the body and the item being stacked

Industry

CPC
H01L2224/24221

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/24221the body and the item being stacked

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,682,613
- Issue date Jun 20, 2023
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, package-on-package structure and method of fabri...
- Patent number 10,867,966
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable semiconductor assembly with bump/flange heat spreader and...
- Patent number 8,952,526
- Issue date Feb 10, 2015
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making cavity substrate with built-in stiffener and cavit...
- Patent number 8,865,525
- Issue date Oct 21, 2014
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making stackable semiconductor assembly with bump/flange...
- Patent number 8,841,171
- Issue date Sep 23, 2014
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and stack package having the same
- Patent number 8,829,665
- Issue date Sep 9, 2014
- SK Hynix Inc.
- Ju Heon Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional semiconductor assembly board with bump/flange sup...
- Patent number 8,614,502
- Issue date Dec 24, 2013
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making stackable semiconductor assembly with bump/base/fl...
- Patent number 8,343,808
- Issue date Jan 1, 2013
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096179
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Wooyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES OF 3D STACKED DIE ASSEMBLIES
- Publication number 20230098957
- Publication date Mar 30, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING HYBRID WIRING BOARD WITH BUILT-IN STIFFENER AND IN...
- Publication number 20140291001
- Publication date Oct 2, 2014
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING CAVITY SUBSTRATE WITH BUILT-IN STIFFENER AND CAVIT...
- Publication number 20130032388
- Publication date Feb 7, 2013
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL SEMICONDUCTOR ASSEMBLY BOARD WITH BUMP/FLANGE SUP...
- Publication number 20130032938
- Publication date Feb 7, 2013
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FL...
- Publication number 20120129300
- Publication date May 24, 2012
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/FLANGE HEAT SPREADER AND...
- Publication number 20120126388
- Publication date May 24, 2012
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEA...
- Publication number 20120126399
- Publication date May 24, 2012
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADE...
- Publication number 20120126401
- Publication date May 24, 2012
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/FLANGE...
- Publication number 20120129298
- Publication date May 24, 2012
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND STACK PACKAGE HAVING THE SAME
- Publication number 20120007253
- Publication date Jan 12, 2012
- Hynix Semiconductor Inc.
- Ju Heon YANG
- H01 - BASIC ELECTRIC ELEMENTS

the body and the item being stacked

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package substrates with magnetic build-up layers

Package structure, package-on-package structure and method of fabri...

Stackable semiconductor assembly with bump/flange heat spreader and...

Method of making cavity substrate with built-in stiffener and cavit...

Method of making stackable semiconductor assembly with bump/flange...

Semiconductor chip and stack package having the same

Three dimensional semiconductor assembly board with bump/flange sup...

Method of making stackable semiconductor assembly with bump/base/fl...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

CONFORMAL POWER DELIVERY STRUCTURES OF 3D STACKED DIE ASSEMBLIES

METHOD OF MAKING HYBRID WIRING BOARD WITH BUILT-IN STIFFENER AND IN...

METHOD OF MAKING CAVITY SUBSTRATE WITH BUILT-IN STIFFENER AND CAVIT...

THREE DIMENSIONAL SEMICONDUCTOR ASSEMBLY BOARD WITH BUMP/FLANGE SUP...

METHOD OF MAKING STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FL...

STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/FLANGE HEAT SPREADER AND...

THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEA...

STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADE...

METHOD OF MAKING STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/FLANGE...

SEMICONDUCTOR CHIP AND STACK PACKAGE HAVING THE SAME