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CPC
Y10S438/976

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S438/00Semiconductor device manufacturing: process

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Y10S438/976Temporary protective layer

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Patents Grantslast 30 patents

Information Patent Grant
Surface treatment agent and surface-treated body manufacturing method
- Patent number 11,670,498
- Issue date Jun 6, 2023
- Central Glass Company, Limited
- Yuki Fukui
- B08 - CLEANING
Information Patent Grant
Light emitting device and method of manufacturing the same
- Patent number 9,954,196
- Issue date Apr 24, 2018
- Semiconductor Energy Laboratory Co., Ltd.
- Hirokazu Yamagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the same
- Patent number 9,768,405
- Issue date Sep 19, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Hirokazu Yamagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an integrated circuit device
- Patent number 9,564,509
- Issue date Feb 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsi Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the same
- Patent number 9,502,679
- Issue date Nov 22, 2016
- Semiconductor Energy Laboratory Co., Ltd.
- Hirokazu Yamagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Releasable buried layer for 3-D fabrication and methods of manufact...
- Patent number 9,040,390
- Issue date May 26, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of fabricating an integrated circuit device
- Patent number 8,921,177
- Issue date Dec 30, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsi Yeh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Formation of SiOCl-containing layer on spacer sidewalls to prevent...
- Patent number 8,809,194
- Issue date Aug 19, 2014
- Tokyo Electron Limited
- Alok Ranjan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Light emitting device and method of manufacturing the same
- Patent number 8,679,875
- Issue date Mar 25, 2014
- Semiconductor Energy Laboratory Co., Ltd.
- Hirokazu Yamagata
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Light emitting device and method of manufacturing the same
- Patent number 8,497,525
- Issue date Jul 30, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Hirokazu Yamagata
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 8,441,073
- Issue date May 14, 2013
- Kabushiki Kaisha Toshiba
- Kazuaki Nakajima
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for cleaning a substrate surface
- Patent number 8,309,440
- Issue date Nov 13, 2012
- Applied Materials, Inc.
- Errol Antonio C. Sanchez
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Chip pickup apparatus, chip pickup method, chip releasing device an...
- Patent number 8,192,578
- Issue date Jun 5, 2012
- Panasonic Corporation
- Hiroshi Haji
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and system for contacting of a flexible sheet and a substrate
- Patent number 8,172,968
- Issue date May 8, 2012
- Koninklijke Philips Electronics N.V.
- Marcus Antonius Verschuuren
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,053,337
- Issue date Nov 8, 2011
- Renesas Electronics Corporation
- Takamitsu Noda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit device fabrication method
- Patent number 8,048,614
- Issue date Nov 1, 2011
- Yoshihiko Okamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 8,017,466
- Issue date Sep 13, 2011
- Kabushiki Kaisha Toshiba
- Kazuaki Nakajima
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for cleaning a substrate surface
- Patent number 8,008,166
- Issue date Aug 30, 2011
- Applied Materials, Inc.
- Errol Antonio C. Sanchez
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and device for detaching a component which is attached to a...
- Patent number 7,981,246
- Issue date Jul 19, 2011
- Kulicke and Soffa Die Bonding GmbH
- Joachim Trinks
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 7,883,989
- Issue date Feb 8, 2011
- Semiconductor Energy Laboratory Co., Ltd.
- Yuugo Goto
- G02 - OPTICS
Information Patent Grant
Methods and systems for removing protective films from microfeature...
- Patent number 7,846,288
- Issue date Dec 7, 2010
- Micron Technology, Inc.
- Charles E. Larson
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for dicing wafer and process for manufacturing liquid-discha...
- Patent number 7,837,820
- Issue date Nov 23, 2010
- Canon Kabushiki Kaisha
- Junichiro Iri
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Light emitting device and method of manufacturing the same
- Patent number 7,825,419
- Issue date Nov 2, 2010
- Semiconductor Energy Laboratory Co., Ltd.
- Hirokazu Yamagata
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Die pickup apparatus for picking up semiconductor dies and methods...
- Patent number 7,820,006
- Issue date Oct 26, 2010
- Shinkkawa Ltd.
- Okito Umehara
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method, system, and apparatus for transfer of dies using a die plat...
- Patent number 7,795,076
- Issue date Sep 14, 2010
- Symbol Technologies, Inc.
- Michael R. Arneson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods to prevent ECC (edge chipping and cracking) damage during d...
- Patent number 7,771,560
- Issue date Aug 10, 2010
- International Business Machines Corporation
- James R. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for removal of an integrated circuit from a mount material
- Patent number 7,763,145
- Issue date Jul 27, 2010
- Stats Chippac Ltd.
- Soo-San Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vibration-induced die detachment system
- Patent number 7,757,742
- Issue date Jul 20, 2010
- ASM Assembly Automation LTD
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a slider or head for a data storage device
- Patent number 7,698,806
- Issue date Apr 20, 2010
