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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32137the bodies being arranged next to each other

Industries

Patents Grantslast 30 patents

Information Patent Grant
System and method for integration of biological chips
- Patent number 12,128,377
- Issue date Oct 29, 2024
- MGI Tech Co., Ltd.
- Liang Wang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Display panel, preparation method thereof, and display device
- Patent number 12,033,974
- Issue date Jul 9, 2024
- Shanghai Tianma Micro-Electronics Co,. Ltd.
- Quanpeng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal bonding pads for underfill application in semiconductor...
- Patent number 11,997,842
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting element and display device including the same and me...
- Patent number 11,955,468
- Issue date Apr 9, 2024
- Samsung Display Co., Ltd.
- Yunku Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable display module and manufacturing method thereof
- Patent number 11,916,052
- Issue date Feb 27, 2024
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Li Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiled display device
- Patent number 11,869,873
- Issue date Jan 9, 2024
- Samsung Display Co., Ltd.
- Dong Hee Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring designs supporting efficient die to die routing
- Patent number 11,862,481
- Issue date Jan 2, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondutor package substrate with die cavity and redistribution l...
- Patent number 11,854,922
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly and method for forming the same
- Patent number 10,903,198
- Issue date Jan 26, 2021
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to enable interposer to interposer connection
- Patent number 10,804,117
- Issue date Oct 13, 2020
- Intel Corporation
- Digvijay Ashokkumar Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 10,553,559
- Issue date Feb 4, 2020
- Mitsubishi Electric Corporation
- Noriyuki Besshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly and method for forming the same
- Patent number 10,497,689
- Issue date Dec 3, 2019
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge interconnect packaging of integrated circuits for power systems
- Patent number 10,325,875
- Issue date Jun 18, 2019
- North Carolina State University
- Jason M. Kulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser sintered interconnections between die
- Patent number 9,935,079
- Issue date Apr 3, 2018
- NXP USA, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity bridge connection for die split architecture
- Patent number 9,443,824
- Issue date Sep 13, 2016
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having the first and second chip inclined si...
- Patent number 8,907,490
- Issue date Dec 9, 2014
- SK Hynix Inc.
- So Hyun Jung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DUMMY METAL BONDING PADS FOR UNDERFILL APPLICATION IN SEMICONDUCTOR...
- Publication number 20240381605
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Chih YEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATIVE SEMICONDUCTOR PACKAGE
- Publication number 20240355703
- Publication date Oct 24, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240243110
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- HYEONJEONG HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234277
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Narae SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seal Ring Designs Supporting Efficient Die to Die Routing
- Publication number 20240096648
- Publication date Mar 21, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240057353
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055398
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240047443
- Publication date Feb 8, 2024
- Kabushiki Kaisha Toshiba
- Jia LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY METAL BONDING PADS FOR UNDERFILL APPLICATION IN SEMICONDUCTOR...
- Publication number 20230380126
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Chih YEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20230369274
- Publication date Nov 16, 2023
- Taiwan Semiconduction Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING REDISTRIBUTION LAYERS FORMED ON AN ACTI...
- Publication number 20230307374
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230260887
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Se-Ho YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH DIRECT ATTACH TO CIRCUIT BOARDS
- Publication number 20230082706
- Publication date Mar 16, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY METAL BONDING PADS FOR UNDERFILL APPLICATION IN SEMICONDUCTOR...
- Publication number 20230067350
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Chih YEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230042063
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- SEONGHOON BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUTOR PACKAGE SUBSTRATE WITH DIE CAVITY AND REDISTRIBUTION L...
- Publication number 20220406673
- Publication date Dec 22, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHABLE DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20220359477
- Publication date Nov 10, 2022
- Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Li Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seal Ring Designs Supporting Efficient Die to Die Routing
- Publication number 20220293433
- Publication date Sep 15, 2022
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND TILED DISPLAY DEVICE
- Publication number 20220231001
- Publication date Jul 21, 2022
- SAMSUNG DISPLAY CO., LTD.
- KWANGSU PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE
- Publication number 20220052022
- Publication date Feb 17, 2022
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Quanpeng YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR INTEGRATION OF BIOLOGICAL CHIPS
- Publication number 20220040662
- Publication date Feb 10, 2022
- Liang Wang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20220045156
- Publication date Feb 10, 2022
- SAMSUNG DISPLAY CO., LTD.
- DONG HEE SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING ELEMENT AND DISPLAY DEVICE INCLUDING THE SAME AND ME...
- Publication number 20210035962
- Publication date Feb 4, 2021
- SAMSUNG DISPLAY CO., LTD.
- Yunku JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE INTERCONNECT
- Publication number 20200388604
- Publication date Dec 10, 2020
- QUALCOMM Incorporated
- Byoungyong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD FOR FORMING THE SAME
- Publication number 20200075572
- Publication date Mar 5, 2020
- MEDIATEK INC.
- Chia-Cheng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ENABLE INTERPOSER TO INTERPOSER CONNECTION
- Publication number 20190304809
- Publication date Oct 3, 2019
- Intel Corporation
- Digvijay Ashokkumar Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20180197838
- Publication date Jul 12, 2018
- MITSUBISHI ELECTRIC CORPORATION
- Noriyuki BESSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical Memory Module Enabled by Fan-Out Redistribution Layer
- Publication number 20180040587
- Publication date Feb 8, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Interconnect Packaging of Integrated Circuits for Power Systems
- Publication number 20170162532
- Publication date Jun 8, 2017
- Jason M. Kulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY BRIDGE CONNECTION FOR DIE SPLIT ARCHITECTURE
- Publication number 20160379959
- Publication date Dec 29, 2016
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS

