the additional leads being a multilayer

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49527the additional leads being a multilayer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package-embedded board
- Patent number 11,948,849
- Issue date Apr 2, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,887,916
- Issue date Jan 30, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Hyeong Il Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead between a plurality of encapsulated MOSFETs
- Patent number 11,830,792
- Issue date Nov 28, 2023
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged high voltage MOSFET device with connection clip and manufa...
- Patent number 11,830,794
- Issue date Nov 28, 2023
- STMicroelectronics S.r.l.
- Cristiano Gianluca Stella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer interconnection ribbon
- Patent number 11,705,387
- Issue date Jul 18, 2023
- Infineon Technologies AG
- Emil Lamco Jocson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional package for semiconductor devices and external co...
- Patent number 11,631,632
- Issue date Apr 18, 2023
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metallization structure on opposite sides...
- Patent number 11,552,016
- Issue date Jan 10, 2023
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,329,004
- Issue date May 10, 2022
- Samsung Electronics Co., Ltd.
- Jieun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through hole side wettable flank
- Patent number 11,227,820
- Issue date Jan 18, 2022
- Nexperia B.V.
- Kan Wae Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, laminated semiconductor arrangement and...
- Patent number 11,183,445
- Issue date Nov 23, 2021
- Infineon Technologies AG
- Dirk Ahlers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices, corresponding device...
- Patent number 11,133,242
- Issue date Sep 28, 2021
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die semiconductor package
- Patent number 11,075,147
- Issue date Jul 27, 2021
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure having an intermediate layer between an upper cond...
- Patent number 11,062,985
- Issue date Jul 13, 2021
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,043,440
- Issue date Jun 22, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,037,868
- Issue date Jun 15, 2021
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack frame for electrical connections and the method to fabricate...
- Patent number 11,031,255
- Issue date Jun 8, 2021
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metallization structure on opposite sides...
- Patent number 10,971,449
- Issue date Apr 6, 2021
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,943,878
- Issue date Mar 9, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yun Tae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stacked die package with flexible interconnect
- Patent number 10,892,248
- Issue date Jan 12, 2021
- Intel Corporation
- Hyoung Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,886,246
- Issue date Jan 5, 2021
- Samsung Electronics Co., Ltd.
- Bong Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices, corresponding device...
- Patent number 10,818,578
- Issue date Oct 27, 2020
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management application of interconnect substrates
- Patent number 10,748,845
- Issue date Aug 18, 2020
- Volterra Semiconductor Corporation
- Mihalis Michael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multiple molding routing layers and a me...
- Patent number 10,734,247
- Issue date Aug 4, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and power conversion system including same
- Patent number 10,727,173
- Issue date Jul 28, 2020
- Hyundai Motor Company
- Jun Hee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,629,519
- Issue date Apr 21, 2020
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,615,105
- Issue date Apr 7, 2020
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack frame for electrical connections and the method to fabricate...
- Patent number 10,593,561
- Issue date Mar 17, 2020
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metallization structure on opposite sides...
- Patent number 10,593,623
- Issue date Mar 17, 2020
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management application of interconnect substrates
- Patent number 10,332,827
- Issue date Jun 25, 2019
- Volterra Semiconductor Corporation
- Mihalis Michael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multiple molding routing layers and a me...
- Patent number 10,325,782
- Issue date Jun 18, 2019
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20240145332
- Publication date May 2, 2024
- Hitachi Energy Ltd
- Niko PAVLICEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240136320
- Publication date Apr 25, 2024
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED HIGH VOLTAGE MOSFET DEVICE WITH CONNECTION CLIP AND MANUFA...
- Publication number 20240136260
- Publication date Apr 25, 2024
- STMicroelectronics S.r.l.
- Cristiano Gianluca STELLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240120262
- Publication date Apr 11, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyeong Il JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240055329
- Publication date Feb 15, 2024
- ROHM CO., LTD.
- Kentaro NASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL PACKAGE FOR SEMICONDUCTOR DEVICES AND EXTERNAL CO...
- Publication number 20230352373
- Publication date Nov 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE PACKAGE WITH COAXIAL LEAD ASSEMBLY
- Publication number 20230154833
- Publication date May 18, 2023
- Qorvo US, Inc.
- Michael Roberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230066285
- Publication date Mar 2, 2023
- STMicroelectronics S.r.l.
- Antonio BELLIZZI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF COUPLING SEMICONDUCTOR DICE AND CORRESPONDING SEMICONDUCT...
- Publication number 20230035470
- Publication date Feb 2, 2023
- STMicroelectronics S.r.l
- Andrea ALBERTINETTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF COUPLING SEMICONDUCTOR DICE, TOOL FOR USE THEREIN AND COR...
- Publication number 20230035445
- Publication date Feb 2, 2023
- STMicroelectronics S.r.l
- Dario VITELLO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE
- Publication number 20220406691
- Publication date Dec 22, 2022
- RICHTEK TECHNOLOGY CORPORATION
- Lung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES
- Publication number 20220238421
- Publication date Jul 28, 2022
- Semiconductor Components Industries, LLC
- Maria Clemens Ypil QUINONES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-EMBEDDED BOARD
- Publication number 20220208629
- Publication date Jun 30, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL PACKAGE FOR SEMICONDUCTOR DEVICES AND EXTERNAL CO...
- Publication number 20220208655
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20220077031
- Publication date Mar 10, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyeong Il JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Interconnection Ribbon
- Publication number 20220068770
- Publication date Mar 3, 2022
- Emil Lamco Jocson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED HIGH VOLTAGE MOSFET DEVICE WITH CONNECTION CLIP AND MANUFA...
- Publication number 20220013439
- Publication date Jan 13, 2022
- STMicroelectronics S.r.l.
- Cristiano Gianluca STELLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210398884
- Publication date Dec 23, 2021
- Kentaro NASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
- Publication number 20210242167
- Publication date Aug 5, 2021
- Semiconductor Components Industries, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH METALLIZATION STRUCTURE ON OPPOSITE SIDES...
- Publication number 20210183763
- Publication date Jun 17, 2021
- INFINEON TECHNOLOGIES AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE SEMICONDUCTOR PACKAGE
- Publication number 20210013138
- Publication date Jan 14, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20210013134
- Publication date Jan 14, 2021
- STMicroelectronics S.r.l.
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200411461
- Publication date Dec 31, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Yun Tae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200395263
- Publication date Dec 17, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Hyung Kyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH HOLE SIDE WETTABLE FLANK
- Publication number 20200357728
- Publication date Nov 12, 2020
- NEXPERIA B.V.
- Kan Wae Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT, LAMINATED SEMICONDUCTOR ARRANGEMENT AND...
- Publication number 20200279799
- Publication date Sep 3, 2020
- INFINEON TECHNOLOGIES AG
- Dirk AHLERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200194356
- Publication date Jun 18, 2020
- Advanced Semiconductor Engineering, Inc.
- Hui Hua LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200194381
- Publication date Jun 18, 2020
- Samsung Electronics Co., Ltd.
- Jieun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A Stack Frame for Electrical Connections and the Method to Fabricat...
- Publication number 20200176270
- Publication date Jun 4, 2020
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Metallization Structure on Opposite Sides...
- Publication number 20200126904
- Publication date Apr 23, 2020
- INFINEON TECHNOLOGIES AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS

