the body and the item being arranged next to each other

Industry

CPC
H01L2224/48153

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48153the body and the item being arranged next to each other

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with branch electrode terminal and method of m...
- Patent number 11,901,326
- Issue date Feb 13, 2024
- Mitsubishi Electric Corporation
- Shinsuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency package
- Patent number 11,831,282
- Issue date Nov 28, 2023
- Sumitomo Electric Device Innovations, Inc.
- Tadashi Minami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bond solution for reducing thermal stress on an intermittent...
- Patent number 11,706,852
- Issue date Jul 18, 2023
- Illinois Tool Works Inc.
- Marco Carcano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency amplifier
- Patent number 11,398,800
- Issue date Jul 26, 2022
- Sumitomo Electric Device Innovations, Inc.
- Tadashi Minami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,398,448
- Issue date Jul 26, 2022
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
X-ray system, semiconductor package, and tray having X-ray absorpti...
- Patent number 11,217,495
- Issue date Jan 4, 2022
- Samsung Electronics Co., Ltd.
- Sang-Young Kim
- G01 - MEASURING TESTING
Information Patent Grant
Amplifier
- Patent number 11,164,828
- Issue date Nov 2, 2021
- Mitsubishi Electric Corporation
- Kei Fukunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multiple-path power amplifier
- Patent number 11,018,629
- Issue date May 25, 2021
- NXP USA, INC.
- Seungkee Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a conductor plate and semiconductor ele...
- Patent number 10,964,630
- Issue date Mar 30, 2021
- Denso Corporation
- Takanori Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measuring device
- Patent number 10,490,518
- Issue date Nov 26, 2019
- AZBIL CORPORATION
- Shinichi Ike
- G01 - MEASURING TESTING
Information Patent Grant
Segmented bond pads and methods of fabrication thereof
- Patent number 9,543,260
- Issue date Jan 10, 2017
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cascode transistor device and manufacturing method thereof
- Patent number 9,425,176
- Issue date Aug 23, 2016
- NATIONAL TAIWAN UNIVERSITY
- Jian-Jang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat management in electronics packaging
- Patent number 9,331,000
- Issue date May 3, 2016
- Kyocera America, Inc.
- Mark Eblen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OUTPUT MATCHING NETWORK TO REDUCE SELF AND MUTUAL INDUCTANCES OF OU...
- Publication number 20250006688
- Publication date Jan 2, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Seiya TAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS
- Publication number 20240355724
- Publication date Oct 24, 2024
- Mitsubishi Electric Corporation
- Tatsuya KAWASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND TEST SOCKET FOR US...
- Publication number 20240201223
- Publication date Jun 20, 2024
- RENESAS ELECTRONICS CORPORATION
- Toshitsugu ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR RADIO FREQUENCY OPTIMIZED INTERCONNECTS FOR A QUAN...
- Publication number 20230210023
- Publication date Jun 29, 2023
- Intel Corporation
- Hubert C. George
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH FREQUENCY PACKAGE
- Publication number 20220329213
- Publication date Oct 13, 2022
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Tadashi MINAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220254749
- Publication date Aug 11, 2022
- Mitsubishi Electric Corporation
- Shinsuke ASADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20220189930
- Publication date Jun 16, 2022
- Fuji Electric Co., Ltd.
- Hideo AMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20210280550
- Publication date Sep 9, 2021
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
X-RAY SYSTEM, SEMICONDUCTOR PACKAGE, AND TRAY HAVING X-RAY ABSORPTI...
- Publication number 20200402864
- Publication date Dec 24, 2020
- Samsung Electronics Co., Ltd.
- SANG-YOUNG KIM
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED MULTIPLE-PATH POWER AMPLIFIER
- Publication number 20200403576
- Publication date Dec 24, 2020
- NXP USA, Inc.
- Seungkee Min
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Ribbon Bond Solution for Reducing Thermal Stress on an Intermittent...
- Publication number 20200163174
- Publication date May 21, 2020
- lIlinois Tool Works Inc.
- Marco Carcano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER
- Publication number 20200118950
- Publication date Apr 16, 2020
- Mitsubishi Electric Corporation
- Kei FUKUNAGA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200098673
- Publication date Mar 26, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takanori KAWASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEASURING DEVICE
- Publication number 20190035751
- Publication date Jan 31, 2019
- AZBIL CORPORATION
- Shinichi Ike
- G01 - MEASURING TESTING
Information Patent Application
X-RAY SYSTEM, SEMICONDUCTOR PACKAGE, AND TRAY HAVING X-RAY ABSORPTI...
- Publication number 20170301591
- Publication date Oct 19, 2017
- Samsung Electronics Co., Ltd.
- SANG-YOUNG KIM
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20160190114
- Publication date Jun 30, 2016
- National Taiwan University
- Jian-Jang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT MANAGEMENT IN ELECTRONICS PACKAGING
- Publication number 20150287661
- Publication date Oct 8, 2015
- Kyocera America Inc
- Mark EBLEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Segmented Bond Pads and Methods of Fabrication Thereof
- Publication number 20150035171
- Publication date Feb 5, 2015
- INFINEON TECHNOLOGIES AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS

the body and the item being arranged next to each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with branch electrode terminal and method of m...

High frequency package

Ribbon bond solution for reducing thermal stress on an intermittent...

High frequency amplifier

Semiconductor module

X-ray system, semiconductor package, and tray having X-ray absorpti...

Amplifier

Integrated multiple-path power amplifier

Semiconductor device having a conductor plate and semiconductor ele...

Measuring device

Segmented bond pads and methods of fabrication thereof

Cascode transistor device and manufacturing method thereof

Heat management in electronics packaging

Patents Applicationslast 30 patents

OUTPUT MATCHING NETWORK TO REDUCE SELF AND MUTUAL INDUCTANCES OF OU...

SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND TEST SOCKET FOR US...

TECHNOLOGIES FOR RADIO FREQUENCY OPTIMIZED INTERCONNECTS FOR A QUAN...

HIGH FREQUENCY PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MODULE

SEMICONDUCTOR MODULE

X-RAY SYSTEM, SEMICONDUCTOR PACKAGE, AND TRAY HAVING X-RAY ABSORPTI...

INTEGRATED MULTIPLE-PATH POWER AMPLIFIER

Ribbon Bond Solution for Reducing Thermal Stress on an Intermittent...

AMPLIFIER

SEMICONDUCTOR DEVICE

MEASURING DEVICE

X-RAY SYSTEM, SEMICONDUCTOR PACKAGE, AND TRAY HAVING X-RAY ABSORPTI...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

HEAT MANAGEMENT IN ELECTRONICS PACKAGING

Segmented Bond Pads and Methods of Fabrication Thereof