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CPC
H01L2224/40221
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/40221
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor module
Patent number
11,410,911
Issue date
Aug 9, 2022
Mitsubishi Electric Corporation
Kensuke Takeuchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die-packaging component with retaining structure for package body t...
Patent number
10,037,964
Issue date
Jul 31, 2018
Taiwan Semiconductor Co., Ltd.
Reyn Qin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductor strip with contact areas having cutouts
Patent number
9,406,592
Issue date
Aug 2, 2016
Continental Automotive GmbH
Nico Kohl
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD...
Publication number
20240312968
Publication date
Sep 19, 2024
RENESAS ELECTRONICS CORPORATION
Toshiyuki HATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240105665
Publication date
Mar 28, 2024
Kabushiki Kaisha Toshiba
Katsuyuki IMAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CLIP STRUCTURE FOR A PACKAGED SEMICONDUCTOR DEVICE
Publication number
20240038637
Publication date
Feb 1, 2024
NEXPERIA B.V.
Jia Yunn Ting
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE
Publication number
20210151362
Publication date
May 20, 2021
Mitsubishi Electric Corporation
Kensuke TAKEUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CIRCUIT AND METHOD FOR PRODUCING THE SEMICONDUCTOR CI...
Publication number
20150357303
Publication date
Dec 10, 2015
CONTINENTAL AUTOMOTIVE GMBH
Nico Kohl
H01 - BASIC ELECTRIC ELEMENTS