- Seagate Technology LLC
- Wayne A. Bonin
- G11 - INFORMATION STORAGE
Information Patent Grant
Rectangular substrate dividing apparatus
- Patent number 7,644,747
- Issue date Jan 12, 2010
- Disco Corporation
- Satoshi Ohkawara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180047933
- Publication date Feb 15, 2018
- Semiconductor Energy Laboratory Co., Ltd.
- Hirokazu YAMAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140183515
- Publication date Jul 3, 2014
- Semiconductor Energy Laboratory Co., Ltd.
- Hirokazu YAMAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELEASABLE BURIED LAYER FOR 3-D FABRICATION AND METHODS OF MANUFACT...
- Publication number 20130320521
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Timothy H. DAUBENSPECK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130280841
- Publication date Oct 24, 2013
- Hirokazu Yamagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF SiOCl-CONTAINING LAYER ON SPACER SIDEWALLS TO PREVENT...
- Publication number 20130237059
- Publication date Sep 12, 2013
- TOKYO ELECTRON LIMITED
- Alok RANJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CLEANING A SUBSTRATE SURFACE
- Publication number 20130068390
- Publication date Mar 21, 2013
- Applied Materials, Inc.
- Errol Antonio C. SANCHEZ
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD OF FABRICATING AN INTEGRATED CIRCUIT DEVICE
- Publication number 20130023094
- Publication date Jan 24, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsi YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method for the same
- Publication number 20110298055
- Publication date Dec 8, 2011
- Kabushiki Kaisha Toshiba
- Kazuaki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CLEANING A SUBSTRATE SURFACE
- Publication number 20110263103
- Publication date Oct 27, 2011
- Errol Antonio C. SANCHEZ
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20110229824
- Publication date Sep 22, 2011
- Yoshihiko OKAMOTO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR DICING WAFER AND PROCESS FOR MANUFACTURING LIQUID-DISCHA...
- Publication number 20110027970
- Publication date Feb 3, 2011
- Canon Kabushiki Kaisha
- Junichiro Iri
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110024787
- Publication date Feb 3, 2011
- Semiconductor Energy Laboratory Co., Ltd.
- Hirokazu YAMAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20100273312
- Publication date Oct 28, 2010
- NEC ELECTRONICS CORPORATION
- Takamitsu Noda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die Pickup Apparatus for Picking Up Semiconductor Dies and Methods...
- Publication number 20100226745
- Publication date Sep 9, 2010
- SHINKAWA LTD.
- Okito Umehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method for the same
- Publication number 20100062596
- Publication date Mar 11, 2010
- Kabushiki Kaisha Toshiba
- Kazuaki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100035407
- Publication date Feb 11, 2010
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Yuugo Goto
- G02 - OPTICS
Information Patent Application
METHOD AND SYSTEM FOR CONTACTING OF A FLEXIBLE SHEET AND A SUBSTRATE
- Publication number 20090314414
- Publication date Dec 24, 2009
- Koninklijke Philips Electronics N.V.
- Marcus Antonius Verschuuren
- B82 - NANO-TECHNOLOGY
Information Patent Application
CHIP PICKUP APPARATUS, CHIP PICKUP METHOD, CHIP RELEASING DEVICE AN...
- Publication number 20090279995
- Publication date Nov 12, 2009
- PANASONIC CORPORATION
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DICING WAFER AND PROCESS FOR MANUFACTURING LIQUID-DISCHA...
- Publication number 20090242111
- Publication date Oct 1, 2009
- Canon Kabushiki Kaisha
- Junichiro Iri
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090128026
- Publication date May 21, 2009
- Semiconductor Energy Laboratory Co., Ltd.
- Hirokazu YAMAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO PREVENT ECC (EDGE CHIPPING AND CRACKING) DAMAGE DURING D...
- Publication number 20090084499
- Publication date Apr 2, 2009
- International Business Machines Corporation
- James R. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIBRATION-INDUCED DIE DETACHMENT SYSTEM
- Publication number 20090032186
- Publication date Feb 5, 2009
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CLEANING A SUBSTRATE SURFACE
- Publication number 20090029528
- Publication date Jan 29, 2009
- APPLIED MATERIALS, INC.
- Errol Antonio C. SANCHEZ
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD, SYSTEM, AND APPARATUS FOR TRANSFER OF DIES USING A DIE PLATE
- Publication number 20080271313
- Publication date Nov 6, 2008
- Symbol Technologies
- Michael R. Arneson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for bonding slider row bars for photolithography process
- Publication number 20080078077
- Publication date Apr 3, 2008
- SAE MAGNETICS (H. K) LTD.
- TaiBoon Lee
- G11 - INFORMATION STORAGE
Information Patent Application
PROCESS FOR FABRICATING A SLIDER OR HEAD FOR A DATA STORAGE DEVICE
- Publication number 20080062568
- Publication date Mar 13, 2008
- Seagate Technology LLC
- Wayne A. Bonin
- G11 - INFORMATION STORAGE
Information Patent Application
Method for manufacturing semiconductor device
- Publication number 20080009106
- Publication date Jan 10, 2008
- Semiconductor Energy Laboratory Co., Ltd.
- Yuugo Goto
- G02 - OPTICS
Information Patent Application
Light emitting device and method of manufacturing the same
- Publication number 20070290219
- Publication date Dec 20, 2007
- Hirokazu Yamagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE PROCESSING DEVICE
- Publication number 20070277934
- Publication date Dec 6, 2007
- Isamu Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Device for Detaching a Component Which is Attached to a...
- Publication number 20070277929
- Publication date Dec 6, 2007
- Joachim Trinks
- H01 - BASIC ELECTRIC ELEMENTS