the additional leads being a multilayer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package-embedded board

Semiconductor devices and methods of manufacturing semiconductor de...

Lead between a plurality of encapsulated MOSFETs

Packaged high voltage MOSFET device with connection clip and manufa...

Multi-layer interconnection ribbon

Three dimensional package for semiconductor devices and external co...

Semiconductor device with metallization structure on opposite sides...

Semiconductor package

Through hole side wettable flank

Semiconductor arrangement, laminated semiconductor arrangement and...

Method of manufacturing semiconductor devices, corresponding device...

Stacked die semiconductor package

Wiring structure having an intermediate layer between an upper cond...

Semiconductor package

Semiconductor device package and method of manufacturing the same

Stack frame for electrical connections and the method to fabricate...

Semiconductor device with metallization structure on opposite sides...

Semiconductor package

Multi-stacked die package with flexible interconnect

Fan-out semiconductor package

Method of manufacturing semiconductor devices, corresponding device...

Power management application of interconnect substrates

Semiconductor package with multiple molding routing layers and a me...

Power module and power conversion system including same

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Stack frame for electrical connections and the method to fabricate...

Semiconductor device with metallization structure on opposite sides...

Power management application of interconnect substrates

Semiconductor package with multiple molding routing layers and a me...

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICE

PACKAGED HIGH VOLTAGE MOSFET DEVICE WITH CONNECTION CLIP AND MANUFA...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE

THREE DIMENSIONAL PACKAGE FOR SEMICONDUCTOR DEVICES AND EXTERNAL CO...

MODULE PACKAGE WITH COAXIAL LEAD ASSEMBLY

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

METHOD OF COUPLING SEMICONDUCTOR DICE AND CORRESPONDING SEMICONDUCT...

METHOD OF COUPLING SEMICONDUCTOR DICE, TOOL FOR USE THEREIN AND COR...

INTELLIGENT POWER MODULE

MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES

PACKAGE-EMBEDDED BOARD

THREE DIMENSIONAL PACKAGE FOR SEMICONDUCTOR DEVICES AND EXTERNAL CO...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

Multi-Layer Interconnection Ribbon

PACKAGED HIGH VOLTAGE MOSFET DEVICE WITH CONNECTION CLIP AND MANUFA...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

SEMICONDUCTOR DEVICE WITH METALLIZATION STRUCTURE ON OPPOSITE SIDES...

STACKED DIE SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

THROUGH HOLE SIDE WETTABLE FLANK

SEMICONDUCTOR ARRANGEMENT, LAMINATED SEMICONDUCTOR ARRANGEMENT AND...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

A Stack Frame for Electrical Connections and the Method to Fabricat...

Semiconductor Device with Metallization Structure on Opposite Sides...