Termination of transmission lines

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H05K1/0246

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/0246Termination of transmission lines

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Patents Grantslast 30 patents

Information Patent Grant
Waveguide launch system for coupling to a waveguide channel through...
- Patent number 12,087,990
- Issue date Sep 10, 2024
- Saab AB
- Sten Gunnarsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module board and memory module including the same
- Patent number 12,063,736
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Wonseop Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory devices and systems with parallel impedance adjustment circu...
- Patent number 12,001,368
- Issue date Jun 4, 2024
- Hyun Yoo Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring board, electronic component package, and electronic apparatus
- Patent number 11,889,618
- Issue date Jan 30, 2024
- Kyocera Corporation
- Toshihiko Kitamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit, circuit board, and electronic apparatus
- Patent number 11,888,475
- Issue date Jan 30, 2024
- Oki Electric Industry Co., Ltd.
- Keisuke Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module board and memory module including the same
- Patent number 11,785,710
- Issue date Oct 10, 2023
- Samsung Electronics Co., Ltd.
- Wonseop Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
C-PHY receiver with self-regulated common mode servo loop
- Patent number 11,764,733
- Issue date Sep 19, 2023
- QUALCOMM Incorporated
- Shih-Wei Chou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Vertically transitioning between substrate integrated waveguides (S...
- Patent number 11,658,378
- Issue date May 23, 2023
- International Business Machines Corporation
- Joshua C. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module board and memory module including the same
- Patent number 11,477,880
- Issue date Oct 18, 2022
- Samsung Electronics Co., Ltd.
- Wonseop Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
RF coaxial thermal power sensor
- Patent number 11,422,172
- Issue date Aug 23, 2022
- Jefferson D. Lexa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband termination for high power applications
- Patent number 11,406,008
- Issue date Aug 2, 2022
- TTM Technologies Inc.
- Omar Eldaiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low current line termination structure
- Patent number 11,323,108
- Issue date May 3, 2022
- Xilinx, Inc.
- Bob W. Verbruggen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fan-out transition structure for transmission of mm-Wave signals fr...
- Patent number 10,937,748
- Issue date Mar 2, 2021
- Huawei Technologies Co., Ltd.
- Houssam Kanj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication channel with tuning structure
- Patent number 10,771,291
- Issue date Sep 8, 2020
- Hewlett Packard Enterprise Development LP
- Melvin Benedict
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband termination for high power applications
- Patent number 10,772,193
- Issue date Sep 8, 2020
- TTM Technologies Inc.
- Omar Eldaiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,763,214
- Issue date Sep 1, 2020
- Renesas Electronics Corporation
- Shuuichi Kariyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices and systems with parallel impedance adjustment circu...
- Patent number 10,565,151
- Issue date Feb 18, 2020
- Micron Technology, Inc.
- Hyun Yoo Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical interface for package and die
- Patent number 10,212,807
- Issue date Feb 19, 2019
- MACOM Technology Solutions Holdings, Inc.
- Alfredo Moncayo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for transmitting differential data signals
- Patent number 10,178,762
- Issue date Jan 8, 2019
- Leoni Kabel Holding GmbH
- Bernd Janssen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Circuit board, electronic component housing package, and electronic...
- Patent number 10,051,725
- Issue date Aug 14, 2018
- KYOCERA Corporation
- Yoshiki Kawazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed signal routing topology for better signal quality
- Patent number 10,039,183
- Issue date Jul 31, 2018
- QUALCOMM Incorporated
- Yokesh Subramanian
- G11 - INFORMATION STORAGE
Information Patent Grant
High speed signal routing topology for better signal quality
- Patent number 9,980,366
- Issue date May 22, 2018
- QUALCOMM Incorporated
- Yokesh Subramanian
- G11 - INFORMATION STORAGE
Information Patent Grant
Electrical interface for printed circuit board, package and die
- Patent number 9,848,488
- Issue date Dec 19, 2017
- MACOM Technology Solutions Holdings, Inc.
- Alfredo Moncayo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Absorbing termination in an interconnect
- Patent number 9,750,129
- Issue date Aug 29, 2017
- Intel Corporation
- Shaowu Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Trace structure for improved electrical signaling
- Patent number 9,595,217
- Issue date Mar 14, 2017
- Samsung Display Co., Ltd.
- Minghui Han
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Absorbing termination in an interconnect
- Patent number 9,485,854
- Issue date Nov 1, 2016
- Intel Corporation
- Shaowu Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Printed circuit board and printed wiring board
- Patent number 9,456,489
- Issue date Sep 27, 2016
- Canon Kabushiki Kaisha
- Masanori Kikuchi
- G11 - INFORMATION STORAGE
Information Patent Grant
Components and circuits for output termination
- Patent number 9,450,279
- Issue date Sep 20, 2016
- SOCIONEXT INC.
- Ian Juso Dedic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transmission system and method for constructing backplane system
- Patent number 9,380,704
- Issue date Jun 28, 2016
- NEC Corporation
- Kazuhiro Kashiwakura
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Differential passive equalizer
- Patent number 9,277,651
- Issue date Mar 1, 2016
- Intel Corporation