the bodies being arranged next to each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

System and method for integration of biological chips

Display panel, preparation method thereof, and display device

Dummy metal bonding pads for underfill application in semiconductor...

Light emitting element and display device including the same and me...

Stretchable display module and manufacturing method thereof

Tiled display device

Seal ring designs supporting efficient die to die routing

Semicondutor package substrate with die cavity and redistribution l...

Semiconductor package assembly and method for forming the same

Method to enable interposer to interposer connection

Power semiconductor device

Semiconductor package assembly and method for forming the same

Edge interconnect packaging of integrated circuits for power systems

Laser sintered interconnections between die

Cavity bridge connection for die split architecture

Semiconductor packages having the first and second chip inclined si...

Patents Applicationslast 30 patents

DUMMY METAL BONDING PADS FOR UNDERFILL APPLICATION IN SEMICONDUCTOR...

HEAT DISSIPATIVE SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

Seal Ring Designs Supporting Efficient Die to Die Routing

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

DUMMY METAL BONDING PADS FOR UNDERFILL APPLICATION IN SEMICONDUCTOR...

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE HAVING REDISTRIBUTION LAYERS FORMED ON AN ACTI...

SEMICONDUCTOR PACKAGE

MICROELECTRONIC ASSEMBLIES WITH DIRECT ATTACH TO CIRCUIT BOARDS

DUMMY METAL BONDING PADS FOR UNDERFILL APPLICATION IN SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

SEMICONDUTOR PACKAGE SUBSTRATE WITH DIE CAVITY AND REDISTRIBUTION L...

STRETCHABLE DISPLAY MODULE AND MANUFACTURING METHOD THEREOF

Seal Ring Designs Supporting Efficient Die to Die Routing

DISPLAY DEVICE AND TILED DISPLAY DEVICE

DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE

SYSTEM AND METHOD FOR INTEGRATION OF BIOLOGICAL CHIPS

DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME

LIGHT EMITTING ELEMENT AND DISPLAY DEVICE INCLUDING THE SAME AND ME...

MULTI-DIE INTERCONNECT

SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD FOR FORMING THE SAME

METHOD TO ENABLE INTERPOSER TO INTERPOSER CONNECTION

POWER SEMICONDUCTOR DEVICE

Vertical Memory Module Enabled by Fan-Out Redistribution Layer

Edge Interconnect Packaging of Integrated Circuits for Power Systems

CAVITY BRIDGE CONNECTION FOR DIE SPLIT ARCHITECTURE