the body and the item being arranged next to each other

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CPC
H01L2224/32153

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/32153the body and the item being arranged next to each other

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic packages having mold-embedded traces and methods fo...
- Patent number 9,331,029
- Issue date May 3, 2016
- Freescale Semiconductor Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER
- Publication number 20240282658
- Publication date Aug 22, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS