the bodies being arranged on opposite sides of a substrate

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H01L2224/32141

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/32141the bodies being arranged on opposite sides of a substrate

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Patents Grantslast 30 patents

Information Patent Grant
Multi-die integrated circuit packages and methods of manufacturing...
- Patent number 11,328,984
- Issue date May 10, 2022
- Texas Instruments Incorporated
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,840,212
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,483,230
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low thermal resistance hanging die package
- Patent number 10,347,558
- Issue date Jul 9, 2019
- Intel IP Corporation
- Christian Geissler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic power device with vertical 3D switching cell
- Patent number 10,083,942
- Issue date Sep 25, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Bastien Letowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate with buried substrate having linear conductors
- Patent number 9,960,120
- Issue date May 1, 2018
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,704,828
- Issue date Jul 11, 2017
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 9,691,738
- Issue date Jun 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3-D STACKING SEMICONDUCTOR ASSEMBLY HAVING HEAT DISSIPATION CHARACT...
- Publication number 20200091116
- Publication date Mar 19, 2020
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Package Components Through Plating
- Publication number 20200020662
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING...
- Publication number 20190206772
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW THERMAL RESISTANCE HANGING DIE PACKAGE
- Publication number 20180218962
- Publication date Aug 2, 2018
- Intel IP Corporation
- Christian GEISSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC POWER DEVICE WITH VERTICAL 3D SWITCHING CELL
- Publication number 20170338208
- Publication date Nov 23, 2017
- CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
- Bastien LETOWSKI
- H01 - BASIC ELECTRIC ELEMENTS

the bodies being arranged on opposite sides of a substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-die integrated circuit packages and methods of manufacturing...

Bonding package components through plating

Bonding package components through plating

Low thermal resistance hanging die package

Electronic power device with vertical 3D switching cell

Wiring substrate with buried substrate having linear conductors

Semiconductor module

Bonding package components through plating

Patents Applicationslast 30 patents

3-D STACKING SEMICONDUCTOR ASSEMBLY HAVING HEAT DISSIPATION CHARACT...

Bonding Package Components Through Plating

MULTI-DIE INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING...

LOW THERMAL RESISTANCE HANGING DIE PACKAGE

ELECTRONIC POWER DEVICE WITH VERTICAL 3D SWITCHING CELL