Terbium [Tb]

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H01L2924/01065

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01065Terbium [Tb]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive member, display device, and manufacturing method of displa...
- Patent number 11,923,330
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Jung Hoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-chip packages in package-on-package apparatus, methods of a...
- Patent number 11,217,516
- Issue date Jan 4, 2022
- Intel Corporation
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method for manufacturing light emitting d...
- Patent number 10,230,034
- Issue date Mar 12, 2019
- Nichia Corporation
- Motokazu Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-chip packages in package-on-package apparatus, methods of a...
- Patent number 10,186,480
- Issue date Jan 22, 2019
- Intel Corporation
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method for manufacturing light emitting d...
- Patent number 9,887,329
- Issue date Feb 6, 2018
- Nichia Corporation
- Motokazu Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using millisecond pulsed laser welding in MEMS packaging
- Patent number 9,688,533
- Issue date Jun 27, 2017
- The Regents of the University of California
- Payam Bozorgi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple access over proximity communication
- Patent number 9,472,498
- Issue date Oct 18, 2016
- Oracle International Corporation
- Alex Chow
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,466,559
- Issue date Oct 11, 2016
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing semiconductor module and semiconductor module
- Patent number 9,076,892
- Issue date Jul 7, 2015
- Sharp Kabushiki Kaisha
- Takae Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple access over proximity communication
- Patent number 8,975,752
- Issue date Mar 10, 2015
- Oracle America, Inc.
- Alex Chow
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor light-emitting device, method for manufacturing the s...
- Patent number 8,742,438
- Issue date Jun 3, 2014
- Nichia Corporation
- Takeshi Kususe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for manufacturing an electronic assembly, elec...
- Patent number 8,735,218
- Issue date May 27, 2014
- Muehlbauer AG
- Michael Max Mueller
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Flip-chip mounting resin composition and bump forming resin composi...
- Patent number 8,709,293
- Issue date Apr 29, 2014
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Submount
- Patent number 8,581,106
- Issue date Nov 12, 2013
- Dowa Electronics Materials Co., Ltd.
- Yoshikazu Oshika
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,575,721
- Issue date Nov 5, 2013
- Renesas Electronics Corporation
- Ryuichi Okamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submount and method of manufacturing the same
- Patent number 8,472,208
- Issue date Jun 25, 2013
- Dowa Electronics Materials Co., Ltd.
- Yoshikazu Oshika
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED package
- Patent number 8,378,347
- Issue date Feb 19, 2013
- Kabushiki Kaisha Toshiba
- Satoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-package microelectronic apparatus, and methods of using same
- Patent number 8,354,748
- Issue date Jan 15, 2013
- Intel Corporation
- Sriram Dattaguru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light-emitting device, method for manufacturing the s...
- Patent number 8,330,179
- Issue date Dec 11, 2012
- Nichia Corporation
- Takeshi Kususe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,283,753
- Issue date Oct 9, 2012
- Renesas Electronics Corporation
- Ryuichi Okamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 8,279,605
- Issue date Oct 2, 2012
- Kabushiki Kaisha Yaskawa Denki
- Yasuhiko Kawanami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing LED package and substrate thereof
- Patent number 8,143,080
- Issue date Mar 27, 2012
- Advanced Optoelectronic Technology, Inc.
- Shen-Bo Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-package microelectronic apparatus, and methods of using same
- Patent number 8,110,920
- Issue date Feb 7, 2012
- Intel Corporation
- Sriram Dattaguru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including power supply bar having jutted porti...
- Patent number 8,097,942
- Issue date Jan 17, 2012
- Renesas Electronics Corporation
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-chip and multi-chip module for proximity communication
- Patent number 8,072,772
- Issue date Dec 6, 2011
- Oracle America, Inc.
- Arthur R. Zingher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device and method of manufacturing electrical devices us...
- Patent number 8,067,253
- Issue date Nov 29, 2011
- Avery Dennison Corporation
- Scott Wayne Ferguson
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 8,063,489
- Issue date Nov 22, 2011
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor chip and semiconductor device
- Patent number 8,043,940
- Issue date Oct 25, 2011
- Renesas Electronics Corporation
- Yoshitsugu Kawashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor light-emitting device, method for manufacturing the s...
- Patent number 8,035,118
- Issue date Oct 11, 2011
- Nichia Corporation
- Takeshi Kususe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
- Publication number 20240128224
- Publication date Apr 18, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jung Hoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
- Publication number 20220216172
- Publication date Jul 7, 2022
- SAMSUNG DISPLAY CO., LTD.
- Jung Hoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED-CHIP PACKAGES IN PACKAGE-ON-PACKAGE APPARATUS, METHODS OF A...
- Publication number 20190148275
- Publication date May 16, 2019
- Intel Corporation
- Sriram MUTHUKUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING D...
- Publication number 20180123006
- Publication date May 3, 2018
- Nichia Corporation.
- Motokazu YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING MILLISECOND PULSED LASER WELDING IN MEMS PACKAGING
- Publication number 20140126167
- Publication date May 8, 2014
- The Regents of the University of California
- Payam Bozorgi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20130313708
- Publication date Nov 28, 2013
- RENESAS ELECTRONICS CORPORATION
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING THE S...
- Publication number 20130193467
- Publication date Aug 1, 2013
- Nichia Corporation.
- Takeshi KUSUSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED-CHIP PACKAGES IN PACKAGE-ON-PACKAGE APPARATUS, METHODS OF A...
- Publication number 20130127054
- Publication date May 23, 2013
- Sriram MUTHUKUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130026602
- Publication date Jan 31, 2013
- RENESAS ELECTRONICS CORPORATION
- Ryuichi OKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE
- Publication number 20120286415
- Publication date Nov 15, 2012
- Takae Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR THE SAME
- Publication number 20120273799
- Publication date Nov 1, 2012
- Kabushiki Kaisha Toshiba
- Kazutaka TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PACKAGE MICROELECTRONIC APPARATUS, AND METHODS OF USING SAME
- Publication number 20120113704
- Publication date May 10, 2012
- Sriram Dattaguru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED PACKAGE
- Publication number 20120080674
- Publication date Apr 5, 2012
- Kabushiki Kaisha Toshiba
- Satoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20120049386
- Publication date Mar 1, 2012
- Samsung Electronics Co., Ltd.
- Hyung-Geun OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20120032329
- Publication date Feb 9, 2012
- Renesas Electronics Corporation
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING THE S...
- Publication number 20120025256
- Publication date Feb 2, 2012
- Takeshi Kususe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Submount and Method of Manufacturing the Same
- Publication number 20120012373
- Publication date Jan 19, 2012
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Yoshikazu Oshika
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING AN ELECTRONIC ASSEMBLY, ELEC...
- Publication number 20110291302
- Publication date Dec 1, 2011
- Muhlbauer AG
- Michael Max Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE PACKAGE USING A LIQUID CRYSTAL POLYMER
- Publication number 20110260192
- Publication date Oct 27, 2011
- Chang Hoon Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING LED PACKAGE AND SUBSTRATE THEREOF
- Publication number 20110256646
- Publication date Oct 20, 2011
- ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- SHEN-BO LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED PACKAGE
- Publication number 20110186868
- Publication date Aug 4, 2011
- Kabushiki Kaisha Toshiba
- Gen Watari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20110057713
- Publication date Mar 10, 2011
- KABUSHIKI KAISHA YASKAWA DENKI
- Yasuhiko KAWANAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked-chip packages in package-on-package apparatus, methods of a...
- Publication number 20100327419
- Publication date Dec 30, 2010
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-pakage microelectronic apparatus, and methods of using same
- Publication number 20100309704
- Publication date Dec 9, 2010
- Sriram Dattaguru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20100133688
- Publication date Jun 3, 2010
- RENESAS TECHNOLOGY CORP.
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20100001386
- Publication date Jan 7, 2010
- RENESAS TECHNOLOGY CORP.
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor chip and semiconductor device
- Publication number 20090294913
- Publication date Dec 3, 2009
- NEC Electronics Corporation
- Yoshitsugu Kawashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface-mounted optoelectronic semiconductor component and method f...
- Publication number 20090212316
- Publication date Aug 27, 2009
- Osram Opto Semiconductors GmbH
- Bert Braune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICE AND METHOD OF MANUFACTURING ELECTRICAL DEVICES US...
- Publication number 20090206474
- Publication date Aug 20, 2009
- Avery Dennison Corporation
- Scott Wayne Ferguson
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Submount and Method of Manufacturing the Same
- Publication number 20090207580
- Publication date Aug 20, 2009
- Yoshikazu Oshika
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Terbium [Tb]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Adhesive member, display device, and manufacturing method of displa...

