 11, 2020
- Murata Manufacturing Co., Ltd.
- Toshiro Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-finished product for the production of connection systems for...
- Patent number 10,729,013
- Issue date Jul 28, 2020
- AT&S (CHINA) (CO., LTD.
- Peiwang Chen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Placement of component in circuit board intermediate product by flo...
- Patent number 10,709,023
- Issue date Jul 7, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding discrete components having variable dimensions in a subst...
- Patent number 10,701,797
- Issue date Jun 30, 2020
- International Business Machines Corporation
- Lei Shan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating flexible substrate
- Patent number 10,517,171
- Issue date Dec 24, 2019
- LG Chem, Ltd.
- Hye Won Jeong
- B32 - LAYERED PRODUCTS
Information Patent Grant
Entry sheet for drilling and method for drilling processing using same
- Patent number 10,486,324
- Issue date Nov 26, 2019
- Mitsubishi Gas Chemical Company, Inc.
- Takayuki Kamei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transparent polyimide composite film for flexible display and metho...
- Patent number 10,385,176
- Issue date Aug 20, 2019
- TAIMIDE TECH. INC.
- Chih-Wei Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic device and method for producing same
- Patent number 10,375,867
- Issue date Aug 6, 2019
- Omron Corporation
- Wakahiro Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production method for printed wiring board having dielectric layer
- Patent number 10,342,143
- Issue date Jul 2, 2019
- MITSUI MINNG & SMELTING CO., LTD.
- Toshiyuki Shimizu
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE...
- Publication number 20240373561
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Jung Won PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20240306290
- Publication date Sep 12, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE...
- Publication number 20240276648
- Publication date Aug 15, 2024
- The Penn State Research Foundation
- Ning Yi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL FOIL WITH CARRIER
- Publication number 20230072120
- Publication date Mar 9, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Yukiko KITABATAKE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF ASSEMBLING AND EFFICIENT MANUFACTURE OF HIGH PERFORMANCE...
- Publication number 20230012133
- Publication date Jan 12, 2023
- Amphenol Corporation
- Michael D. Long
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20220167499
- Publication date May 26, 2022
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER SUBSTRATE STRUCTURE WHICH CAN BE PEELED OFF PRECISELY A...
- Publication number 20220087027
- Publication date Mar 17, 2022
- Princo Corp.
- Pei-Liang CHIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD STRUCTURE
- Publication number 20210298184
- Publication date Sep 23, 2021
- Unimicron Technology Corp.
- Chien-Chen LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacking Arrays and Separator Bodies During Processing of Component...
- Publication number 20210195753
- Publication date Jun 24, 2021
- AT&S (Chongqing) Company Limited
- Amin Nickkolgh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR FABRICATING CONDUCTIVE PATTERNS ON 3-DIMENSIONAL SURFAC...
- Publication number 20210153345
- Publication date May 20, 2021
- Yissum Research Development Company of the Hebrew University of Jerusalem Ltd.
- Shlomo MAGDASSI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210014975
- Publication date Jan 14, 2021
- Unimicron Technology Corp.
- Chien-Chen LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR DEPOSITING FUNCTIONAL TRACES
- Publication number 20200323084
- Publication date Oct 8, 2020
- MGI Digital Technology
- Edmond ABERGEL
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR APPLYING AN ELECTRICAL MICROSTRUCTURE, ELASTOMER STRUCTU...
- Publication number 20200068718
- Publication date Feb 27, 2020
- GOTTFRIED WILHELM LEIBNIZ UNIVERSITAT HANNOVER
- Hans Jürgen MAIER
- B60 - VEHICLES IN GENERAL
Information Patent Application
Removable Tabs And Methods Of Making And Using The Same
- Publication number 20190263550
- Publication date Aug 29, 2019
- Hutchinson Technology Incorporated
- Erich W. Bierbrauer
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Burned-in Component Assembly
- Publication number 20190174630
- Publication date Jun 6, 2019
- VNS Portfolio LLC
- Joseph Charles Fjelstad
- B32 - LAYERED PRODUCTS
Information Patent Application
Surface Treated Copper Foil, Surface Treated Copper Foil With Resin...
- Publication number 20180288881
- Publication date Oct 4, 2018
- JX NIPPON MINING & METALS CORPORATION
- Yuki Ori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE TREATED COPPER FOIL, LAMINATE USING THE SAME, COPPER FOIL W...
- Publication number 20180288867
- Publication date Oct 4, 2018
- JX NIPPON MINING & METALS CORPORATION
- RYO FUKUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
Sacrificial Structure With Dummy Core and Two Sections of Separate...
- Publication number 20180255649
- Publication date Sep 6, 2018
- AT&S (China) Co. Ltd.
- Annie Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carriers Sandwiching a Sacrificial Structure and Having P...
- Publication number 20180255650
- Publication date Sep 6, 2018
- AT&S (China) Co. Ltd.
- Annie Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATION METHOD OF FLEXIBLE ELECTRONIC DEVICE
- Publication number 20180213649
- Publication date Jul 26, 2018
- E Ink Holdings Inc.
- Kuo-Feng Chen
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD,...
- Publication number 20180063950
- Publication date Mar 1, 2018
- JX NIPPON MINING & METALS CORPORATION
- Michiya Kohiki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ENTRY SHEET FOR DRILLING HOLES, AND HOLE DRILLING METHOD USING SAME
- Publication number 20180050462
- Publication date Feb 22, 2018
- Mitsubishi Gas Chemical Company, Inc.
- Takayuki KAMEI
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170311450
- Publication date Oct 26, 2017
- Subtron Technology Co., Ltd.
- Yu-Chi Huang
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS OF TRANSFERRING ELECTRICALLY CONDUCTIVE MATERIALS
- Publication number 20160286662
- Publication date Sep 29, 2016
- PPG INDUSTRIES OHIO, INC.
- Jaye Tyler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20140247571
- Publication date Sep 4, 2014
- IBIDEN CO., LTD.
- Shunsuke SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING CAVITY OF CORE SUBSTRATE
- Publication number 20140123486
- Publication date May 8, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jin-Soo Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FOIL WITH CARRIER
- Publication number 20140106112
- Publication date Apr 17, 2014
- Freesia Macross Corporation
- Beji Sasaki
- B32 - LAYERED PRODUCTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20140042602
- Publication date Feb 13, 2014
- IBIDEN CO., LTD.
- Toyotaka SHIMABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20140027169
- Publication date Jan 30, 2014
- BENQ MATERIALS CORPORATION
- Chien-Huang HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL FOIL WITH CARRIER AND METHOD FOR PRODUCING LAMINATED SUBSTRAT...
- Publication number 20130323455
- Publication date Dec 5, 2013
- Freesia Macross Corporation
- Beji Sasaki
- B32 - LAYERED PRODUCTS

