-
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SEMICONDUCTOR PACKAGE
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Publication number 20240055398
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Publication date Feb 15, 2024
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Samsung Electronics Co., Ltd.
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Choong Bin Yim
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SEMICONDUCTOR DEVICE
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Publication number 20240047443
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Publication date Feb 8, 2024
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Kabushiki Kaisha Toshiba
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Jia LIU
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SEMICONDUCTOR PACKAGE
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Publication number 20230260887
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Publication date Aug 17, 2023
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Samsung Electronics Co., Ltd.
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Se-Ho YOU
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20230042063
-
Publication date Feb 9, 2023
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Samsung Electronics Co., Ltd.
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SEONGHOON BAE
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H01 - BASIC ELECTRIC ELEMENTS
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MULTI-DIE INTERCONNECT
-
Publication number 20200388604
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Publication date Dec 10, 2020
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QUALCOMM Incorporated
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Byoungyong LEE
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H01 - BASIC ELECTRIC ELEMENTS
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POWER SEMICONDUCTOR DEVICE
-
Publication number 20180197838
-
Publication date Jul 12, 2018
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MITSUBISHI ELECTRIC CORPORATION
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Noriyuki BESSHI
-
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20160172265
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Publication date Jun 16, 2016
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J-DEVICES CORPORATION
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Kiyoaki HASHIMOTO
-
H01 - BASIC ELECTRIC ELEMENTS
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MULTI-CHIP INTEGRATED CIRCUIT
-
Publication number 20110215465
-
Publication date Sep 8, 2011
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Xilinx, Inc.
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Arifur Rahman
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H01 - BASIC ELECTRIC ELEMENTS