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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/08137the bodies being arranged next to each other

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and methods of manufacturing a semiconductor...
- Patent number 12,087,717
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,923,302
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding structure, stack structure, and method of forming die b...
- Patent number 11,658,152
- Issue date May 23, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,410,929
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,211,339
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing a semiconductor...
- Patent number 11,081,457
- Issue date Aug 3, 2021
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, electronic component and method of manufactur...
- Patent number 11,069,639
- Issue date Jul 20, 2021
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,861,842
- Issue date Dec 8, 2020
- STMicroelectronics S.r.l.
- Alberto Pagani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming multi-die package structures including redistrib...
- Patent number 10,804,242
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical chip interposer and method of making a chip assembly conta...
- Patent number 10,700,028
- Issue date Jun 30, 2020
- SanDisk Technologies LLC
- Akio Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,510,681
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,453,833
- Issue date Oct 22, 2019
- STMicroelectonics S.R.L.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Fan-out wafer level packaging structure
- Patent number 10,418,299
- Issue date Sep 17, 2019
- Advanced Semiconductor Engineering, Inc.
- Chung-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,319,708
- Issue date Jun 11, 2019
- STMicroelectronics S.r.l.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,043,761
- Issue date Aug 7, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 9,881,911
- Issue date Jan 30, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming multi-die package structures including redistrib...
- Patent number 9,768,145
- Issue date Sep 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level packaging structure
- Patent number 9,711,426
- Issue date Jul 18, 2017
- Advanced Semiconductor Engineering, Inc.
- Chung-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing a semiconductor d...
- Patent number 9,613,930
- Issue date Apr 4, 2017
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 9,570,410
- Issue date Feb 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level packaging structure
- Patent number 9,484,307
- Issue date Nov 1, 2016
- Advanced Semiconductor Engineering, Inc.
- Chung-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die edge side connection
- Patent number 9,209,143
- Issue date Dec 8, 2015
- Intel IP Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing Method of Semiconductive Element and Ink Jet Head Sub...
- Patent number 7,591,071
- Issue date Sep 22, 2009
- Canon Kabushiki Kaisha
- Satoshi Ibe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240387377
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240258228
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Juneyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS
- Publication number 20240250067
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240203835
- Publication date Jun 20, 2024
- Rohm Co., Ltd.
- Masatsugu YUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING PACKAGE STRUCTURE
- Publication number 20240194573
- Publication date Jun 13, 2024
- LITE-ON SINGAPORE PTE. LTD.
- You-Fa WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING
- Publication number 20240128150
- Publication date Apr 18, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTRA-BONDING SEMICONDUCTOR INTEGRATED CIRCUIT CHIPS
- Publication number 20240113076
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Frank Robert Libsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240105619
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240057353
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, METHOD FOR MANUFACTURING SEMICONDUCTOR STR...
- Publication number 20240055399
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kaimin LV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH COMPUTE BRICKS HAVING VERTICALLY STACKED...
- Publication number 20240006375
- Publication date Jan 4, 2024
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH IN...
- Publication number 20230420411
- Publication date Dec 28, 2023
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLA...
- Publication number 20230420410
- Publication date Dec 28, 2023
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING STRUCTURE, STACK STRUCTURE, AND METHOD OF FORMING DIE B...
- Publication number 20230145518
- Publication date May 11, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20220336356
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING A SEMICONDUCTOR...
- Publication number 20210335739
- Publication date Oct 28, 2021
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Package Structures Including Redistribution Layers
- Publication number 20210028147
- Publication date Jan 28, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING MULTIPLE CHIPS USING AN INTERCONNECT DEVICE
- Publication number 20200402913
- Publication date Dec 24, 2020
- Invensas Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200111753
- Publication date Apr 9, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUEI-TANG WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module, Electronic Component and Method of Manufactur...
- Publication number 20190267343
- Publication date Aug 29, 2019
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL CHIP INTERPOSER AND METHOD OF MAKING A CHIP ASSEMBLY CONTA...
- Publication number 20190252361
- Publication date Aug 15, 2019
- SanDisk Technologies LLC
- Akio NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20190244948
- Publication date Aug 8, 2019
- STMicroelectronics S.r.l
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180350752
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUEI-TANG WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180130784
- Publication date May 10, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180102353
- Publication date Apr 12, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Multi-Die Package Structures Including Redistrib...
- Publication number 20180005984
- Publication date Jan 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170110412
- Publication date Apr 20, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUEI-TANG WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structures and Methods of Making the Same
- Publication number 20170062383
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chung Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Connector Pad Structures, Interconnect Structure...
- Publication number 20170033065
- Publication date Feb 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D FANOUT STACKING
- Publication number 20170025380
- Publication date Jan 26, 2017
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS

the bodies being arranged next to each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and methods of manufacturing a semiconductor...

Semiconductor device and method of manufacture

Die bonding structure, stack structure, and method of forming die b...

Semiconductor device and method of manufacture

Semiconductor device

Semiconductor package and methods of manufacturing a semiconductor...

Semiconductor module, electronic component and method of manufactur...

Electronic system having increased coupling by using horizontal and...

Methods of forming multi-die package structures including redistrib...

Vertical chip interposer and method of making a chip assembly conta...

Semiconductor device

Electronic system having increased coupling by using horizontal and...

Fan-out wafer level packaging structure

Electronic system having increased coupling by using horizontal and...

Semiconductor device and manufacturing method thereof

Electronic system having increased coupling by using horizontal and...

Methods of forming multi-die package structures including redistrib...

Fan-out wafer level packaging structure

Semiconductor device and method for manufacturing a semiconductor d...

Methods of forming connector pad structures, interconnect structure...

Fan-out wafer level packaging structure

Die edge side connection

Manufacturing Method of Semiconductive Element and Ink Jet Head Sub...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

INTEGRATED CIRCUIT DEVICE

MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS

SEMICONDUCTOR DEVICE

CAPACITIVE COUPLING PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING

INTRA-BONDING SEMICONDUCTOR INTEGRATED CIRCUIT CHIPS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR STRUCTURE, METHOD FOR MANUFACTURING SEMICONDUCTOR STR...

PACKAGE ARCHITECTURE WITH COMPUTE BRICKS HAVING VERTICALLY STACKED...

PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH IN...

PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLA...

DIE BONDING STRUCTURE, STACK STRUCTURE, AND METHOD OF FORMING DIE B...

Semiconductor Device and Method of Manufacture

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING A SEMICONDUCTOR...

Multi-Die Package Structures Including Redistribution Layers

CONNECTING MULTIPLE CHIPS USING AN INTERCONNECT DEVICE

SEMICONDUCTOR DEVICE

Semiconductor Module, Electronic Component and Method of Manufactur...

VERTICAL CHIP INTERPOSER AND METHOD OF MAKING A CHIP ASSEMBLY CONTA...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

SEMICONDUCTOR DEVICE

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

Methods of Forming Multi-Die Package Structures Including Redistrib...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Package Structures and Methods of Making the Same

Methods of Forming Connector Pad Structures, Interconnect Structure...

3D FANOUT STACKING