Temporary polymeric carrier or foil

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Patterned article including electrically conductive elements

Patterned conductive article

On-demand method of making PCB pallets using additive manufacturing

Stacking arrays and separator bodies during processing of component...

Substrate structure and manufacturing method thereof, electronic de...

High-density soft-matter electronics

On-demand method of making PCB pallets using additive manufacturing

Method for manufacturing wiring board or wiring board material

Method for depositing functional traces

Removable tabs and methods of making and using the same

Board assembly sheet

Method for preparing patterned coverlay on substrate

Fabrication method of flexible electronic device

Circuit board structure and manufacturing method thereof

Component carriers sandwiching a sacrificial structure and having p...

Sacrificial structure with dummy core and two sections of separate...

Copper clad laminates and method for manufacturing a printed circui...

High-density soft-matter electronics

Surface treated copper foil, surface treated copper foil with resin...

Copper foil with carrier, copper foil with resin and method for man...

Fabrication method of substrate structure

Resin multilayer substrate and method of manufacturing the same

Semi-finished product for the production of connection systems for...

Placement of component in circuit board intermediate product by flo...

Embedding discrete components having variable dimensions in a subst...

Method for fabricating flexible substrate

Entry sheet for drilling and method for drilling processing using same

Transparent polyimide composite film for flexible display and metho...

Electronic device and method for producing same

Production method for printed wiring board having dielectric layer

Patents Applicationslast 30 patents

SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE...

PATTERNED CONDUCTIVE ARTICLE

FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE...

METAL FOIL WITH CARRIER

METHOD OF ASSEMBLING AND EFFICIENT MANUFACTURE OF HIGH PERFORMANCE...

PATTERNED CONDUCTIVE ARTICLE

MULTI-LAYER SUBSTRATE STRUCTURE WHICH CAN BE PEELED OFF PRECISELY A...

METHOD OF MANUFACTURING CIRCUIT BOARD STRUCTURE

Stacking Arrays and Separator Bodies During Processing of Component...

PROCESS FOR FABRICATING CONDUCTIVE PATTERNS ON 3-DIMENSIONAL SURFAC...

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR DEPOSITING FUNCTIONAL TRACES

METHOD FOR APPLYING AN ELECTRICAL MICROSTRUCTURE, ELASTOMER STRUCTU...

Removable Tabs And Methods Of Making And Using The Same

Burned-in Component Assembly

Surface Treated Copper Foil, Surface Treated Copper Foil With Resin...

SURFACE TREATED COPPER FOIL, LAMINATE USING THE SAME, COPPER FOIL W...

Sacrificial Structure With Dummy Core and Two Sections of Separate...

Component Carriers Sandwiching a Sacrificial Structure and Having P...

FABRICATION METHOD OF FLEXIBLE ELECTRONIC DEVICE

COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD,...

ENTRY SHEET FOR DRILLING HOLES, AND HOLE DRILLING METHOD USING SAME

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHODS OF TRANSFERRING ELECTRICALLY CONDUCTIVE MATERIALS

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

METHOD OF PROCESSING CAVITY OF CORE SUBSTRATE

METAL FOIL WITH CARRIER

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

ANISOTROPIC CONDUCTIVE FILM

METAL FOIL WITH CARRIER AND METHOD FOR PRODUCING LAMINATED SUBSTRAT...