Stacked-chip packages in package-on-package apparatus, methods of a...

Semiconductor integrated circuit device

Light emitting device and method for manufacturing light emitting d...

Stacked-chip packages in package-on-package apparatus, methods of a...

Light emitting device and method for manufacturing light emitting d...

Using millisecond pulsed laser welding in MEMS packaging

Multiple access over proximity communication

Semiconductor integrated circuit device

Method of producing semiconductor module and semiconductor module

Multiple access over proximity communication

Semiconductor light-emitting device, method for manufacturing the s...

Method and apparatus for manufacturing an electronic assembly, elec...

Flip-chip mounting resin composition and bump forming resin composi...

Submount

Semiconductor device

Submount and method of manufacturing the same

LED package

In-package microelectronic apparatus, and methods of using same

Semiconductor light-emitting device, method for manufacturing the s...

Semiconductor device

Power semiconductor module

Method for manufacturing LED package and substrate thereof

In-package microelectronic apparatus, and methods of using same

Semiconductor device including power supply bar having jutted porti...

Single-chip and multi-chip module for proximity communication

Electrical device and method of manufacturing electrical devices us...

Semiconductor integrated circuit device

Method for manufacturing semiconductor chip and semiconductor device

Semiconductor light-emitting device, method for manufacturing the s...

Patents Applicationslast 30 patents

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...

STACKED-CHIP PACKAGES IN PACKAGE-ON-PACKAGE APPARATUS, METHODS OF A...

LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING D...

USING MILLISECOND PULSED LASER WELDING IN MEMS PACKAGING

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING THE S...

STACKED-CHIP PACKAGES IN PACKAGE-ON-PACKAGE APPARATUS, METHODS OF A...

SEMICONDUCTOR DEVICE

METHOD OF PRODUCING SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR THE SAME

IN-PACKAGE MICROELECTRONIC APPARATUS, AND METHODS OF USING SAME

LED PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING THE S...

Submount and Method of Manufacturing the Same

METHOD AND APPARATUS FOR MANUFACTURING AN ELECTRONIC ASSEMBLY, ELEC...

LIGHT-EMITTING DIODE PACKAGE USING A LIQUID CRYSTAL POLYMER

METHOD FOR MANUFACTURING LED PACKAGE AND SUBSTRATE THEREOF

LED PACKAGE

POWER MODULE

Stacked-chip packages in package-on-package apparatus, methods of a...

In-pakage microelectronic apparatus, and methods of using same

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Method for manufacturing semiconductor chip and semiconductor device

Surface-mounted optoelectronic semiconductor component and method f...

ELECTRICAL DEVICE AND METHOD OF MANUFACTURING ELECTRICAL DEVICES US...

Submount and Method of Manufacturing the Same