Temporary protective layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Surface treatment agent and surface-treated body manufacturing method

Light emitting device and method of manufacturing the same

Light emitting device and method of manufacturing the same

Method of fabricating an integrated circuit device

Light emitting device and method of manufacturing the same

Releasable buried layer for 3-D fabrication and methods of manufact...

Method of fabricating an integrated circuit device

Formation of SiOCl-containing layer on spacer sidewalls to prevent...

Light emitting device and method of manufacturing the same

Light emitting device and method of manufacturing the same

Semiconductor device and manufacturing method for the same

Method and apparatus for cleaning a substrate surface

Chip pickup apparatus, chip pickup method, chip releasing device an...

Method and system for contacting of a flexible sheet and a substrate

Method of manufacturing semiconductor device

Semiconductor integrated circuit device fabrication method

Semiconductor device and manufacturing method for the same

Method and apparatus for cleaning a substrate surface

Method and device for detaching a component which is attached to a...

Method for manufacturing semiconductor device

Methods and systems for removing protective films from microfeature...

Method for dicing wafer and process for manufacturing liquid-discha...

Light emitting device and method of manufacturing the same

Die pickup apparatus for picking up semiconductor dies and methods...

Method, system, and apparatus for transfer of dies using a die plat...

Methods to prevent ECC (edge chipping and cracking) damage during d...

System for removal of an integrated circuit from a mount material

Vibration-induced die detachment system

Process for fabricating a slider or head for a data storage device

Rectangular substrate dividing apparatus

Patents Applicationslast 30 patents

LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME

LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME

RELEASABLE BURIED LAYER FOR 3-D FABRICATION AND METHODS OF MANUFACT...

LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME

FORMATION OF SiOCl-CONTAINING LAYER ON SPACER SIDEWALLS TO PREVENT...

METHOD AND APPARATUS FOR CLEANING A SUBSTRATE SURFACE

METHOD OF FABRICATING AN INTEGRATED CIRCUIT DEVICE

Semiconductor device and manufacturing method for the same

METHOD AND APPARATUS FOR CLEANING A SUBSTRATE SURFACE

METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

METHOD FOR DICING WAFER AND PROCESS FOR MANUFACTURING LIQUID-DISCHA...

LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME

Method of manufacturing semiconductor device

Die Pickup Apparatus for Picking Up Semiconductor Dies and Methods...

Semiconductor device and manufacturing method for the same

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD AND SYSTEM FOR CONTACTING OF A FLEXIBLE SHEET AND A SUBSTRATE

CHIP PICKUP APPARATUS, CHIP PICKUP METHOD, CHIP RELEASING DEVICE AN...

METHOD FOR DICING WAFER AND PROCESS FOR MANUFACTURING LIQUID-DISCHA...

LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME

METHODS TO PREVENT ECC (EDGE CHIPPING AND CRACKING) DAMAGE DURING D...

VIBRATION-INDUCED DIE DETACHMENT SYSTEM

METHOD AND APPARATUS FOR CLEANING A SUBSTRATE SURFACE

METHOD, SYSTEM, AND APPARATUS FOR TRANSFER OF DIES USING A DIE PLATE

Method for bonding slider row bars for photolithography process

PROCESS FOR FABRICATING A SLIDER OR HEAD FOR A DATA STORAGE DEVICE

Method for manufacturing semiconductor device

Light emitting device and method of manufacturing the same

WORKPIECE PROCESSING DEVICE

Method and Device for Detaching a Component Which is Attached to a...