the additional leads being a wiring board

Industry

CPC
H01L23/49531

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49531the additional leads being a wiring board

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,948,866
- Issue date Apr 2, 2024
- Rohm Co., Ltd.
- Nahoko Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 11,915,998
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,881,444
- Issue date Jan 23, 2024
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging high-frequency microwave circuits using hot via die attac...
- Patent number 11,869,858
- Issue date Jan 9, 2024
- Marki Microwave, Inc.
- Christopher Ferenc Marki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid-cooled package having shielding layer
- Patent number 11,862,533
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having die pad with cooling fins
- Patent number 11,848,256
- Issue date Dec 19, 2023
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package module
- Patent number 11,842,950
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 11,837,537
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Bongju Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,810,840
- Issue date Nov 7, 2023
- Shinko Electric Industries Co., Ltd.
- Toshiyuki Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,776,867
- Issue date Oct 3, 2023
- Industrial Technology Research Institute
- Kuo-Shu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with frame having arms
- Patent number 11,715,677
- Issue date Aug 1, 2023
- STMicroelectronics, Inc.
- Jefferson Sismundo Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,699,641
- Issue date Jul 11, 2023
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module and interposer
- Patent number 11,640,860
- Issue date May 2, 2023
- Murata Manufacturing Co., Ltd.
- Keito Yonemori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package comprising substrate, semiconductor chip...
- Patent number 11,631,628
- Issue date Apr 18, 2023
- Infineon Technologies AG
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state switching device
- Patent number 11,587,856
- Issue date Feb 21, 2023
- ABB Schweiz AG
- Paolo Antonello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module comprising two substrates and method of manufacturing...
- Patent number 11,574,889
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Ottmar Geitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a resin layer sealing a plurality of se...
- Patent number 11,551,985
- Issue date Jan 10, 2023
- Kioxia Corporation
- Yuki Sugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 11,545,421
- Issue date Jan 3, 2023
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of power semiconductor chips between a substrate and lead...
- Patent number 11,521,920
- Issue date Dec 6, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,508,646
- Issue date Nov 22, 2022
- Mitsubishi Electric Corporation
- Katsumi Miyawaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 11,502,027
- Issue date Nov 15, 2022
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Suspended semiconductor dies
- Patent number 11,495,522
- Issue date Nov 8, 2022
- Texas Instruments Incorporated
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power converter using the same
- Patent number 11,489,457
- Issue date Nov 1, 2022
- Denso Corporation
- Shingo Tsuchimochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module and interposer
- Patent number 11,450,451
- Issue date Sep 20, 2022
- Murata Manufacturing Co., Ltd.
- Keito Yonemori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with a reflow wall
- Patent number 11,437,333
- Issue date Sep 6, 2022
- Texas Instruments Incorporated
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 11,417,589
- Issue date Aug 16, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure including an encapsulant having a c...
- Patent number 11,410,915
- Issue date Aug 9, 2022
- Advanced Semiconductor Engineering, Inc.
- Yu-Che Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power control modules
- Patent number 11,404,354
- Issue date Aug 2, 2022
- Hamilton Sundstrand Corporation
- John A. Dickey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having die pad with cooling fins
- Patent number 11,398,417
- Issue date Jul 26, 2022
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly with conductive frame for I/O standoff and t...
- Patent number 11,393,743
- Issue date Jul 19, 2022
- Infineon Technologies AG
- Stuart Cardwell
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MONOLITHIC MULTIPLE-CHANNEL PROTECTION DEVICE
- Publication number 20240128167
- Publication date Apr 18, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Glenda Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20240112991
- Publication date Apr 4, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240112992
- Publication date Apr 4, 2024
- ROHM CO., LTD.
- Isamu NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, POWER CONVERTER, AND POWER CONVERTER MANUFACT...
- Publication number 20240071876
- Publication date Feb 29, 2024
- Fuji Electric Co., Ltd.
- Akira ISO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS CURRENT SENSOR PACKAGE WITH HIGH ISOLATION
- Publication number 20240044946
- Publication date Feb 8, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT UNIT, AND METHOD...
- Publication number 20240021503
- Publication date Jan 18, 2024
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER AND POWER CONVERTER MANUFACTURING METHOD
- Publication number 20230411250
- Publication date Dec 21, 2023
- Fuji Electric Co., Ltd.
- Norihiro DAICHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20230378025
- Publication date Nov 23, 2023
- Hitachi, Ltd
- Kyota ASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20230369180
- Publication date Nov 16, 2023
- KYOCERA CORPORATION
- Akihiro MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230326835
- Publication date Oct 12, 2023
- NEXPERIA B.V.
- Hing Suan Cheam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230298981
- Publication date Sep 21, 2023
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING HIGH-FREQUENCY MICROWAVE CIRCUITS USING HOT VIA DIE ATTAC...
- Publication number 20230215823
- Publication date Jul 6, 2023
- Marki Microwave, Inc.
- Christopher Ferenc Marki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230109471
- Publication date Apr 6, 2023
- Rohm Co., Ltd.
- Yuji ISHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230107764
- Publication date Apr 6, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Akira SAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSPENDED SEMICONDUCTOR DIES
- Publication number 20230089201
- Publication date Mar 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Barry Jon MALE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
- Publication number 20230075519
- Publication date Mar 9, 2023
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...
- Publication number 20230031119
- Publication date Feb 2, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20220319965
- Publication date Oct 6, 2022
- Rohm Co., Ltd.
- Akira Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20220310473
- Publication date Sep 29, 2022
- Industrial Technology Research Institute
- Kuo-Shu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE MODULE
- Publication number 20220246506
- Publication date Aug 4, 2022
- Samsung Electronics Co., Ltd.
- Yongjin PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220223504
- Publication date Jul 14, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSPENDED SEMICONDUCTOR DIES
- Publication number 20220189857
- Publication date Jun 16, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Barry Jon MALE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220148946
- Publication date May 12, 2022
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220139813
- Publication date May 5, 2022
- Rohm Co., Ltd.
- Nahoko KAWASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220139812
- Publication date May 5, 2022
- Advanced Semiconductor Engineering, Inc.
- Yu-Che HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluid-Cooled Package Having Shielding Layer
- Publication number 20220115293
- Publication date Apr 14, 2022
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220059438
- Publication date Feb 24, 2022
- Shinko Electric Industries Co., Ltd.
- Toshiyuki OKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DIE PAD WITH COOLING FINS
- Publication number 20220044989
- Publication date Feb 10, 2022
- STMICROELECTRONICS, INC.
- Jefferson TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME PACKAGE
- Publication number 20220005754
- Publication date Jan 6, 2022
- Industrial Technology Research Institute
- Ren-Shin CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES HAVING CAP WITH INTEGRATED ELECTRICAL...
- Publication number 20210391226
- Publication date Dec 16, 2021
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS

the additional leads being a wiring board

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device and a method of manufacturing a semiconductor...

Semiconductor device

Packaging high-frequency microwave circuits using hot via die attac...

Fluid-cooled package having shielding layer

Semiconductor package having die pad with cooling fins

Package module

Fan-out semiconductor package

Semiconductor device

Chip package

Semiconductor device with frame having arms

Semiconductor device

Circuit module and interposer

Semiconductor chip package comprising substrate, semiconductor chip...

Solid state switching device

Power module comprising two substrates and method of manufacturing...

Semiconductor device having a resin layer sealing a plurality of se...

Package including multiple semiconductor devices

Plurality of power semiconductor chips between a substrate and lead...

Semiconductor device

Package including multiple semiconductor devices

Suspended semiconductor dies

Semiconductor module and power converter using the same

Circuit module and interposer

Packaged semiconductor device with a reflow wall

Semiconductor device and a method of manufacturing a semiconductor...

Semiconductor package structure including an encapsulant having a c...

Power control modules

Semiconductor package having die pad with cooling fins

Semiconductor assembly with conductive frame for I/O standoff and t...

Patents Applicationslast 30 patents

MONOLITHIC MULTIPLE-CHANNEL PROTECTION DEVICE

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE, POWER CONVERTER, AND POWER CONVERTER MANUFACT...

LEADLESS CURRENT SENSOR PACKAGE WITH HIGH ISOLATION

ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT UNIT, AND METHOD...

POWER CONVERTER AND POWER CONVERTER MANUFACTURING METHOD

POWER CONVERSION DEVICE

WIRING SUBSTRATE AND ELECTRONIC DEVICE

MOLDED ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

PACKAGING HIGH-FREQUENCY MICROWAVE CIRCUITS USING HOT VIA DIE ATTAC...

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SUSPENDED SEMICONDUCTOR DIES

PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...

Semiconductor Device

CHIP PACKAGE

PACKAGE MODULE

SEMICONDUCTOR PACKAGE

SUSPENDED SEMICONDUCTOR DIES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Fluid-Cooled Package Having Shielding Layer

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE HAVING DIE PAD WITH COOLING FINS

LEAD FRAME PACKAGE

SEMICONDUCTOR DEVICE PACKAGES HAVING CAP WITH INTEGRATED ELECTRICAL...