the body and the item being stacked

Industry

CPC
H01L2224/16221

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16221the body and the item being stacked

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Signal routing between memory die and logic die
- Patent number 12,165,696
- Issue date Dec 10, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package structure with bump
- Patent number 12,119,320
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device for wafer-on-wafer formed memory and logic
- Patent number 12,112,792
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal routing between memory die and logic die for mode based oper...
- Patent number 12,112,793
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing a structure
- Patent number 12,107,069
- Issue date Oct 1, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Nohora-Lizeth Caicedo Panqueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method, semiconductor assembly and electron...
- Patent number 12,046,525
- Issue date Jul 23, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,002,735
- Issue date Jun 4, 2024
- Tien-Chien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferrite electro-magnetic interference (EMI) shield between an integ...
- Patent number 11,990,422
- Issue date May 21, 2024
- High Tech Technology Limited
- Chik Wai (David) Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates with heat transfer structures for bonding a stack of mic...
- Patent number 11,961,818
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,955,453
- Issue date Apr 9, 2024
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method, semiconductor assembly and electron...
- Patent number 11,955,396
- Issue date Apr 9, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-on-wafer formed memory and logic for genomic annotations
- Patent number 11,915,742
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for packaging semiconductor, semiconductor package structure...
- Patent number 11,854,941
- Issue date Dec 26, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jie Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink cutout and insulating through silicon vias to cut thermal...
- Patent number 11,837,519
- Issue date Dec 5, 2023
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill for chip packaging and chip packaging structure
- Patent number 11,804,463
- Issue date Oct 31, 2023
- Wuhan Choice Technology Co, Ltd
- De Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,735,561
- Issue date Aug 22, 2023
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch on interposer package with wireless communication interface
- Patent number 11,737,154
- Issue date Aug 22, 2023
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and head mounted device
- Patent number 11,532,603
- Issue date Dec 20, 2022
- PlayNitride Display Co., Ltd.
- Yi-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with bump
- Patent number 11,410,956
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for temperature modification in bonding stack...
- Patent number 11,410,961
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,367,704
- Issue date Jun 21, 2022
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with patterned underbump metallization and polym...
- Patent number 11,335,659
- Issue date May 17, 2022
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,309,296
- Issue date Apr 19, 2022
- Powertech Technology Inc.
- Nan-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch on interposer package with wireless communication interface
- Patent number 11,140,723
- Issue date Oct 5, 2021
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Blade computing system with wireless communication between blades w...
- Patent number 11,109,428
- Issue date Aug 31, 2021
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for a package substrate
- Patent number 10,903,127
- Issue date Jan 26, 2021
- Samsung Electronics Co., Ltd.
- So Young Lim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Assembly of semiconductor devices using multiple LED placement cycles
- Patent number 10,878,733
- Issue date Dec 29, 2020
- Facebook Technologies, LLC
- Padraig Hughes
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Chip package structure with bump
- Patent number 10,854,565
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
X-ray detector comprising a converter element with rewiring unit
- Patent number 10,761,221
- Issue date Sep 1, 2020
- Siemens Healthcare GmbH
- Thorsten Ergler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip wire bondless power device
- Patent number 10,720,380
- Issue date Jul 21, 2020
- Sayan Seal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC
- Publication number 20240420757
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Chip Package Structure with Bump
- Publication number 20240387431
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS SUBSTRATES AND MANUFACUTRING METHODS THEREOF
- Publication number 20240379514
- Publication date Nov 14, 2024
- Avago Technologies International Sales Pte. Limited
- Kwok Cheung Tsang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING PASSIVE COMPONENT AND METHOD OF MANU...
- Publication number 20240371797
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-TAI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE WARPAGE CONTROL SPACERS
- Publication number 20240347432
- Publication date Oct 17, 2024
- Nokia Solutions and Networks Oy
- Alex Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240312940
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wei TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU
- Publication number 20240243091
- Publication date Jul 18, 2024
- The Indium Corporation of America
- Richard McDonough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE
- Publication number 20240203825
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Seogwoo HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE WITH SECURITY DIE
- Publication number 20240186269
- Publication date Jun 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT
- Publication number 20240162192
- Publication date May 16, 2024
- International Business Machines Corporation
- Arvind Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLED SYSTEM-ON-WAFER WITH MEANS FOR REDUCING THE EFFECTS OF ELECT...
- Publication number 20240145432
- Publication date May 2, 2024
- Tesla, Inc.
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240071950
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240072005
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Kyung Don MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS AIR VENT
- Publication number 20240063067
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND AS...
- Publication number 20240038704
- Publication date Feb 1, 2024
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240006287
- Publication date Jan 4, 2024
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230343744
- Publication date Oct 26, 2023
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKED PROCESSING SYSTEMS
- Publication number 20230326905
- Publication date Oct 12, 2023
- Alibaba Group Holding Limited
- Dimin NIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ferrite Electro-Magnetic Interference (EMI) Shield Between an Integ...
- Publication number 20230290735
- Publication date Sep 14, 2023
- High Tech Technology Limited
- Chik Wai (David) NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air-Core Transformer Package with Ferrite Electro-Magnetic Interfer...
- Publication number 20230290736
- Publication date Sep 14, 2023
- High Tech Technology Limited
- Chik Wai (David) NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE MATERIAL FOR ELECTRONIC DEVICES
- Publication number 20230268309
- Publication date Aug 24, 2023
- SUMITOMO CHEMICAL CO., LTD.
- Martin Humphries
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL FOR CHIP PACKAGING AND CHIP PACKAGING STRUCTURE
- Publication number 20230260948
- Publication date Aug 17, 2023
- Wuhan Choice Technology Co,Ltd
- De WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD
- Publication number 20230197670
- Publication date Jun 22, 2023
- SHINKAWA LTD.
- ALEXANDER Dzhangirov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Systems And Methods Using Spacer Dies
- Publication number 20230100829
- Publication date Mar 30, 2023
- Intel Corporation
- Sheue Fen Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...
- Publication number 20230090693
- Publication date Mar 23, 2023
- Fasford Technology Co., Ltd.
- Geonju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE
- Publication number 20230046050
- Publication date Feb 16, 2023
- Micron Technology, Inc.
- Sean S. Eilert
- G11 - INFORMATION STORAGE
Information Patent Application
INPUT/OUTPUT CONNECTIONS OF WAFER-ON-WAFER BONDED MEMORY AND LOGIC
- Publication number 20230048628
- Publication date Feb 16, 2023
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DIE AND LOGIC DIE WITH WAFER-ON-WAFER BOND
- Publication number 20230048103
- Publication date Feb 16, 2023
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230009495
- Publication date Jan 12, 2023
- InnoLux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR TEMPERATURE MODIFICATION IN BONDING STACK...
- Publication number 20220375893
- Publication date Nov 24, 2022
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS

