the bodies being arranged on opposite sides of a substrate

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CPC
H01L2224/48141

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48141the bodies being arranged on opposite sides of a substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Light-emitting substrate, method of manufacturing light-emitting su...
- Patent number 12,046,591
- Issue date Jul 23, 2024
- BOE Technology Group Co., Ltd.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, semiconductor package structure, and method for...
- Patent number 11,961,831
- Issue date Apr 16, 2024
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and electric power steering apparatus us...
- Patent number 10,096,572
- Issue date Oct 9, 2018
- NSK Ltd.
- Shigeru Shimakawa
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Package leadframe for dual side assembly
- Patent number 8,951,847
- Issue date Feb 10, 2015
- Intersil Americas LLC
- Nikhil Vishwanath Kelkar
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240347466
- Publication date Oct 17, 2024
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...
- Publication number 20240339444
- Publication date Oct 10, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED MODULE PACKAGE WITH AN EMI SHIELDING BARRIER
- Publication number 20240258245
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- KWANG-SOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230230904
- Publication date Jul 20, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Akihiro SHINSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, SEMICONDUCTOR PACKAGE STRUCTURE, AND METHOD FOR...
- Publication number 20230058358
- Publication date Feb 23, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...
- Publication number 20220320056
- Publication date Oct 6, 2022
- BOE TECHNOLOGY GROUP CO., LTD.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND ELECTRIC POWER STEERING APPARATUS US...
- Publication number 20170338201
- Publication date Nov 23, 2017
- NSK Ltd.
- Shigeru SHIMAKAWA
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Application
PACKAGE LEADFRAME FOR DUAL SIDE ASSEMBLY
- Publication number 20130181332
- Publication date Jul 18, 2013
- INTERSIL AMERICAS LLC
- Nikhil Vishwanath Kelkar
- H01 - BASIC ELECTRIC ELEMENTS

the bodies being arranged on opposite sides of a substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light-emitting substrate, method of manufacturing light-emitting su...

Electronic package, semiconductor package structure, and method for...

Power semiconductor module and electric power steering apparatus us...

Package leadframe for dual side assembly

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE

LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...

MOLDED MODULE PACKAGE WITH AN EMI SHIELDING BARRIER

SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE, SEMICONDUCTOR PACKAGE STRUCTURE, AND METHOD FOR...

LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...

POWER SEMICONDUCTOR MODULE AND ELECTRIC POWER STEERING APPARATUS US...

PACKAGE LEADFRAME FOR DUAL SIDE ASSEMBLY