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Industry

CPC
H01L2224/08221

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/08221the body and the item being stacked

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding structure and method thereof
- Patent number 12,015,001
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Chuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging unit having a stacked structure and electronic apparatus in...
- Patent number 11,670,625
- Issue date Jun 6, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masahiko Yukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive alignment of polymer waveguides
- Patent number 9,671,577
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Roger F. Dangel
- G02 - OPTICS
Information Patent Grant
Contact pad for semiconductor devices
- Patent number 9,589,891
- Issue date Mar 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...
- Publication number 20240387324
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20240347590
- Publication date Oct 17, 2024
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHAN...
- Publication number 20240347427
- Publication date Oct 17, 2024
- INFINEON TECHNOLOGIES AG
- Edward FÜRGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20240304580
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COOLING STRUCTURES
- Publication number 20240266255
- Publication date Aug 8, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem HABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240145366
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Dongjoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128147
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sey-Ping SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240120315
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240063159
- Publication date Feb 22, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240030083
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Yikoan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICON...
- Publication number 20230343672
- Publication date Oct 26, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICON...
- Publication number 20230343673
- Publication date Oct 26, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20230299028
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...
- Publication number 20230163094
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Euisun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING SYSTEMS, AND METHODS OF USING THE SAME
- Publication number 20230163095
- Publication date May 25, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Andreas Marte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING APPARATUS AND HYBRID BONDING METHOD USING THE SAME
- Publication number 20230087198
- Publication date Mar 23, 2023
- HANWHA PRECISION MACHINERY CO., LTD.
- Tae Woo KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING CHIPS TO A SUBSTRATE BY DIRECT BONDING
- Publication number 20230029338
- Publication date Jan 26, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank FOURNEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180012853
- Publication date Jan 11, 2018
- XINTEC INC.
- Hsi-Chien LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Contact Pad for Semiconductor Devices
- Publication number 20160079158
- Publication date Mar 17, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...
- Publication number 20140035167
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY

the body and the item being stacked

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding structure and method thereof

Imaging unit having a stacked structure and electronic apparatus in...

Passive alignment of polymer waveguides

Contact pad for semiconductor devices

Patents Applicationslast 30 patents

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...

METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES

LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHAN...

BONDING STRUCTURE AND METHOD THEREOF

ELECTRONIC DEVICE COOLING STRUCTURES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICON...

METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICON...

BONDING STRUCTURE AND METHOD THEREOF

APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...

DIE BONDING SYSTEMS, AND METHODS OF USING THE SAME

HYBRID BONDING APPARATUS AND HYBRID BONDING METHOD USING THE SAME

METHOD FOR BONDING CHIPS TO A SUBSTRATE BY DIRECT BONDING

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

Contact Pad for Semiconductor Devices

METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...