the body and the item being stacked

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Signal routing between memory die and logic die

Chip package structure with bump

Memory device for wafer-on-wafer formed memory and logic

Signal routing between memory die and logic die for mode based oper...

Method for manufacturing a structure

Semiconductor packaging method, semiconductor assembly and electron...

Semiconductor package

Ferrite electro-magnetic interference (EMI) shield between an integ...

Substrates with heat transfer structures for bonding a stack of mic...

Electronic device

Semiconductor packaging method, semiconductor assembly and electron...

Wafer-on-wafer formed memory and logic for genomic annotations

Method for packaging semiconductor, semiconductor package structure...

Heatsink cutout and insulating through silicon vias to cut thermal...

Underfill for chip packaging and chip packaging structure

Semiconductor device and method for manufacturing semiconductor device

Patch on interposer package with wireless communication interface

Display panel and head mounted device

Chip package structure with bump

Methods and apparatus for temperature modification in bonding stack...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor chip with patterned underbump metallization and polym...

Semiconductor package and manufacturing method thereof

Patch on interposer package with wireless communication interface

Blade computing system with wireless communication between blades w...

Film for a package substrate

Assembly of semiconductor devices using multiple LED placement cycles

Chip package structure with bump

X-ray detector comprising a converter element with rewiring unit

Flip-chip wire bondless power device

Patents Applicationslast 30 patents

MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC

Chip Package Structure with Bump

CORELESS SUBSTRATES AND MANUFACUTRING METHODS THEREOF

SEMICONDUCTOR STRUCTURE HAVING PASSIVE COMPONENT AND METHOD OF MANU...

CONFIGURABLE WARPAGE CONTROL SPACERS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU

SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE

BONDED STRUCTURE WITH SECURITY DIE

STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT

COOLED SYSTEM-ON-WAFER WITH MEANS FOR REDUCING THE EFFECTS OF ELECT...

Integrated Circuit Packages and Methods of Forming the Same

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH A POROUS AIR VENT

HYBRID SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND AS...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

THREE-DIMENSIONAL STACKED PROCESSING SYSTEMS

Ferrite Electro-Magnetic Interference (EMI) Shield Between an Integ...

Air-Core Transformer Package with Ferrite Electro-Magnetic Interfer...

THERMALLY CONDUCTIVE MATERIAL FOR ELECTRONIC DEVICES

UNDERFILL FOR CHIP PACKAGING AND CHIP PACKAGING STRUCTURE

BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD

Circuit Systems And Methods Using Spacer Dies

DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...

SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE

INPUT/OUTPUT CONNECTIONS OF WAFER-ON-WAFER BONDED MEMORY AND LOGIC

MEMORY DIE AND LOGIC DIE WITH WAFER-ON-WAFER BOND

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

METHODS AND APPARATUS FOR TEMPERATURE MODIFICATION IN BONDING STACK...