the body and the item being arranged next to each other

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H01L2224/16153

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/16153the body and the item being arranged next to each other

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Patents Grantslast 30 patents

Information Patent Grant
System-in-package chip of printer driver system
- Patent number 12,107,071
- Issue date Oct 1, 2024
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded multi-die interconnect bridge
- Patent number 10,381,310
- Issue date Aug 13, 2019
- Intel Corporation
- Arvind Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with electrodes on side surface
- Patent number 5,606,198
- Issue date Feb 25, 1997
- Yamaha Corporation
- Yukichi Ono
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM-IN-PACKAGE CHIP OF PRINTER DRIVER SYSTEM
- Publication number 20220216181
- Publication date Jul 7, 2022
- MICROJET TECHNOLOGY CO., LTD.
- Hao-Jan Mou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MULTI-DIE INTERCONNECT BRIDGE
- Publication number 20180261545
- Publication date Sep 13, 2018
- Intel Corporation
- Arvind Sundaram
- H01 - BASIC ELECTRIC ELEMENTS