- Kai Xiao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME
- Publication number 20230413424
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Wonseop LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Terahertz Carrier Sending Apparatus and Terahertz Carrier Receiving...
- Publication number 20230352807
- Publication date Nov 2, 2023
- Huawei Technologies Co., Ltd
- Luqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NETWORK SWITCH INCLUDING TRANSMISSION PORTS WHICH ARE NOT ARRANGED...
- Publication number 20230140400
- Publication date May 4, 2023
- Accton Technology Corporation
- Kuan-Tse Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY DEVICES AND SYSTEMS WITH PARALLEL IMPEDANCE ADJUSTMENT CIRCU...
- Publication number 20230039984
- Publication date Feb 9, 2023
- Micron Technology, Inc.
- Hyun Yoo Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME
- Publication number 20230013064
- Publication date Jan 19, 2023
- Samsung Electronics Co., Ltd.
- Wonseop LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT, CIRCUIT BOARD, AND ELECTRONIC APPARATUS
- Publication number 20220385289
- Publication date Dec 1, 2022
- Oki Electric Industry Co., Ltd.
- Keisuke WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CIRCUIT BOARD
- Publication number 20220304149
- Publication date Sep 22, 2022
- 3M Innovative Properties Company
- YunLong Qiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, ELECTRONIC COMPONENT PACKAGE, AND ELECTRONIC APPARATUS
- Publication number 20220217834
- Publication date Jul 7, 2022
- KYOCERA CORPORATION
- Toshihiko KITAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME
- Publication number 20220159827
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- Wonseop LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAVEGUIDE LAUNCH
- Publication number 20210151849
- Publication date May 20, 2021
- SAAB AB
- Gunnarsson STEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDEBAND TERMINATION FOR HIGH POWER APPLICATIONS
- Publication number 20210127482
- Publication date Apr 29, 2021
- TTM TECHNOLOGIES, INC.
- Omar Eldaiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICALLY TRANSITIONING BETWEEN SUBSTRATE INTEGRATED WAVEGUIDES (S...
- Publication number 20210111472
- Publication date Apr 15, 2021
- International Business Machines Corporation
- JOSHUA C. MYERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT TRANSITION STRUCTURE FOR TRANSMISSION OF mm-WAVE SIGNALS FR...
- Publication number 20210082840
- Publication date Mar 18, 2021
- Huawei Technologies Co., Ltd
- Houssam KANJ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF MANUFACTURING A STRUCTURE FOR GUIDING ELECT...
- Publication number 20200411942
- Publication date Dec 31, 2020
- Nokia Solutions and Networks Oy
- Florian Pivit
- B22 - CASTING POWDER METALLURGY
Information Patent Application
RF Coaxial Thermal Power Sensor
- Publication number 20200341038
- Publication date Oct 29, 2020
- TEGAM, INC.
- Jefferson D. Lexa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY DEVICES AND SYSTEMS WITH PARALLEL IMPEDANCE ADJUSTMENT CIRCU...
- Publication number 20200159684
- Publication date May 21, 2020
- Micron Technology, Inc.
- Hyun Yoo Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190363050
- Publication date Nov 28, 2019
- RENESAS ELECTRONICS CORPORATION
- Shuuichi KARIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMUNICATION CHANNEL WITH TUNING STRUCTURE
- Publication number 20190238370
- Publication date Aug 1, 2019
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Melvin Benedict
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND OPTICAL MODULE
- Publication number 20190182949
- Publication date Jun 13, 2019
- Sumitomo Electric Industries, Ltd.
- Taichi Misawa
- G02 - OPTICS
Information Patent Application
NOVEL HIGH SPEED SIGNAL ROUTING TOPOLOGY FOR BETTER SIGNAL QUALITY
- Publication number 20180220524
- Publication date Aug 2, 2018
- QUALCOMM Incorporated
- Yokesh SUBRAMANIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL INTERFACE FOR PACKAGE AND DIE
- Publication number 20180103541
- Publication date Apr 12, 2018
- MACOM Technology Solutions Holdings, Inc.
- Alfredo Moncayo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINATION CIRCUIT, WIRELESS COMMUNICATION DEVICE AND TERMINATION...
- Publication number 20180019510
- Publication date Jan 18, 2018
- NEC Corporation
- Shiro HIROSAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERFACE FOR PRINTED CIRCUIT BOARD, PACKAGE AND DIE
- Publication number 20170367177
- Publication date Dec 21, 2017
- MACOM Technology Solutions Holdings, Inc.
- Alfredo Moncayo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADAR SYSTEM FOR REGISTERING THE ENVIRONMENT FOR A MOTOR VEHICLE AN...
- Publication number 20170055344
- Publication date Feb 23, 2017
- Conti Temic microelectronic GmbH
- Michael Menge
- G01 - MEASURING TESTING
Information Patent Application
FERROELECTRIC NANOCOMPOSITE BASED DIELECTRIC INKS FOR RECONFIGURABL...
- Publication number 20170009090
- Publication date Jan 12, 2017
- University of Massachusetts
- Mahdi Haghzadeh
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CIRCUIT BOARD, ELECTRONIC COMPONENT HOUSING PACKAGE, AND ELECTRONIC...
- Publication number 20160120026
- Publication date Apr 28, 2016
- KYOCERA CORPORATION
- Yoshiki Kawazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DECREASING STUB RESONANCE OF PLATING FOR CI...
- Publication number 20140326489
- Publication date Nov 6, 2014
- Bhyrav M. Mutnury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIFFERENTIAL PASSIVE EQUALIZER
- Publication number 20140266516
- Publication date Sep 18, 2014
- Kai Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND PRINTED WIRING BOARD
- Publication number 20140226278
- Publication date Aug 14, 2014
- Canon Kabushiki Kaisha
- Masanori Kikuchi
- G11 - INFORMATION STORAGE
Information Patent Application
GROUND TERMINATION WITH DAMPENED RESONANCE
- Publication number 20140065856
- Publication date Mar 6, 2014
- Molex Incorporated
- Kent E. Regnier
- H01 - BASIC ELECTRIC ELEMENTS

