the bodies being arranged on opposite sides of a substrate

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H01L2224/40141

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/40141the bodies being arranged on opposite sides of a substrate

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit connection arrangement for minimizing crosstalk
- Patent number 10,446,687
- Issue date Oct 15, 2019
- Silanna Asia Pte Ltd
- Shanghui Larry Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe and integrated circuit connection arrangement
- Patent number 10,424,666
- Issue date Sep 24, 2019
- Silanna Asia Pte Ltd
- Shanghui Larry Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection arrangements for integrated lateral diffusion field effe...
- Patent number 10,249,759
- Issue date Apr 2, 2019
- Silanna Asia Pte Ltd
- Shanghui Larry Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit connection arrangement for minimizing crosstalk
- Patent number 10,192,989
- Issue date Jan 29, 2019
- Silanna Asia Pte Ltd
- Shanghui Larry Tu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT CONNECTION ARRANGEMENT FOR MINIMIZING CROSSTALK
- Publication number 20190157446
- Publication date May 23, 2019
- Silanna Asia Pte Ltd
- Shanghui Larry Tu
- H01 - BASIC ELECTRIC ELEMENTS