Termination of transmission lines

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Waveguide launch system for coupling to a waveguide channel through...

Module board and memory module including the same

Memory devices and systems with parallel impedance adjustment circu...

Wiring board, electronic component package, and electronic apparatus

Integrated circuit, circuit board, and electronic apparatus

Module board and memory module including the same

C-PHY receiver with self-regulated common mode servo loop

Vertically transitioning between substrate integrated waveguides (S...

Module board and memory module including the same

RF coaxial thermal power sensor

Wideband termination for high power applications

Low current line termination structure

Fan-out transition structure for transmission of mm-Wave signals fr...

Communication channel with tuning structure

Wideband termination for high power applications

Semiconductor device

Memory devices and systems with parallel impedance adjustment circu...

Electrical interface for package and die

Device and method for transmitting differential data signals

Circuit board, electronic component housing package, and electronic...

High speed signal routing topology for better signal quality

High speed signal routing topology for better signal quality

Electrical interface for printed circuit board, package and die

Absorbing termination in an interconnect

Trace structure for improved electrical signaling

Absorbing termination in an interconnect

Printed circuit board and printed wiring board

Components and circuits for output termination

Transmission system and method for constructing backplane system

Differential passive equalizer

Patents Applicationslast 30 patents

MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME

Terahertz Carrier Sending Apparatus and Terahertz Carrier Receiving...

NETWORK SWITCH INCLUDING TRANSMISSION PORTS WHICH ARE NOT ARRANGED...

MEMORY DEVICES AND SYSTEMS WITH PARALLEL IMPEDANCE ADJUSTMENT CIRCU...

MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME

INTEGRATED CIRCUIT, CIRCUIT BOARD, AND ELECTRONIC APPARATUS

MULTILAYER CIRCUIT BOARD

WIRING BOARD, ELECTRONIC COMPONENT PACKAGE, AND ELECTRONIC APPARATUS

MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME

WAVEGUIDE LAUNCH

WIDEBAND TERMINATION FOR HIGH POWER APPLICATIONS

VERTICALLY TRANSITIONING BETWEEN SUBSTRATE INTEGRATED WAVEGUIDES (S...

FAN-OUT TRANSITION STRUCTURE FOR TRANSMISSION OF mm-WAVE SIGNALS FR...

STRUCTURE AND METHOD OF MANUFACTURING A STRUCTURE FOR GUIDING ELECT...

RF Coaxial Thermal Power Sensor

MEMORY DEVICES AND SYSTEMS WITH PARALLEL IMPEDANCE ADJUSTMENT CIRCU...

SEMICONDUCTOR DEVICE

COMMUNICATION CHANNEL WITH TUNING STRUCTURE

FLEXIBLE PRINTED CIRCUIT BOARD AND OPTICAL MODULE

NOVEL HIGH SPEED SIGNAL ROUTING TOPOLOGY FOR BETTER SIGNAL QUALITY

ELECTRICAL INTERFACE FOR PACKAGE AND DIE

TERMINATION CIRCUIT, WIRELESS COMMUNICATION DEVICE AND TERMINATION...

ELECTRICAL INTERFACE FOR PRINTED CIRCUIT BOARD, PACKAGE AND DIE

RADAR SYSTEM FOR REGISTERING THE ENVIRONMENT FOR A MOTOR VEHICLE AN...

FERROELECTRIC NANOCOMPOSITE BASED DIELECTRIC INKS FOR RECONFIGURABL...

CIRCUIT BOARD, ELECTRONIC COMPONENT HOUSING PACKAGE, AND ELECTRONIC...

SYSTEMS AND METHODS FOR DECREASING STUB RESONANCE OF PLATING FOR CI...

DIFFERENTIAL PASSIVE EQUALIZER

PRINTED CIRCUIT BOARD AND PRINTED WIRING BOARD

GROUND TERMINATION WITH DAMPENED RESONANCE